WO2006109355A1 - Procede et dispositif de lithographie laser multifaisceaux pour realisation de microstructures, employant des faisceaux laser de longueurs d'onde differentes - Google Patents

Procede et dispositif de lithographie laser multifaisceaux pour realisation de microstructures, employant des faisceaux laser de longueurs d'onde differentes Download PDF

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Publication number
WO2006109355A1
WO2006109355A1 PCT/JP2005/007012 JP2005007012W WO2006109355A1 WO 2006109355 A1 WO2006109355 A1 WO 2006109355A1 JP 2005007012 W JP2005007012 W JP 2005007012W WO 2006109355 A1 WO2006109355 A1 WO 2006109355A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
different wavelength
reaction
curing reaction
inducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/007012
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English (en)
Japanese (ja)
Inventor
Hiroshi Masuhara
Shoji Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D-MEC Ltd
Japan Science and Technology Agency
D Mec Ltd
Original Assignee
D-MEC Ltd
Japan Science and Technology Agency
D Mec Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D-MEC Ltd, Japan Science and Technology Agency, D Mec Ltd filed Critical D-MEC Ltd
Priority to PCT/JP2005/007012 priority Critical patent/WO2006109355A1/fr
Publication of WO2006109355A1 publication Critical patent/WO2006109355A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources

