WO2006099652A1 - Tete d'impression a jet d'encre comportant des buses isolees - Google Patents

Tete d'impression a jet d'encre comportant des buses isolees Download PDF

Info

Publication number
WO2006099652A1
WO2006099652A1 PCT/AU2005/000392 AU2005000392W WO2006099652A1 WO 2006099652 A1 WO2006099652 A1 WO 2006099652A1 AU 2005000392 W AU2005000392 W AU 2005000392W WO 2006099652 A1 WO2006099652 A1 WO 2006099652A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
printhead
ink ejection
ejection surface
roof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AU2005/000392
Other languages
English (en)
Inventor
Kia Silverbrook
Gregory John Mcavoy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Priority to JP2007555422A priority Critical patent/JP4473314B2/ja
Priority to KR1020077024048A priority patent/KR100973614B1/ko
Priority to EP05714264A priority patent/EP1861256A4/fr
Priority to AU2005329726A priority patent/AU2005329726B2/en
Priority to CA2592267A priority patent/CA2592267C/fr
Priority to PCT/AU2005/000392 priority patent/WO2006099652A1/fr
Publication of WO2006099652A1 publication Critical patent/WO2006099652A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/1412—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B41J2002/14443—Nozzle guard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

Definitions

  • the present invention relates to the field of inkjet printers and, discloses an inkjet printing system using printheads manufactured with microelectro-mechanical systems (MEMS) techniques.
  • MEMS microelectro-mechanical systems
  • Ink Jet printers themselves come in many different types.
  • the utilization of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein US Patent No. 1941001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
  • US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al)
  • Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in US Patent No. 3946398 (1970) which utilizes a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in US Patent No. 3747120 (1972) discloses a bend mode of piezoelectric operation, Howkins in US Patent No. 4459601 discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a shear mode type of piezoelectric transducer element.
  • the ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in US Patent 4490728. Both the aforementioned references disclosed ink jet printing techniques that rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media.
  • Printing devices utilizing the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.
  • a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
  • a problem with inkjet printheads, and especially inkjet printheads having a high nozzle density, is that ink can flood across the printhead surface contaminating adjacent nozzles. This is undesirable because it results in reduced print quality.
  • cross- contamination of ink across the printhead surface can potentially result in electrolysis and accelerated corrosion of nozzle actuators. Previous attempts to minimize ink flooding across the printhead surface typically involve coating the printhead with a hydrophobic material. However, hydrophobic coatings have only had limited success in minimizing the extent of flooding.
  • printheads are wiped regularly to remove particles of paper dust or paper fibers, which build up on the ink ejection surface.
  • a wiping mechanism comes into contact with nozzle structures on the printhead surface, there is an obvious risk of damaging the nozzles.
  • a printhead comprising: a substrate including a plurality of nozzles for ejecting ink droplets onto a print medium, each nozzle having a nozzle aperture defined in an ink ejection surface of the substrate; and a plurality of formations on the ink ejection surface, the surface formations being configured to isolate each nozzle from at least one adjacent nozzle.
  • a method of operating a printhead whilst minimizing cross-contamination of ink between adjacent nozzles, the method comprising the steps of: (a) providing a printhead comprising: a substrate including a plurality of nozzles for ejecting ink droplets onto a print medium, each nozzles having a nozzle aperture defined in an ink ejection surface of the substrate; and a plurality of formations on the ink ejection surface, the surface formations being configured to isolate each nozzle from at least one adjacent nozzle; and
  • a method of fabricating a printhead having isolated nozzles comprising the steps of: (a) providing a substrate, the substrate including a plurality of nozzles for ejecting ink droplets onto a print medium, each nozzle having a nozzle aperture defined in an ink ejection surface of the substrate;
  • each nozzle enclosure having an opening defined in a roof and sidewalls extending from the roof to the ink ejection surface; and (f) removing the photoresist.
  • the formations have a hydrophobic surface.
  • InkJet inks are typically aqueous-based inks and hydrophobic formations will repel any flooded ink.
  • hydrophobic formations minimize as far as possible any cross-contamination of ink by acting as a physical barrier and by intermolecular repulsive forces.
  • hydrophobic formations promote ingestion of any flooded ink back into respective nozzle chambers and ink supply channels. Since nozzle chambers are typically hydrophilic, ink will tend to be drawn back into the nozzle and away from a surrounding hydrophobic formation.
  • each nozzle enclosure comprising sidewalls surrounding a respective nozzle, the sidewalls forming a seal with the ink ejection surface.
  • each nozzle is isolated from its adjacent nozzles by a nozzle enclosure.
