WO2006125375A1 - Lampe a groupe de diodes electroluminescentes - Google Patents

Lampe a groupe de diodes electroluminescentes Download PDF

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Publication number
WO2006125375A1
WO2006125375A1 PCT/CN2006/001023 CN2006001023W WO2006125375A1 WO 2006125375 A1 WO2006125375 A1 WO 2006125375A1 CN 2006001023 W CN2006001023 W CN 2006001023W WO 2006125375 A1 WO2006125375 A1 WO 2006125375A1
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WIPO (PCT)
Prior art keywords
module
light
light emitting
diode
led
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Application number
PCT/CN2006/001023
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English (en)
French (fr)
Inventor
Jen-Shyan Chen
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Individual
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Individual
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Application filed by Individual filed Critical Individual
Priority to EP06741911A priority Critical patent/EP1933085A4/en
Priority to US11/921,177 priority patent/US7722217B2/en
Priority to JP2008512672A priority patent/JP4805347B2/ja
Priority to CA2610026A priority patent/CA2610026C/en
Publication of WO2006125375A1 publication Critical patent/WO2006125375A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers

Definitions

  • the present invention relates to a light-emitting diode cluster lamp, and in particular, the light-emitting diode cluster lamp of the present invention is a high-intensity lighting device. Background technique
  • LEDs light emitting diodes
  • shock resistance shock resistance
  • fast response fast response
  • mass production the current lighting products using light-emitting diodes as a light source are becoming more and more widespread.
  • the existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require a good heat dissipation mechanism.
  • Figure 1A shows an external view of a conventional illuminator incorporating an integrated heat sink.
  • Figure 1B shows a side view of the illuminator of the prior integrated heat sink.
  • the control circuit 24 is used to control the LEDs 22.
  • the heat conducting plate 26 under the control circuit 24 is used to help the LEDs 22 and the control circuit 24 to dissipate heat.
  • a plurality of heat radiating fins 28 are provided around the heat conducting plate 26.
  • a disadvantage of the illuminator shown in Figures 1A and 1B is that the control circuit 24 is too close to the LEDs 12. When the light-emitting diodes 22 generate thermal energy, it is extremely easy to affect or even destroy the operation of the control circuit 24.
  • the present invention provides a light-emitting diode cluster bulb which, in addition to effectively solving the heat dissipation problems of the prior art, also provides a high-intensity illuminating effect. Summary of the invention
  • the invention provides an LED cluster bulb.
  • the LED cluster bulb according to the present invention comprises a plurality of Light-emitting diode packages, a control circuit module
  • the plurality of diode bulb assemblies include a heat conducting/dissipating module and an emitting diode module.
  • the heat conducting/dissipating module includes a heat conducting device and at least one heat sink fin. Heat-dissipating fin.
  • the heat conducting device has a flat portion.
  • the at least one heat sink fin is provided.
  • the LED module is disposed on the flat portion of the heat conducting device and is smoothly and tightly engaged with the flat portion.
  • the LED module packages a plurality of LEDs or laser diodes together, so each diode bulb assembly provides a luminous effect equivalent to a point source.
  • the control circuit module is configured to control the diode bulb assembly.
  • the housing fits to accommodate the diode bulb assembly and the control circuit module.
  • the control circuit module controls the light emitting diode modules to selectively illuminate the light emitting diode modules when the light emitting diode cluster bulb is connected to a power source. And the heat generated by one of the light emitting diode modules when the light emitting diode module is emitted is guided by the heat conducting device corresponding to the light emitting diode module from the flat portion of the light emitting diode module to the at least one heat dissipating fin, thereby At least one heat sink fin dissipates heat.
  • the LED cluster bulb provided by the present invention integrates the heat conduction/heat dissipation module and the LED module.
