WO2006082960A1 - 噴流はんだ槽 - Google Patents
噴流はんだ槽 Download PDFInfo
- Publication number
- WO2006082960A1 WO2006082960A1 PCT/JP2006/301976 JP2006301976W WO2006082960A1 WO 2006082960 A1 WO2006082960 A1 WO 2006082960A1 JP 2006301976 W JP2006301976 W JP 2006301976W WO 2006082960 A1 WO2006082960 A1 WO 2006082960A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- jet
- solder
- duct
- molten solder
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Definitions
- the present invention relates to a jet solder bath for soldering a printed circuit board by jetting molten solder.
- a printed circuit board to be incorporated in a home appliance such as a television or a video is soldered by an automatic soldering apparatus.
- the automatic soldering equipment is equipped with processing equipment such as a fluxer, pre-heater, jet solder bath, and cooler.
- the printed circuit board is fed by the fluxer while being transported by the transport device, and preheater is used.
- Preheating, jet flow Solder adheres in a solder bath, cools in a cooler, and is soldered.
- All of the processing devices installed in the automatic soldering apparatus are related to the quality of soldering, but the jet solder bath has the most influence on this. That is, in the jet solder bath, poor soldering may occur depending on the jet state, and the oxides may adhere to the printed circuit board.
- the automatic soldering equipment can be used stably for a long time, but the jet solder bath has a shorter service life than other processing equipment.
- the jet solder bath is provided with a primary jet nozzle that jets molten solder in a rough state and a secondary jet nozzle that jets molten solder in a quiet state!
- Primary jet nozzle force The molten solder that spouts is rough, so it easily penetrates into places where molten solder is difficult to penetrate, such as through-holes on printed circuit boards and corners of surface-mounted components, and eliminates unsolder. is there. If the molten solder is rough while being pressed, the bridge will adhere when it touches the printed circuit board, and the solder will adhere to the tip of the lead. Will occur. Therefore, the bridge solara is corrected by bringing the printed circuit board on which these bridges are generated into contact with the quiet molten solder jetting with the secondary jet nozzle force.
- FIG. 4 is a front sectional view of a secondary jet nozzle of a conventional jet solder bath
- FIG. 5 is a cutaway perspective view of the same part
- FIG. 3 is a side sectional view of the same.
- a primary jet nozzle (not shown) and a secondary jet nozzle 21 are installed. Also, molten solder 22 is placed in the jet solder bath 20, and the molten solder is melted by an electric heater (not shown) and the molten solder is kept at a predetermined temperature.
- the secondary jet nozzle 21 includes a duct 23, an impeller pump 24, a nozzle port 25, and a current plate 26.
- the duct 23 is formed with an approximately 3Z4 arc pump chamber 27 at one end, and a jet pump 24 is installed in the pump chamber.
- Many impeller pumps are used in conventional jet nozzles! As shown in Figs. 4 and 5, a large number of blades 28 are attached radially.
- a shaft 29 is fixed at the center of the upper portion of the impeller pump 24, and the upper end of the shaft is interlocked with a V and a motor (not shown).
- an inlet 30 opens!
- the other end of the duct 23 is an engaging portion 31 that rises upward.
- the duct of the secondary jet nozzle in the conventional jet tank has a narrow outlet at the pump chamber 27 as shown in FIG. 5 and is wide for a while until reaching the engaging portion 31. In this way, the width of the duct between the pump chamber and the engaging portion has been wide for a while.
- the impeller pump uses the lower part of the pump chamber to blow the molten solder that has flowed in with a large number of blades, and blows it away.
- the outlet of the pump chamber is narrowed to increase the pressure inside the chamber and let it flow into the duct. However, if the duct width remains narrow, the amount of molten solder that reaches the nozzle port is reduced.
- the duct between the pump chamber and the engaging part is widened for a while.
- the secondary jet nozzle of the conventional jet solder bath has the same width (W) at the nozzle opening and width (W) at the duct.
- a nozzle port 25 is engaged with the engaging portion 31 in a sealed state, and a rectifying plate 26 having a large number of holes 32 is stretched over the engaging portion.