  • each nozzle enclosure further comprises a roof spaced apart from the respective nozzle, the roof having a roof opening aligned with a respective nozzle opening for allowing ejected ink droplets to pass therethrough onto the print medium.
  • each nozzle enclosure may typically take the form of a cap, which covers or encapsulates an individual nozzle on the ink ejection surface.
  • the roof not only provides additional containment of any flooded ink, it also provides further protection of each nozzle from, for example, the potentially damaging effects of paper dust, paper fibers or wiping.
  • the sidewalls extend from a perimeter region of each roof to the ink ejection surface. Sidewalls of adjacent nozzle enclosures are usually spaced apart across the ink ejection surface.
  • the printhead is an inkjet printhead, such as a pagewidth inkjet printhead.
  • the printhead has a nozzle density, which is sufficient to print at up to 1600 dpi. The present invention is particularly beneficial for printheads having a high nozzle density, because high density printheads are especially prone to flooding between adjacent nozzles.
  • Fig. 1 is a schematic cross-sectional view through an ink chamber of a unit cell of a printhead according to an embodiment using a bubble forming heater element
  • Fig. 2 is a schematic cross-sectional view through the ink chamber Fig. 1, at another stage of operation;
  • Fig. 3 is a schematic cross-sectional view through the ink chamber Fig. 1, at yet another stage of operation;
  • Fig. 4 is a schematic cross-sectional view through the ink chamber Fig. 1, at yet a further stage of operation;
  • Fig. 5 is a diagrammatic cross-sectional view through a unit cell of a printhead in accordance with an embodiment of the invention showing the collapse of a vapor bubble.
  • Fig. 6 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.
  • Figs. 7 to 20 are schematic perspective views of the unit cell shown in Fig. 6, at various successive stages in the fabrication process of the printhead.
  • the unit cell 1 of one of the Applicant's printheads comprises a nozzle plate 2 with nozzles 3 therein, the nozzles having nozzle rims 4, and apertures 5 extending through the nozzle plate.
  • the nozzle plate 2 is plasma etched from a silicon nitride structure which is deposited, by way of chemical vapor deposition (CVD), over a sacrificial material which is subsequently etched.
  • CVD chemical vapor deposition
  • the printhead also includes, with respect to each nozzle 3, side walls 6 on which the nozzle plate is supported, a chamber 7 defined by the walls and the nozzle plate 2, a multi- layer substrate 8 and an inlet passage 9 extending through the multi-layer substrate to the far side (not shown) of the substrate.
  • a looped, elongate heater element 10 is suspended within the chamber 7, so that the element is in the form of a suspended beam.
  • the printhead as shown is a microelectromechanical system (MEMS) structure, which is formed by a lithographic process which is described in more detail below.
  • MEMS microelectromechanical system
  • ink 11 from a reservoir enters the chamber 7 via the inlet passage 9, so that the chamber fills to the level as shown in Figure 1.
  • the heater element 10 is heated for somewhat less than 1 microsecond, so that the heating is in the form of a thermal pulse.
  • the heater element 10 is in thermal contact with the ink 11 in the chamber 7 so that when the element is heated, this causes the generation of vapor bubbles 12 in the ink.
  • the ink 11 constitutes a bubble forming liquid.
  • Figure 1 shows the formation of a bubble 12 approximately 1 microsecond after generation of the thermal pulse, that is, when the bubble has just nucleated on the heater elements 10. It will be appreciated that, as the heat is applied in the form of a pulse, all the energy necessary to generate the bubble 12 is to be supplied within that short time.
  • the bubble 12 forms along the length of the element, this bubble appearing, in the cross-sectional view of Figure 1, as four bubble portions, one for each of the element portions shown in cross section.
  • the bubble 12, once generated, causes an increase in pressure within the chamber 7, which in turn causes the ejection of a drop 16 of the ink 11 through the nozzle 3.
  • the rim 4 assists in directing the drop 16 as it is ejected, so as to minimize the chance of drop misdirection.
  • the bubble 12 generates further, and hence grows, with the resultant advancement of ink 11 through the nozzle 3.
  • the shape of the bubble 12 as it grows, as shown in Figure 3, is determined by a combination of the inertial dynamics and the surface tension of the ink 11. The surface tension tends to minimize the surface area of the bubble 12 so that, by the time a certain amount of liquid has evaporated, the bubble is essentially disk-shaped.
  • the increase in pressure within the chamber 7 not only pushes ink 11 out through the nozzle 3, but also pushes some ink back through the inlet passage 9.
  • the inlet passage 9 is approximately 200 to 300 microns in length, and is only approximately 16 microns in diameter. Hence there is a substantial viscous drag. As a result, the predominant effect of the pressure rise in the chamber 7 is to force ink out through the nozzle 3 as an ejected drop 16, rather than back through the inlet passage 9.
  • the printhead is shown at a still further successive stage of operation, in which the ink drop 16 that is being ejected is shown during its "necking phase" before the drop breaks off.
  • the bubble 12 has already reached its maximum size and has then begun to collapse towards the point of collapse 17, as reflected in more detail in Figure 21.