Definitions

  • the present invention relates to a multi-beam microstructure optical modeling method and apparatus using different wavelength laser light.
  • the size of the cured portion of the photocurable resin is determined by the focused spot diameter of the laser beam.
  • Patent Document 1 Japanese Patent Laid-Open No. 2003-025295
  • Patent Document 2 JP 2001-158050 A
  • Patent Document 3 Japanese Patent Laid-Open No. 7-329188
  • Patent Document 4 Japanese Patent Laid-Open No. 2003-001599
  • Non-Patent Literature l Makoto Horiyama, Hong— Bo Sun, Masafumi Miwa, Shige Ki Kimatsuo, and Hiroaki Misawa, Japanese Journal of Applied Physi cs 38, pp. L212 -L215 (1999).
  • Non-Patent Document 2 Shoji Maruo and Koji Ikuta, Applied Physics Letters 7 6, p. 2656 (2000).
  • Non-Patent Document 3 Shoji Maruo, Osamu Nakamura, and Satoshi Kawata, Optics Letters 22, p. 132 (1997).
  • Non-Patent Document 4 Hong— Bo Sun, Takeshi Kawakami, Ying Xu, Jia-Yu Ye, Shigeki Matsuo, Hiroaki Misawa, Masafumi Miwa, and Reizo Kane ko, Optics Letters 25, p. 1110 (2000).
  • the reason why it is difficult to improve the modeling accuracy in the one-photon process is that light absorption occurs in a region other than the focused spot of the laser beam, that is, a region outside the scanning locus of the focused spot. This is because a curing reaction occurs.
  • the photocuring reaction is a threshold reaction, and curing occurs when the amount of light irradiation exceeds a certain threshold.
  • Two-photon polymerization can have high spatial selectivity because the two-photon absorption probability is proportional to the square of the light intensity, and therefore light absorption occurs only near the condensing spot.
  • the present invention provides a reaction promoting laser beam having a wavelength different from that of the curing reaction inducing laser beam (in the example, a near infrared laser).
  • a reaction promoting laser beam having a wavelength different from that of the curing reaction inducing laser beam (in the example, a near infrared laser).
  • the present invention is in addition to the laser beam for inducing the curing reaction.
  • Multi-beam microstructures using different wavelength laser light that can give nano-level three-dimensional spatial selectivity by using a reaction promoting laser light having a wavelength different from that of the curing reaction inducing laser light
  • An object is to provide an optical modeling method and apparatus. In order to achieve the above object, the present invention provides
  • a curing reaction-inducing laser beam is irradiated into a photocurable resin, and a laser beam for promoting a reaction at a different wavelength is cured.
  • a photocurable resin in superposition with the laser beam for inducing reaction, a photocuring reaction is induced only in the vicinity of the focused spot where the two laser beams overlap.
  • the curing reaction-inducing laser beam is absorbed in the photocurable resin. It is characterized by being one laser beam and having an extremely weak light intensity, and the one reaction promoting laser beam is a laser beam having another wavelength that is not absorbed by the photocurable resin.
  • the intensity of the curing reaction-inducing laser beam is approximately 0.038-0. It is.
  • the wavelength of the reaction promoting laser beam is approximately 1064 nm.
  • means for irradiating a curing reaction inducing laser beam having an extremely weak light intensity that does not induce a photocuring reaction and the curing A means for irradiating a reaction promoting laser beam to the same spot as the curing reaction inducing laser light in a state where the reaction inducing laser light is irradiated in the photocurable resin, and a collection of the curing reaction inducing laser light. It is characterized by comprising a photocurable resin that induces a photocuring reaction only in the vicinity of the light spot.
  • the curing reaction-inducing laser beam has an intensity of about 0.038-0.076 / z W.
  • the reaction promoting laser beam has a wavelength of approximately 1064 nm. .
  • the photocurable resin in which the photocurable resin is dropped on a glass substrate The curing reaction inducing laser light and the reaction promoting laser light are irradiated from the glass substrate side.
  • the photocurable resin is It is an acrylic photocurable resin.
  • FIG. 1 is a block diagram of a main part of a multi-beam micro structure object stereolithography apparatus using a two-beam micro-stereolithography method showing a first embodiment of the present invention.
  • FIG. 2 is a diagram showing a resin line pattern formed by the two-beam micro-stereolithography method according to the first embodiment of the present invention.
  • FIG. 3 is a system configuration diagram of a multi-beam micro structure object stereolithography apparatus using a two-beam micro-stereolithography method showing a second embodiment of the present invention.
  • FIG. 4 is a view showing a scanning electron microscope image of a photocurable resin that has been spot-cured on a glass substrate according to a second embodiment of the present invention.
  • FIG. 5 is a diagram showing a columnar microstructure manufactured according to the present invention.
  • the photocuring reaction is not induced !, extremely weak !, for accelerating the reaction to the same spot in a state where the curing reaction-inducing laser light is irradiated into the resin at the light intensity.
  • a photo-curing reaction can occur only in the vicinity of the condensing spot of the curing reaction-inducing laser beam, and nano-level three-dimensional spatial selectivity can be achieved.
  • FIG. 1 is a configuration diagram of the main part of a multi-beam micro-structure stereolithography apparatus using a two-beam micro-stereolithography according to the first embodiment of the present invention, and FIG. It is a figure which shows the line pattern of the made resin.
  • 1 is a glass substrate
  • 2 is a stage
  • 3 is an objective lens (40 ⁇ , NA: 0.9)
  • 4 is an ultraviolet laser beam for inducing curing reaction (dotted line)
  • 5 is a near reaction promoting accelerator.
  • 6 is a photocurable resin.
  • the curing reaction-inducing ultraviolet laser beam 4 is condensed by the objective lens 3 at the interface between the glass substrate 1 and the photocurable resin 6, and the stage 2 is scanned, while the curing reaction-inducing ultraviolet laser beam is scanned.
  • the photocurable resin 6 is, for example, an acrylic photocurable resin CFC KC 1156A).
  • the curing reaction inducing laser beam 4 is a laser beam that is absorbed by the photocurable resin 6 and has an extremely weak light intensity.
  • the reaction promoting laser beam 5 is a photocurable resin. This is a laser beam of another wavelength that is not absorbed by the resin 6.
  • the photocuring reaction (resin line pattern 7 ) Can be confirmed.
  • the photo-curing reaction does not occur when only the curing reaction-inducing ultraviolet laser light 4 is irradiated, but the photo-curing reaction does not occur even when only the reaction-promoting near-infrared laser light 5 is irradiated.
  • FIG. 3 is a system configuration diagram of a multi-beam micro structure stereolithography apparatus using a two-beam micro stereo modeling method according to a second embodiment of the present invention
  • FIG. 4 is a glass illustrating a second embodiment of the present invention. It is a figure which shows the scanning electron microscope image of the photocurable resin which was spot-cured on the board
  • 11 is an ultraviolet laser light source for inducing curing reaction
  • 12, 13, 16, 18, 19 are reflecting mirrors
  • 14, 15, 20, 21, 25 are lenses
  • 17 is a near infrared for promoting reaction.
  • Laser light source, 22 and 23 are dichroic mirrors
  • 24 is an objective lens (100x, NA: 1.3) 5)
  • 26 is a CCD camera
  • 27 is a monitor
  • 31 is a cover glass
  • 32 is a photocurable resin
  • 33 is a stage.
  • an ultraviolet laser pulse (wavelength 355 nm, pulse width 0.5 ns) focused on the photocurable resin 32 dropped on the cover glass 31 by the objective lens 24 (curing reaction induction laser)
  • light (dotted line) is irradiated, photocuring occurs at the condensing position of the curing reaction-inducing ultraviolet laser light from the light intensity that reaches the threshold value of the photocuring reaction, as shown in Fig. 4 (a).
  • continuous irradiation near-infrared laser light (wavelength 1064nm) (reaction promoting laser light) (solid line) (solid line) is also focused and irradiated together with ultraviolet laser light for curing reaction induction (dotted line)
  • the photo-curing reaction could be induced even with the UV laser light intensity for curing reaction induction that was so weak that the photo-curing reaction did not occur when only the curing reaction-inducing ultraviolet laser light (dotted line) was irradiated. . It was found that the photo-curing reaction with the intensity below the threshold value was not induced by irradiation with the curing reaction-inducing ultraviolet laser beam alone or the reaction promoting near-infrared laser beam alone.
  • FIG. 2 and FIG. 4 show that the present invention can impart space selectivity to the photopolymerization reaction.
  • FIG. 5 is a diagram showing a columnar microstructure manufactured according to the present invention.
  • a curing reaction-inducing ultraviolet laser beam and a reaction promoting near-infrared laser beam are used.
  • the columnar microstructures 41 produced have a reduced level of excess growth in the horizontal and optical axis directions compared to the columnar microstructures 42 produced using only the curing reaction-inducing ultraviolet laser beam, and the molding accuracy is remarkably improved. It can be confirmed that there is an improvement.
  • Nano-level three-dimensional spatial selectivity can be provided.
  • the multi-beam microstructure optical modeling method and apparatus using the different wavelength laser beam of the present invention can be expected to be used for manufacturing various micro devices (chemical chip, biochip, micromachine, etc.).