- the molten solder flowing into the duct with a strong pump chamber force is turbulent, and if it is directly jetted from the nozzle port of the secondary jet nozzle, a quiet jet state cannot be obtained. Rectify turbulence .
- the turbulent flow is rectified as it passes through many holes in the rectifying plate, and is jetted in a quiet state from the nozzle port.
- the rectifying plate also has the function of removing the oxides mixed in the molten solder that uses a force to rectify the turbulent flow.
- the oxide In the jet solder bath, the oxide is floating on the surface of the molten solder near the nozzle mouth.
- the acid The iron oxide is sunk under the molten solder.
- the acid oxide that sinks downward is sucked into the impeller pump that sucks in the molten solder vigorously and enters the duct, which is jetted together with the nozzle-loca molten solder and adheres to the printed circuit board. Therefore, a rectifying plate is installed at the top of the duct so that the acid is attached to the rectifying plate, and the acid is prevented from coming up from the rectifying plate.
- a front former 33 is installed on the entrance side of the printed circuit board, and a rear former 34 is installed on the exit side of the printed circuit board.
- the molten solder jetted from the nozzle port is caused to flow toward the entry side, thereby remelting the bridge slurry generated by the primary jet nozzle.
- the amount of solder attached to the soldering portion will be reduced, and an appropriate amount of solder will be deposited by the reformer.
- the molten solder flows in the same direction as the printed circuit board in the direction of the printed circuit board, and almost the same speed as that of the printed circuit board.
- the secondary jet nozzle in the conventional jet solder bath has the same horizontal width of the duct and the horizontal width of the nozzle port, and the molten solder force that has flowed into the duct is jetted upward and quietly It forms a simple jet state.
- the molten solder is turbulent because the flow velocity is fast and the flow direction changes when the force hits the end of the duct.
- This turbulent flow is rectified by a large number of holes 32 ⁇ of the rectifying plate 26 stretched on the engaging portion 31 and jetted upward from the nozzle port 25.
- the printed circuit board (not shown) is soldered by the primary jet nozzle, then jets from the secondary jet nozzle, contacts the molten solder, and corrects the bridging slurry generated by the primary jet nozzle, as well as an appropriate amount.
- the secondary jet nozzle force retreats with the solder.
- Patent Documents 1 to 5 Japanese Utility Model Publication No. 48-19425
- Patent Document 2 Japanese Utility Model Publication No. 48-98520
- Patent Document 3 Japanese Utility Model Publication No. 50-148327
- Patent Document 4 Japanese Utility Model Publication No. 51-3632
- Patent Document 5 Japanese Patent Laid-Open No. 62-259665
- the inventors of the present invention diligently studied about problems in the conventional jet solder bath. As a result, the reason why the solder does not uniformly adhere to the entire printed circuit board over the secondary jet nozzle of the conventional jet solder bath is that the jet height is uneven as shown in Fig. 4, that is, above the top of the duct. Since the height (H) near the pump chamber is high, the height (H) is low.
- this is a secondary jet nozzle with a high flow velocity coming out of the pump chamber at the end of the duct, and the molten solder hits the tip of the duct. It is considered to be high because it flows, and near the pump chamber, most of the melt with high flow velocity flows toward the tip of the duct and hardly flows upward near the pump chamber.
- the reason why the oxides adhere to the printed circuit board in the conventional jet solder bath is that the impeller pump rotates at high speed and sucks the molten solder under the pump vigorously. The oxide that has been caught in the solder and sinks downward is sucked into the pump chamber together with the molten solder. The oxide entering the pump chamber reaches the nozzle opening from the duct and adheres to the printed circuit board.
- the secondary jet nozzle of the conventional jet solder bath has a rectifying plate, and the rectifying plate only attaches to the rectifying plate and removes the oxidizer that arrives in the vicinity of the hole.
- the effect of removing the oxide is not good, but the oxide is deposited around the hole and grows larger. When the large oxide is released from the rectifying plate force, it adheres to the printed circuit board in a large state. Therefore, it has been desired that the jet solder bath should not use a current plate as much as possible.