  • the collapsing of the bubble 12 towards the point of collapse 17 causes some ink 11 to be drawn from within the nozzle 3 (from the sides 18 of the drop), and some to be drawn from the inlet passage 9, towards the point of collapse. Most of the ink 11 drawn in this manner is drawn from the nozzle 3, forming an annular neck 19 at the base of the drop 16 prior to its breaking off.
  • the drop 16 requires a certain amount of momentum to overcome surface tension forces, in order to break off.
  • the diameter of the neck 19 reduces thereby reducing the amount of total surface tension holding the drop, so that the momentum of the drop as it is ejected out of the nozzle is sufficient to allow the drop to break off.
  • cavitation forces are caused as reflected by the arrows 20, as the bubble 12 collapses to the point of collapse 17. It will be noted that there are no solid surfaces in the vicinity of the point of collapse 17 on which the cavitation can have an effect.
  • the aperture 5 is surrounded by a nozzle enclosure 60, which isolates adjacent apertures on the printhead.
  • the nozzle enclosure 60 has a roof 61 and sidewalls 62, which extend from the roof to the nozzle plate 2 and form a seal therewith.
  • An opening 63 is defined in the roof 61, which allows ink droplets (not shown) to pass through the nozzle enclosure and onto a print medium (not shown).
  • the nozzle enclosure 60 minimize cross-contamination between adjacent apertures 5 by containing any flooded ink in the immediate vicinity of each nozzle. Flooding of ink from each nozzle may be caused by a variety of reasons, such as nozzle misfires or pressure fluctuations in ink supply channels.
  • the nozzle enclosure may be formed from or coated with a hydrophobic material during the fabrication process, which further minimizes the risk of cross-contamination.
  • a further advantage of the printhead according to the invention is that it allows the nozzle plate 2 of the printhead to be wiped without risk of damaging the sensitive nozzle structures.
  • inkjet printheads are cleaned by a wiping mechanism as part of a warm-up cycle.
  • the nozzle enclosures 60 provide a protective barrier between the nozzles and the wiping mechanism (not shown).
  • CMOS processing of a silicon wafer provides a silicon substrate 21 having drive circuitry 22, and an interlayer dielectric ("interconnect") 23.
  • the interconnect 23 comprises four metal layers, which together form a seal ring for the inlet passage 9 to be etched through the interconnect.
  • the top metal layer 26, which forms an upper portion of the seal ring, can be seen in Figure 7.
  • the metal seal ring prevents ink moisture from seeping into the interconnect 23 when the inlet passage 9 is filled with ink.
  • a passivation layer 24 is deposited onto the top metal layer 26 by plasma-enhanced chemical vapour deposition (PECVD). After deposition of the passivation layer 24, it is etched to define a circular recess, which forms parts of the inlet passage 9. At the same as etching the recess, a plurality of vias 50 are also etched, which allow electrical connection through the passivation layer 24 to the top metal layer 26.
  • the etch pattern is defined by a layer of patterned photoresist (not shown), which is removed by O 2 ashing after the etch.
  • a layer of photoresist is spun onto the passivation later 24.
  • the photoresist is exposed and developed to define a circular opening.
  • the dielectric interconnect 23 is etched as far as the silicon substrate 21 using a suitable oxide-etching gas chemistry (e.g. (VC 4 F 8 ).
  • Etching through the silicon substrate is continued down to about 20 microns to define a front ink hole 52, using a suitable silicon-etching gas chemistry (e.g. 'Bosch etch').
  • a suitable silicon-etching gas chemistry e.g. 'Bosch etch'.
  • the same photoresist mask 51 can be used for both etching steps.
  • Figure 9 shows the unit cell after etching the front ink hole 52 and removal of the photoresist 51.
  • the front ink hole 52 is plugged with photoresist to provide a front plug 53.
  • a layer of photoresist is deposited over the passivation layer 24.
  • This layer of photoresist is exposed and developed to define a first sacrificial scaffold 54 over the front plug 53, and scaffolding tracks 35 around the perimeter of the unit cell.
  • the first sacrificial scaffold 54 is used for subsequent deposition of heater material 38 thereon and is therefore formed with a planar upper surface to avoid any buckling in the heater element (see heater element 10 in Figure 10).
  • the first sacrificial scaffold 54 is UV cured and hardbaked to prevent reflow of the photoresist during subsequent high-temperature deposition onto its upper surface.
  • the first sacrificial scaffold 54 has sloped or angled side faces 55. These angled side faces 55 are formed by adjusting the focusing in the exposure tool (e.g. stepper) when exposing the photoresist.
  • the sloped side faces 55 advantageously allow heater material 38 to be deposited substantially evenly over the first sacrificial scaffold 54.
  • the next stage of fabrication deposits the heater material 38 over the first sacrificial scaffold 54, the passivation layer 24 and the perimeter scaffolding tracks 35.
  • the heater material 38 is typically a monolayer of TiAlN.
  • the heater material 38 may alternatively comprise TiAlN sandwiched between upper and lower passivating materials, such as tantalum or tantalum nitride. Passivating layers on the heater element 10 minimize corrosion of the and improve heater longevity.
  • the heater material 38 is subsequently etched down to the first sacrificial scaffold 54 to define the heater element 10.
  • contact electrodes 15 are defined on either side of the heater element 10.
  • the electrodes 15 are in contact with the top metal layer 26 and so provide electrical connection between the CMOS and the heater element 10.