  • the heat dissipation/heat dissipation module can directly dissipate the heat generated by the LED module to the surrounding air by using the heat dissipation fins, thereby greatly improving the heat dissipation efficiency. Therefore, the diode bulb according to the present invention is more suitable for use in an illumination device requiring a high efficiency light emitting diode compared to the prior art.
  • the LED cluster bulb of the present invention integrates a plurality of diode bulb assemblies corresponding to point sources to provide high intensity illumination.
  • the LED cluster bulb of the present invention can be widely integrated into a diode lamp in an existing lighting device, and the casing can be designed to match the size of an existing cylindrical battery or square battery. Therefore, the diode bulb according to the present invention is quite easy to integrate with an existing power supply unit.
  • Fig. 1A shows an external view of a conventional illuminator incorporating a heat sink.
  • Figure 1B shows a side view of a conventional illuminator incorporating a heat sink.
  • Figure 2 shows an external view of a light-emitting diode cluster bulb in accordance with the present invention.
  • Fig. 3 is a cross-sectional view taken along line L-L of Fig. 2 showing a light-emitting diode cluster bulb according to the present invention.
  • Figure 4 shows an exploded perspective view of a light emitting diode cluster bulb in accordance with the present invention.
  • FIG. 5A and 5B illustrate various embodiments of a light emitting diode cluster bulb in accordance with the present invention.
  • Figure 6 illustrates the heat conduction and heat dissipation mechanisms in a heat conduction/heat dissipation module in a light emitting diode cluster bulb in accordance with the present invention.
  • LED cluster bulb 122 Thermal / thermal module
  • Diode bulb assembly 124 LED module
  • Control circuit module 1222 Heat transfer unit
  • FIG. 2 is a perspective view of a light-emitting diode cluster bulb in accordance with the present invention.
  • Fig. 3 is a sectional view taken along line L-L of Fig. 1.
  • the LED cluster bulb 1 according to the present invention includes a plurality of light-emitting diode packages 12, a control circuit module 14, and a casing 16.
  • the plurality of diode bulbs are arranged in an Array form.
  • the plurality of diode bulb assemblies 12 includes a heat conducting/dissipating module 122 and an emitting diode module 124.
  • the heat conduction/heat dissipation module 122 includes a heat conducting device 1222 and at least one heat-dissipating fin 1224.
  • the at least one heat dissipation fin 1224 is disposed around a heat conducting device 1222.
  • the heat conducting device 1222 has a flat portion.
  • the LED module 124 is disposed on the flat portion of the heat conducting device 1222 and is evenly and tightly engaged with the flat portion.
  • the LED module 124 encloses a plurality of LEDs or laser diodes together, so that each diode bulb assembly provides illumination equivalent to a point source.
  • the control circuit module 14 is used to control the diode bulb assemblies 12.
  • the housing 16 cooperates to accommodate the diode bulb assembly 12 and the control circuit module 14.
  • the control circuit module 14 controls the LED modules 124 to selectively illuminate the LED modules 124. And the heat generated by one of the LED modules 124 in the light-emitting diode module is guided by the flat portion of the heat-conducting device 12 22 corresponding to the LED module 1 24 from itself.
  • the heat sink fins 1224 are further radiated by the at least one heat sink fin 1224.
  • control circuit module 14 since there is a distance between the control circuit module 14 and the LED modules 124 in accordance with the present invention, the control circuit module 14 can be prevented from being directly affected by the thermal energy generated by the LED modules 124.
  • FIG 4 shows an exploded perspective view of the LED cluster bulb of Figure 2 in accordance with the present invention. According to this figure, the connection between modules can be seen in more detail.
  • the LED cluster bulb of the present invention may also be arranged in a plurality of light emitting diodes in the form of a column.
  • Figures 5A and 5B illustrate other embodiments of LED cluster bulbs in accordance with the present invention.
  • the heat conducting device is a heat pipe, a heat column or a column formed of a material having a high thermal conductivity. See Figure 6.
  • Figure 6 shows the heat transfer and heat dissipation mechanisms in the heat transfer/heat dissipation module 122.