- the reason why the component members are eroded in the conventional jet solder bath is that the molten solder flowing in the duct also flows quickly.
- the components of the jet solder bath are made of stainless steel that is hard to adhere to solder. Since the stainless steel is covered with a strong acid such as Ni or Cr on the surface, the oxide becomes a NOR and does not adhere the molten solder.
- the reason why stainless steel is eroded by molten solder is that when the oxides disappear and a clean metal surface appears, the stainless steel Fe and Ni alloy with Sn in the molten solder. When the stainless steel component is alloyed with Sn, the melting point of the alloy decreases, and the alloy melts into the molten solder.
- the present inventors have earnestly researched to eliminate the nonuniformity of the jet height generated in the conventional jet solder bath, the adhesion of oxide to the printed circuit board, the erosion of the components of the jet solder bath, and the like.
- the present invention has been completed by paying attention to the fact that it is sufficient to eliminate the rapid flow of molten solder flowing in the duct.
- the one end force of the duct is also applied to the molten solder in the duct rather than flowing the molten solder quickly, and the pressure is propagated to the molten solder in the duct, and the other end of the duct is caused by the pressure of the propagation.
- Nozzle mouth force Molten solder should be jetted.
- the present invention relates to a jet solder bath in which a primary jet nozzle that jets molten solder in a rough state and a secondary jet nozzle that jets molten solder quietly are installed.
- a cylinder with an opening at the top and bottom of the duct is formed at the bottom of one end of the duct, and a spiral pump is installed in the cylinder.
- This is a jet solder bath characterized in that a nozzle opening narrower than the horizontal width of the duct is installed at the upper end of the other end.
- the spiral pump installed at one end of the duct does not force the molten solder in the duct to flow well. Even if it flows, the flow rate is very slow. Therefore, in the jet soldering bath of the present invention, the pressure at one end of the duct is directly propagated to the nozzle port installed at the other end of the duct, and the same pressure is applied to the entire nozzle port, so that there is no difference in height from the nozzle port. Solder is jetted and the molten solder contacts the printed circuit board evenly, causing no surface covering or unsoldering. [0021] Further, the jet solder tank of the present invention is adapted to propagate the pressure of the molten solder to the spiral pump force jet nozzle, and does not strongly rub against or strongly hit the components that have been eroded conventionally. No erosion occurs.
- the inlet to the cylinder faces downward, and the suction force and the suction of the molten solder into the cylinder are gentle, so that the oxide is not drawn at all. Therefore, there is no adhesion of oxides to the printed circuit board.
- the flow straightening plate inherently weakens the vigorous flow to make a uniform jet, and the flow straightening plate also has the role of blocking the passage of the acid oxide.
- the flow of molten solder in the duct is slow and does not become turbulent, so there is no need to install a rectifying plate because there is no mixing of oxides by force if there is no need to rectify.
- the rectifying plate is not used as much as possible because it deposits oxides or erodes the molten solder and changes the components of the solder. In the present invention, however, the rectifying plate is not used as much as possible. It is not necessary at all.
- the spiral pump used in the jet solder bath of the present invention is capable of applying pressure to the molten solder that does not cause a rapid flow in suction and discharge like a conventional impeller pump. .
- the spiral pump can apply pressure to the molten solder by sequentially sending out molten solder with spiral blades. Since the spiral pump used in the conventional jet solder bath has a single blade, the amount of molten solder to be sent out is small, and the pulsating flow, that is, the molten solder is Sometimes it moved down. When the number of blades of the spiral pump is set to plural, preferably four, the amount to be sent out can be increased, and a smooth flow is formed to eliminate the pulsating flow.
- the spiral pump is installed in a cylinder having an opening at the top and bottom, and the molten solder is sucked from below and pressure is applied upward, so that the molten solder does not flow quickly.
- the spiral pump since the spiral pump is sucked from the bottom, it floats above the molten solder and does not suck or suck in the acid.
- the lateral width W1 of the nozzle opening is narrower than the lateral width W2 of the duct.