  • the sloped side faces of the first sacrificial scaffold 54 ensure good electrical connection between the heater element 10 and the electrodes 15, since the heater material is deposited with sufficient thickness around the scaffold 54. Any thin areas of heater material (due to insufficient side face deposition) would increase resistivity and affect heater performance.
  • Adjacent unit cells are electrically insulated from each other by virtue of grooves etched around the perimeter of each unit cell.
  • the grooves are etched at the same time as defining the heater element 10.
  • a second sacrificial scaffold 39 of photoresist is deposited over the heater material.
  • the second sacrificial scaffold 39 is exposed and developed to define sidewalls for the cylindrical nozzle chamber and perimeter sidewalls for each unit cell.
  • the second sacrificial scaffold 39 is also UV cured and hardbaked to prevent any refiow of the photoresist during subsequent high-temperature deposition of the silicon nitride roof material.
  • silicon nitride is deposited onto the second sacrificial scaffold 39 by plasma enhanced chemical vapour deposition.
  • the silicon nitride forms a roof 44 over each unit cell, which is the nozzle plate 2 for a row of nozzles.
  • Chamber sidewalls 6 and unit cell sidewalls 56 are also formed by deposition of silicon nitride.
  • the nozzle rim 4 is etched partially through the roof 44, by placing a suitably patterned photoresist mask over the roof, etching for a controlled period of time and removing the photoresist by ashing.
  • the nozzle aperture 5 is etched through the roof 24 down to the second sacrificial scaffold 39. Again, the etch is performed by placing a suitably patterned photoresist mask over the roof, etching down to the scaffold 39 and removing the photoresist mask.
  • a third sacrificial scaffold 64 is deposited over the roof 44.
  • the third sacrificial scaffold 64 is exposed and developed to define sidewalls for the cylindrical nozzle enclosure over each aperture 5.
  • the third sacrificial scaffold 64 is also UV cured and hardbaked to prevent any refiow of the photoresist during subsequent high-temperature deposition of the nozzle enclosure material.
  • silicon nitride is deposited onto the third sacrificial scaffold 64 by plasma enhanced chemical vapour deposition.
  • the silicon nitride forms an enclosure roof 61 over each aperture 5.
  • Enclosure sidewalls 62 are also formed by deposition of silicon nitride.
  • the enclosure roof 61 may equally be formed from silicon oxide, silicon oxynitride etc.
  • a layer of hydrophobic material ⁇ e.g. fluoropolymer
  • This extra deposition step may be performed at any stage after deposition (e.g. after etching or after ashing).
  • the nozzle enclosure 60 is formed by etching through the enclosure roof layer 61.
  • the enclosure opening 63 is defined by this etch.
  • the enclosure roof material which is located outside the enclosure sidewalls 62 is removed.
  • the etch pattern is defined by standard photoresist masking.
  • the first, second and sacrificial scaffolds of photoresist, together with the front plug 53 are ashed off using an O 2 plasma. Accordingly, fluid connection is made from the ink supply channel 32 through to the nozzle aperture 5 and the nozzle enclosure opening 63.
  • a portion of photoresist, on either side of the nozzle chamber sidewalls 6, remains encapsulated by the roof 44, the unit cell sidewalls 56 and the chamber sidewalls 6.
  • This portion of photoresist is sealed from the O 2 ashing plasma and, therefore, remains intact after fabrication of the printhead.
  • This encapsulated photoresist advantageously provides additional robustness for the printhead by supporting the nozzle plate 2.
  • the printhead has a robust nozzle plate spanning continuously over rows of nozzles, and being supported by solid blocks of hardened photoresist, in addition to support walls.
  • Embodiments The invention has been described above with reference to printheads using bubble forming heater elements. However, it is potentially suited to a wide range of printing system including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
  • PHOTO CD PHOTO CD is a registered trade mark of the Eastman Kodak Company
  • the embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.
  • thermal ink jet The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. In conventional thermal inkjet printheads, this leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.
  • piezoelectric inkjet The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.
  • the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications.
  • new ink jet technologies have been created.
  • the target features include: low power (less than 10 Watts) high resolution capability (1,600 dpi or more) photographic quality output low manufacturing cost small size (pagewidth times minimum cross section) high speed ( ⁇ 2 seconds per page).
  • ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.
  • the printhead is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing.
  • the printhead is 100 mm long, with a width which depends upon the ink jet type.
  • the smallest printhead designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm.
  • the printheads each contain 19,200 nozzles plus data and control circuitry.
  • Ink is supplied to the back of the printhead by injection molded plastic ink channels.
  • the molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.
  • ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes.
  • Most of the IJOl to IJ45 examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.
  • Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