  • the heat transfer device 1222 in the heat/heat dissipation module 122 internally includes a capillary structure 12A and a working fluid 12B. When the LED module 124 generates heat, the working fluid 12B in the heat conducting device 1222 that is closer to the LED module 124 is evaporated from the liquid into a gas.
  • the vaporized working fluid 12B transfers heat to the other end of the heat conducting device 1222, and the working fluid 12B cooled by the heat radiating fins 1224 is again condensed into a liquid.
  • the capillary tissue 12A is used to transfer the working fluid 12B that is recondensed into a liquid back to the end of the heat conducting device 1222 that is closer to the LED module 124.
  • the heat conduction and heat dissipation effects can be achieved by the circulation method as shown in Fig. 5.
  • the power source connected to the LED cluster bulb can be a DC power source or an AC power source.
  • the control circuit module further includes an AC toto-DC converter that converts the AC power to DC power for use by the LED cluster bulb.
  • each of the light emitting diode modules of the light emitting diode cluster bulb of the present invention comprises a substrate made of a semiconductor material or a ceramic material, a two electrode (Electrode), and a light emitting module.
  • the light emitting module and the electrode system are respectively disposed on the substrate.
  • the light emitting modules are respectively connected to the control circuit module through the two electrodes.
  • each of the light emitting diode modules includes a light emitting module and two electrodes, and the light emitting module and the two electrodes are directly disposed on a flat portion of the heat conducting device corresponding to the light emitting diode module. And an insulator exists between the two electrodes and the heat conducting device.
  • the light emitting module includes at least one light emitting diode (LED) or a laser diode.
  • the light emitting diode in the light emitting module may be a white light diode or a white light diode composed of a blue light diode and a phosphor.
  • the light emitting module may also include at least one red light diode, at least one blue light diode, and at least one green light diode; the control circuit module selectively illuminates the red light diode, the blue light diode, and the green light diode to make the different colors
  • the light-emitting diodes form light of various colors in different light-emitting ratios.
  • each of the LED assemblies encapsulates a plurality of LEDs together, the volume of the illumination module relative to the concave mirror or the entire diode bulb cooperating with the illumination module is relatively small, and therefore each A light-emitting diode assembly provides illumination equivalent to a point source.