- the width of the jet nozzle is made narrower than the width of the duct. Therefore, when the pressure of the large volume of molten solder in the duct propagates to the small volume of molten solder in the nozzle, a large amount of molten solder flows into the nozzle due to the Noscal principle. A high jet will be obtained.
- FIG. 1 is a partially broken perspective view of a secondary jet nozzle installed in the jet solder bath of the present invention
- FIG. 2 is a front sectional view thereof
- FIG. 3 is a sectional side view thereof.
- a primary jet nozzle (not shown) and a secondary jet nozzle 2 are installed.
- Molten solder 3 is placed in the jet solder bath, and an electric heater (not shown) melts the solder and keeps the molten solder at a predetermined temperature.
- the secondary jet nozzle 2 is composed of a duct 4, a cylinder 5, a spiral pump 6, and a nozzle port 7.
- a box-like duct 4 is installed in the jet solder bath 1.
- a semi-cylindrical pressure chamber 8 is formed at one end of the duct 4.
- a cylinder 5 having an opening at the top and bottom is installed at the bottom of the pressure chamber 8.
- the opening of the cylinder 5 has an inlet 9 at the bottom and a pressure inlet 10 at the top.
- the height of cylinder 5 is lower than that of pressure chamber 8, and the lower part of cylinder 5 is placed at the same level as the bottom of duct 2, so there is sufficient space between the top of cylinder 5 and the ceiling of pressure chamber 8. I love you.
- a spiral pump 6 is installed in the cylinder 5.
- the spiral pump 6 is provided with four spiral blades 11.
- a shaft 12 is fixed at the upper center of the spiral pump 6, and the shaft projects through the ceiling of the pressure chamber 8 to the liquid surface of the molten solder 3 placed in the jet solder tank 1.
- the upper end of shaft 12 is linked to a motor (not shown).
- the other end of the duct 4 is elongated and has a rectangular engaging portion 13.
- a nozzle port 7 is engaged with the engaging portion in a sealed state.
- the width W of nozzle 7 is smaller than the width W of duct 4 as shown in FIG.
- Nozzle port 7 has a print
- a front former 14 force is installed at the board entry side, and a rear former 15 is installed at the printed board exit side. Since the operation of the front former and rear former is the same as described above, the explanation is omitted. [0030] Next, the jet state in the jet solder bath of the present invention having the above structure will be described.
- the shaft 12 is rotated by first driving a motor (not shown)
- the spiral pump 6 in the cylinder 5 rotates.
- molten solder flows in from the inlet 9, and the molten solder in the cylinder is pushed out by the pressure port 10 to apply pressure to the molten solder 2 in the pressure chamber 8.
- the pressure is propagated to the molten solder in the duct 4 and further to the molten solder in the nozzle port 7. Therefore, the molten solder in the nozzle port 7 is jetted upward.
- the molten solder jetted upward is in a quiet jet state and flows along the front former 14 and the rear former 15.
- the molten solder in the duct is in a state of propagating pressure, that is, even if the molten solder moves, the flow is very slow. There is no rubbing or strong hit. Therefore, erosion does not occur in the jet solder bath of the present invention.
- the jet solder bath of the present invention is configured so that even if the acid oxide floating in the vicinity of the jet nozzle is caught in the molten solder after the jet and sinks downward in the molten solder, the pressurizing pump is used for the lower molten solder. Because it does not suck in quickly, the acid sinking below does not enter the duct. As a result, in the jet solder bath of the present invention, there is no problem that the oxides adhere to the printed circuit board during soldering.
- FIG. 1 Front sectional view of the jet solder bath of the present invention
- FIG. 2 is a partially broken perspective view of a secondary jet nozzle installed in the jet solder bath of the present invention.
- FIG. 3 Side sectional view of the secondary jet nozzle installed in the jet solder bath of the present invention
- the secondary jet nozzle that quietly jets molten solder has been described.