La présente invention concerne une tête d'impression appropriée pour minimiser la contamination croisée entre des buses (3). La tête d'impression comprend un substrat (8), qui comprend une pluralité de buses (3) destinées à éjecter des gouttelettes d'encre sur un support d'impression. Chaque buse (3) comporte une ouverture de buse (5) qui est définie dans une surface d'éjection d'encre du substrat (8). La tête d'impression comprend également une pluralité de formations sur la surface d'éjection d'encre. Les formations de surface sont configurées pour isoler chaque buse (3) par rapport à au moins une buse adjacente (3) et prennent en général la forme d'espace fermé (60) entourant chaque buse (3).
PCT/AU2005/000392 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees Ceased WO2006099652A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007555422A JP4473314B2 (ja) 2005-03-21 2005-03-21 印刷ヘッド、プリンタ、および印刷する方法
KR1020077024048A KR100973614B1 (ko) 2005-03-21 2005-03-21 고립노즐을 구비한 잉크젯 프린트헤드
EP05714264A EP1861256A4 (fr) 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees
AU2005329726A AU2005329726B2 (en) 2005-03-21 2005-03-21 Inkjet printhead having isolated nozzles
CA2592267A CA2592267C (fr) 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees
PCT/AU2005/000392 WO2006099652A1 (fr) 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/AU2005/000392 WO2006099652A1 (fr) 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees