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

La présente invention concerne un procédé et un dispositif de lithographie laser multifaisceaux pour la réalisation de microstructures, employant des rayons laser de longueurs d'onde différentes. Ce procédé et ce dispositif permettent d'obtenir une sélectivité spatiale tridimensionnelle à l'échelle nano non seulement au moyen d'un faisceau laser servant à induire une réaction de durcissement mais aussi au moyen d'un faisceau servant à accélérer la réaction, ayant une longueur d'onde différente de celle du faisceau laser servant à induire la réaction de durcissement. Une réaction de photodurcissement peut être induite seulement en un point focalisé ou à proximité de ce dernier par exposition dudit point à un faisceau laser (5) afin d'accélérer la réaction de sorte qu'une résine est exposée à un faisceau laser (4) servant à induire la réaction de durcissement avec une intensité extrêmement faible afin de ne pas induire la réaction de photodurcissement.
PCT/JP2005/007012 2005-04-11 2005-04-11 Procede et dispositif de lithographie laser multifaisceaux pour realisation de microstructures, employant des faisceaux laser de longueurs d'onde differentes Ceased WO2006109355A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/007012 WO2006109355A1 (fr) 2005-04-11 2005-04-11 Procede et dispositif de lithographie laser multifaisceaux pour realisation de microstructures, employant des faisceaux laser de longueurs d'onde differentes

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PCT/JP2005/007012 WO2006109355A1 (fr) 2005-04-11 2005-04-11 Procede et dispositif de lithographie laser multifaisceaux pour realisation de microstructures, employant des faisceaux laser de longueurs d'onde differentes

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011141521A1 (fr) * 2010-05-11 2011-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif et procédé de production de structures tridimensionnelles
CN102649314A (zh) * 2011-02-25 2012-08-29 光刻设备有限公司 用于向光敏物质中空间分辨地输入电磁辐射的强度图案的方法和装置及其应用
WO2020126154A1 (fr) * 2018-12-17 2020-06-25 Karlsruher Institut für Technologie Lithographie 3d parallélisée par polymérisation induite par la lumière multicolore et multifaisceaux
US11179926B2 (en) 2016-12-15 2021-11-23 General Electric Company Hybridized light sources
US11731367B2 (en) 2021-06-23 2023-08-22 General Electric Company Drive system for additive manufacturing
US11813799B2 (en) 2021-09-01 2023-11-14 General Electric Company Control systems and methods for additive manufacturing
US11826950B2 (en) 2021-07-09 2023-11-28 General Electric Company Resin management system for additive manufacturing
CN117330181A (zh) * 2023-12-01 2024-01-02 中国工程物理研究院应用电子学研究所 基于超表面的多通道多功能激光光束质量检测系统
US11951679B2 (en) 2021-06-16 2024-04-09 General Electric Company Additive manufacturing system
US11958249B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11958250B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US12285908B2 (en) 2020-11-20 2025-04-29 General Electric Company Foil interaction device for additive manufacturing
US12296535B2 (en) 2021-08-24 2025-05-13 General Electric Company Attachment structure for additive manufacturing
US12370741B2 (en) 2021-08-13 2025-07-29 General Electric Company Material deposition assembly for additive manufacturing
US12403654B2 (en) 2022-09-30 2025-09-02 General Electric Company Systems and methods for additive manufacturing
US12409604B2 (en) 2022-03-23 2025-09-09 General Electric Company Systems and methods for additive manufacturing
US12434436B2 (en) 2021-02-26 2025-10-07 General Electric Company Accumalator assembly for additive manufacturing
US12589549B2 (en) 2021-04-27 2026-03-31 General Electric Company Systems and methods for additive manufacturing
US12629888B2 (en) 2023-06-28 2026-05-19 General Electric Company Systems and methods for additive manufacturing