- the present invention can also be applied to a primary jet nozzle that roughens the molten solder that jets.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE602006015776T DE602006015776D1 (de) | 2005-02-07 | 2006-02-06 | Jet-lotbad |
| JP2007501661A JP4941289B2 (ja) | 2005-02-07 | 2006-02-06 | 噴流はんだ槽 |
| US11/883,846 US8091758B2 (en) | 2005-02-07 | 2006-02-06 | Wave soldering bath |
| CN2006800035682A CN101112139B (zh) | 2005-02-07 | 2006-02-06 | 喷流焊料槽 |
| PL06713119T PL1850646T3 (pl) | 2005-02-07 | 2006-02-06 | Wanna do lutowania strumieniem |
| EP06713119A EP1850646B1 (en) | 2005-02-07 | 2006-02-06 | Jet solder bath |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005030957 | 2005-02-07 | ||
| JP2005-030957 | 2005-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006082960A1 true WO2006082960A1 (ja) | 2006-08-10 |
Family
ID=36777337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2006/301976 Ceased WO2006082960A1 (ja) | 2005-02-07 | 2006-02-06 | 噴流はんだ槽 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8091758B2 (ja) |
| EP (1) | EP1850646B1 (ja) |
| JP (1) | JP4941289B2 (ja) |
| CN (1) | CN101112139B (ja) |
| DE (1) | DE602006015776D1 (ja) |
| PL (1) | PL1850646T3 (ja) |
| WO (1) | WO2006082960A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161453A1 (ja) | 2012-04-27 | 2013-10-31 | 千住金属工業株式会社 | 偏流板及び噴流装置 |
| JP2021527330A (ja) * | 2018-06-14 | 2021-10-11 | イリノイ トゥール ワークス インコーポレイティド | はんだウェーブ幅を変更するように自動で調節可能な摺動プレートを備えるウェーブはんだノズル |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8590765B2 (en) * | 2010-02-26 | 2013-11-26 | Panasonic Corporation | Soldering apparatus |
| KR20130059760A (ko) * | 2011-11-29 | 2013-06-07 | 삼성전기주식회사 | 솔더범프 형성장치 및 이를 구비하는 솔더링 설비 |
| DE102012013209A1 (de) * | 2012-07-04 | 2014-01-09 | Erwin Quarder Systemtechnik Gmbh | Lötdüse für eine Lötvorrichtung |
| TWM454066U (zh) * | 2013-01-25 | 2013-05-21 | Inventec Corp | 自動焊接設備 |
| DE102014211807A1 (de) * | 2014-06-20 | 2015-12-24 | Robert Bosch Gmbh | Lötvorrichtung und Verfahren zum Löten |
| US9370838B2 (en) * | 2014-08-21 | 2016-06-21 | Illinois Tool Works Inc. | Wave soldering nozzle system and method of wave soldering |
| DE102016124642B4 (de) | 2016-12-16 | 2023-10-05 | Seho Vermögensverwaltungs Gmbh & Co. Kg | Verfahren und Vorrichtung zum Verlöten von Baugruppen |
| CN109719361A (zh) * | 2017-10-31 | 2019-05-07 | 康普技术有限责任公司 | 选择性波焊接的设备和方法 |
| US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
| JP6590232B1 (ja) * | 2019-04-22 | 2019-10-16 | 千住金属工業株式会社 | はんだ付け装置及びはんだ付け方法 |
| US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
| CN115415630B (zh) * | 2022-08-30 | 2024-05-14 | 西安空间无线电技术研究所 | 一种用于自动搪锡设备的锡锅结构 |
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| JPH0619968U (ja) * | 1992-08-20 | 1994-03-15 | 株式会社コウキテクノ | 噴流式半田槽 |
| JP2003053529A (ja) * | 2001-08-07 | 2003-02-26 | Senju Metal Ind Co Ltd | 酸化物の分離方法および酸化物の分離装置 |
| JP2005028446A (ja) * | 2003-06-17 | 2005-02-03 | Ktt:Kk | 半田槽用ポンプ及びそれを使用する半田槽 |