Publications (1)

Publication Number Publication Date
WO2006099652A1 true WO2006099652A1 (fr) 2006-09-28

Family

ID=37023282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AU2005/000392 Ceased WO2006099652A1 (fr) 2005-03-21 2005-03-21 Tete d'impression a jet d'encre comportant des buses isolees

Country Status (6)

Country Link
EP (1) EP1861256A4 (fr)
JP (1) JP4473314B2 (fr)
KR (1) KR100973614B1 (fr)
AU (1) AU2005329726B2 (fr)
CA (1) CA2592267C (fr)
WO (1) WO2006099652A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010520080A (ja) * 2007-03-12 2010-06-10 シルバーブルック リサーチ ピーティワイ リミテッド 疎水性のインク噴射面を有する印刷ヘッドを製造する方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102926993B1 (ko) 2020-07-22 2026-02-12 삼성디스플레이 주식회사 잉크젯 프린트 장치 및 이를 이용한 잉크젯 프린트 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528577A (en) * 1982-11-23 1985-07-09 Hewlett-Packard Co. Ink jet orifice plate having integral separators
US4578687A (en) * 1984-03-09 1986-03-25 Hewlett Packard Company Ink jet printhead having hydraulically separated orifices
US6523938B1 (en) * 2000-01-17 2003-02-25 Hewlett-Packard Company Printer orifice plate with mutually planarized ink flow barriers
US20030143492A1 (en) * 2002-01-31 2003-07-31 Scitex Digital Printing, Inc. Mandrel with controlled release layer for multi-layer electroformed ink jet orifice plates
US20040029305A1 (en) * 2002-08-08 2004-02-12 Industrial Technology Research Institute Method for fabricating an integrated nozzle plate and multi-level micro-fluidic devices fabricated