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JPH0355224A (ja) * 1989-07-24 1991-03-11 Matsushita Electric Works Ltd 三次元形状の形成方法
JPH0491928A (ja) * 1990-08-06 1992-03-25 Fujitsu Ltd 立体形状物の形成方法
JP2003001599A (ja) * 2001-06-25 2003-01-08 Japan Science & Technology Corp 三次元微小構造物の製造方法及びその装置

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JPH0355224A (ja) * 1989-07-24 1991-03-11 Matsushita Electric Works Ltd 三次元形状の形成方法
JPH0491928A (ja) * 1990-08-06 1992-03-25 Fujitsu Ltd 立体形状物の形成方法
JP2003001599A (ja) * 2001-06-25 2003-01-08 Japan Science & Technology Corp 三次元微小構造物の製造方法及びその装置

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011141521A1 (fr) * 2010-05-11 2011-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif et procédé de production de structures tridimensionnelles
US20130056910A1 (en) * 2010-05-11 2013-03-07 Fraunhofer-Gesellschaft Zur Foederung Der Angewandten Forschung E. V. Device and method for producing three-dimensional structures
EP3225383A1 (fr) * 2010-05-11 2017-10-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif et procédé de production de structures tridimensionnelles
CN102649314A (zh) * 2011-02-25 2012-08-29 光刻设备有限公司 用于向光敏物质中空间分辨地输入电磁辐射的强度图案的方法和装置及其应用
CN102649314B (zh) * 2011-02-25 2016-01-20 光刻设备有限公司 用于向光敏物质中空间分辨地输入电磁辐射的强度图案的方法和装置及其应用
US11179926B2 (en) 2016-12-15 2021-11-23 General Electric Company Hybridized light sources
WO2020126154A1 (fr) * 2018-12-17 2020-06-25 Karlsruher Institut für Technologie Lithographie 3d parallélisée par polymérisation induite par la lumière multicolore et multifaisceaux
US11999098B2 (en) 2018-12-17 2024-06-04 Karlsruher Institut für Technologie Parallelized 3D lithography using multi-beam, multi-color light-induced polymerization
US12285908B2 (en) 2020-11-20 2025-04-29 General Electric Company Foil interaction device for additive manufacturing
US12434436B2 (en) 2021-02-26 2025-10-07 General Electric Company Accumalator assembly for additive manufacturing
US12589549B2 (en) 2021-04-27 2026-03-31 General Electric Company Systems and methods for additive manufacturing
US11951679B2 (en) 2021-06-16 2024-04-09 General Electric Company Additive manufacturing system
US11731367B2 (en) 2021-06-23 2023-08-22 General Electric Company Drive system for additive manufacturing
US11958249B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11958250B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US12521942B2 (en) 2021-06-24 2026-01-13 General Electric Company Reclamation system for additive manufacturing
US12447682B2 (en) 2021-06-24 2025-10-21 General Electric Company Reclamation system for additive manufacturing
US11826950B2 (en) 2021-07-09 2023-11-28 General Electric Company Resin management system for additive manufacturing
US12390986B2 (en) 2021-07-09 2025-08-19 General Electric Company Resin management system for additive manufacturing
US12370741B2 (en) 2021-08-13 2025-07-29 General Electric Company Material deposition assembly for additive manufacturing
US12296535B2 (en) 2021-08-24 2025-05-13 General Electric Company Attachment structure for additive manufacturing
US11813799B2 (en) 2021-09-01 2023-11-14 General Electric Company Control systems and methods for additive manufacturing
US12409604B2 (en) 2022-03-23 2025-09-09 General Electric Company Systems and methods for additive manufacturing
US12403654B2 (en) 2022-09-30 2025-09-02 General Electric Company Systems and methods for additive manufacturing
US12629888B2 (en) 2023-06-28 2026-05-19 General Electric Company Systems and methods for additive manufacturing
CN117330181B (zh) * 2023-12-01 2024-02-27 中国工程物理研究院应用电子学研究所 基于超表面的多通道多功能激光光束质量检测系统
CN117330181A (zh) * 2023-12-01 2024-01-02 中国工程物理研究院应用电子学研究所 基于超表面的多通道多功能激光光束质量检测系统

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