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| US3752383A (en) * | 1971-11-11 | 1973-08-14 | Technical Devices Co | Soldering apparatus |
| JPS521771B2 (ja) | 1972-03-25 | 1977-01-18 | ||
| DE2515437A1 (de) | 1974-04-16 | 1975-11-20 | Ici Ltd | Verfahren zur kristallisation von bis(4-chlorphenyl)sulfon |
| JPS513632A (ja) | 1974-06-28 | 1976-01-13 | Kenkoo Kk | Ingayakitsukeho |
| JPS62259665A (ja) | 1986-01-20 | 1987-11-12 | Asahi Chem Res Lab Ltd | 溶融半田の噴流方法及び装置 |
| JPS6471572A (en) | 1987-09-09 | 1989-03-16 | Tamura Seisakusho Kk | Method for separating solder oxide |
| JPH0619968A (ja) | 1991-09-13 | 1994-01-28 | Oki Electric Ind Co Ltd | 専門用語自動抽出装置 |
| FR2682903B1 (fr) | 1991-10-28 | 1994-01-21 | Jacqueline Brizais | Dispositif de controle de hauteur de vague dans une installation de soudage a la vague. |
| JP2004009127A (ja) * | 2002-06-11 | 2004-01-15 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |
| PL1676662T3 (pl) * | 2003-10-10 | 2010-10-29 | Senju Metal Industry Co | Dyszowy zbiornik dla lutowia |
| DE102004040405B4 (de) | 2004-08-19 | 2008-11-13 | Nec Europe Ltd. | Verfahren zur Optimierung des Energieverbrauchs einer Station in einem drahtlosen Netzwerk |
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2006
- 2006-02-06 WO PCT/JP2006/301976 patent/WO2006082960A1/ja not_active Ceased
- 2006-02-06 EP EP06713119A patent/EP1850646B1/en not_active Expired - Lifetime
- 2006-02-06 PL PL06713119T patent/PL1850646T3/pl unknown
- 2006-02-06 CN CN2006800035682A patent/CN101112139B/zh not_active Expired - Lifetime
- 2006-02-06 JP JP2007501661A patent/JP4941289B2/ja not_active Expired - Lifetime
- 2006-02-06 DE DE602006015776T patent/DE602006015776D1/de not_active Expired - Lifetime
- 2006-02-06 US US11/883,846 patent/US8091758B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0619968U (ja) * | 1992-08-20 | 1994-03-15 | 株式会社コウキテクノ | 噴流式半田槽 |
| JP2003053529A (ja) * | 2001-08-07 | 2003-02-26 | Senju Metal Ind Co Ltd | 酸化物の分離方法および酸化物の分離装置 |
| JP2005028446A (ja) * | 2003-06-17 | 2005-02-03 | Ktt:Kk | 半田槽用ポンプ及びそれを使用する半田槽 |
Non-Patent Citations (1)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161453A1 (ja) | 2012-04-27 | 2013-10-31 | 千住金属工業株式会社 | 偏流板及び噴流装置 |
| US9622395B2 (en) | 2012-04-27 | 2017-04-11 | Senju Metal Industry Co., Ltd. | Guide vane and jetting apparatus |
| JP2021527330A (ja) * | 2018-06-14 | 2021-10-11 | イリノイ トゥール ワークス インコーポレイティド | はんだウェーブ幅を変更するように自動で調節可能な摺動プレートを備えるウェーブはんだノズル |
| JP7290669B2 (ja) | 2018-06-14 | 2023-06-13 | イリノイ トゥール ワークス インコーポレイティド | はんだウェーブ幅を変更するように自動で調節可能な摺動プレートを備えるウェーブはんだノズル |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4941289B2 (ja) | 2012-05-30 |
| CN101112139A (zh) | 2008-01-23 |
| PL1850646T3 (pl) | 2011-01-31 |
| EP1850646A1 (en) | 2007-10-31 |
| CN101112139B (zh) | 2012-01-25 |
| EP1850646B1 (en) | 2010-07-28 |
| DE602006015776D1 (de) | 2010-09-09 |
| JPWO2006082960A1 (ja) | 2008-08-07 |
| US8091758B2 (en) | 2012-01-10 |
| EP1850646A4 (en) | 2009-04-08 |
| US20100163599A1 (en) | 2010-07-01 |
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