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4199881B2 (ja) * 1999-07-02 2008-12-24 セーレン株式会社 インクジェット噴射ヘッド及びインクジェット記録装置
JP2004268359A (ja) * 2003-03-07 2004-09-30 Hitachi Printing Solutions Ltd インクジェットヘッド及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528577A (en) * 1982-11-23 1985-07-09 Hewlett-Packard Co. Ink jet orifice plate having integral separators
US4578687A (en) * 1984-03-09 1986-03-25 Hewlett Packard Company Ink jet printhead having hydraulically separated orifices
US6523938B1 (en) * 2000-01-17 2003-02-25 Hewlett-Packard Company Printer orifice plate with mutually planarized ink flow barriers
US6732433B2 (en) * 2000-01-17 2004-05-11 Hewlett-Packard Development Company, L.P. Method of manufacturing an inkjet nozzle plate and printhead
US20030143492A1 (en) * 2002-01-31 2003-07-31 Scitex Digital Printing, Inc. Mandrel with controlled release layer for multi-layer electroformed ink jet orifice plates
US20040029305A1 (en) * 2002-08-08 2004-02-12 Industrial Technology Research Institute Method for fabricating an integrated nozzle plate and multi-level micro-fluidic devices fabricated

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1861256A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010520080A (ja) * 2007-03-12 2010-06-10 シルバーブルック リサーチ ピーティワイ リミテッド 疎水性のインク噴射面を有する印刷ヘッドを製造する方法

Also Published As

Publication number Publication date
JP4473314B2 (ja) 2010-06-02
EP1861256A4 (fr) 2013-03-20
CA2592267C (fr) 2011-12-20
JP2008529848A (ja) 2008-08-07
CA2592267A1 (fr) 2006-09-28
KR20070110449A (ko) 2007-11-16
EP1861256A1 (fr) 2007-12-05
AU2005329726A1 (en) 2006-09-28
AU2005329726B2 (en) 2009-05-07
KR100973614B1 (ko) 2010-08-02

Similar Documents

Publication Publication Date Title
AU2002328661B2 (en) Ink jet printhead chip with predetermined micro-electromechanical systems height
US7794613B2 (en) Method of fabricating printhead having hydrophobic ink ejection face
US7669967B2 (en) Printhead having hydrophobic polymer coated on ink ejection face
US20100271430A1 (en) Printhead provided with individual nozzle enclosures
US20110228004A1 (en) Method of hydrophobizing ejection face of printhead
WO2008109910A1 (fr) Procédé de fabrication d'une tête d'impression ayant une face d'éjection d'encre hydrophobe
US6416170B2 (en) Differential thermal ink jet printing mechanism
US8029686B2 (en) Method of fabricating an ink jet nozzle with a heater element
KR100973614B1 (ko) 고립노즐을 구비한 잉크젯 프린트헤드
US7771015B2 (en) Printhead nozzle arrangement having a looped heater element
US8029097B2 (en) Inkjet nozzle assembly having moving roof structure and sealing bridge
US7862734B2 (en) Method of fabricating nozzle assembly having moving roof structure and sealing bridge
EP1871606A1 (fr) Procede d'hydrofugation d'une tete d'impression par application d'un revetement
EP2349724B1 (fr) Ensemble buse de jet d'encre comportant une structure de toit mobile et un pont d'étanchéité
US20040252165A1 (en) Method of fabricating an ink jet printhead chip with differential expansion actuators
US7901054B2 (en) Printhead including moving portions and sealing bridges
WO2009039551A1 (fr) Procédé d'élimination de photorésist
KR20050019138A (ko) 미리 결정된 마이크로-전자기계적 시스템 높이를 가진잉크젯 프린트헤드 칩

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2592267

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2005329726

Country of ref document: AU

WWE Wipo information: entry into national phase

Ref document number: 2007555422

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2005714264

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2005329726

Country of ref document: AU

Date of ref document: 20050321

Kind code of ref document: A

WWP Wipo information: published in national office

Ref document number: 2005329726

Country of ref document: AU

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020077024048

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: RU

WWW Wipo information: withdrawn in national office

Ref document number: RU

WWP Wipo information: published in national office

Ref document number: 2005714264

Country of ref document: EP