  • the LED cluster bulb provided by the invention can be arranged in a matrix or a row to form high-intensity and high-brightness illumination.
  • the LED cluster bulb provided by the present invention integrates the heat conduction/heat dissipation module and the LED module.
  • the heat-dissipating/heat-dissipating module can directly dissipate the heat generated by the light-emitting diode module into the surrounding air by the heat-dissipating fins, thereby greatly improving the heat-dissipating efficiency.
  • the problem of the efficiency of the LED due to overheating is solved. Therefore, the luminous efficiency of the light-emitting diode cluster bulb according to the present invention is also improved as compared with the prior art.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

发光二极管群集灯泡 技术领域
本发明关于一种发光二极管群集灯泡 (Light-emitting diode cluster lamp), 并且特别地， 本发明的发光二极管群集灯泡为一高强度的照明装置。 背景技术
由于发光二极管 (Light emitting diode, LED)具有如省电、 耐震、 反应快 以及适合量产等许多优点， 因此目前以发光二极管为光源的照明产品日益广 泛。 然而， 现有的高功率的发光二极管在持续发亮一段时间后， 会有温度过 高的问题，使得发光二极管本身的发光效率下降，造成亮度无法提升。 因此， 各种应用高功率的发光二极管的产品均需要良好的散热机制。
请参阅图 1A及图 1B。 图 1A示出一现有的整合散热装置的照明器的外 观视图。 图 1B示出该现有的整合散热装置的照明器的侧视示意图。 为了增 加单一照明装置所能提供的光线强度， 图中的多个发光二极管 22设置在一 控制电路 24之上。 控制电路 24用以控制该等发光二极管 22, 在控制电路 24之下的导热板 26则是用以帮助该等发光二极管 22和控制电路 24散热。 导热板 26的周围则设有多个散热鰭片 28。如图 1A以及图 1B所示的照明器 的缺点为， 控制电路 24与该等发光二极管 12太过接近。 当该等发光二极管 22产生热能时， 极容易影响甚至破坏控制电路 24的运作。
因此， 本发明提供一种发光二极管群集灯泡， 除了可有效解决先前技术 中的散热问题外， 亦提供高强度的发光效果。 发明内容
本发明提供一种发光二极管群集灯泡。根据本发明的发光二极管群集灯 泡包括多个二极管灯泡构装 (Light-emitting diode package), 一控制电路模块
(Control circuit module)以及一夕卜壳 (Casing)。
该 多 个二极管 灯泡构 装 包括一导热 /散热模块（Heat conducting/dissipating module)与一发光二极管模块 (Emitting diode module)„ 该导热 /散热模块包括一导热装置 (Heat conducting device)以及至少一散热鳍 片（Heat-dissipating fin)。 该导热装置具有一平坦部。 该至少一散热鳍片设置 于该导热装置的一周围。 该发光二极管模块设置于该导热装置的该平坦部， 并与该平坦部平整且紧密地接合。该发光二极管模块将多颗发光二极管或激 光二极管封装在一起， 因此每一个二极管灯泡构装可提供相当于点光源的发 光效果。 该控制电路模块用以控制该等二极管灯泡构装。 该外壳配合能容纳 该等二极管灯泡构装以及该控制电路模块。
当该发光二极管群集灯泡连接至一电源时 ,该控制电路模块控制该等发 光二极管模块， 选择性地使该等发光二极管模块发光。 并且该等发光二极管 模块中的一个发光二极管模块于发光时所产生的热由对应该个发光二极管 模块的该导热装置自其本身的该平坦部导引至该至少一散热鳍片，进而由该 至少一散热鳍片散热。
本发明所提供的发光二极管群集灯泡将导热 /散热模块与发光二极管模 块整合在一起。该导热 /散热模块可借由各散热鳍片将该发光二极管模块所产 生的热能立即发散至周围的空气中， 大幅提升散热效率。 因此， 相较于先前 技术，根据本发明的二极管灯泡更适合应用于需要高效率的发光二极管的照 明装置中。 并且， 本发明的发光二极管群集灯泡系整合多个相当于点光源的 二极管灯泡构装， 能提供高强度的照明。
本发明的发光二极管群集灯泡能广泛整合于现有的照明设备中的二极 管灯泡， 该外壳可被设计为与现有的圆柱型电池或方型电池尺寸相搭配。 因 此， 根据本发明的二极管灯泡相当容易与现有的电源装置整合在一起。
关于本发明的优点与精神可以由以下的发明详述及所附图得到进一步 的了解。 附图说明
图 1 A示出一现有的整合散热装置的照明器的外观视图。
图 1B示出一现有的整合散热装置的照明器的侧视示意图。
图 2示出根据本发明的发光二极管群集灯泡的外观视图。
图 3示出沿图 2中 L-L线的剖面图，显示根据本发明的发光二极管群集 灯泡。
图 4示出根据本发明的发光二极管群集灯泡的分解透视图。
图 5A以及图 5B示出根据本发明的发光二极管群集灯泡的多种实施方 式。 图 6示出根据本发明的发光二极管群集灯泡中的导热 /散热模块中的导 热及散热机制。
主要组件符号说明
22: 发光二极管 24: 控制电路
26: 导热板 28: 散热鰭片
1 : 发光二极管群集灯泡 122: 导热 /散热模块
12 二极管灯泡构装 124: 发光二极管模块
14 控制电路模块 1222: 导热装置
16 外壳 1224: 散热鰭片
12A: 毛细组织 12B: 工作流体 具体实施方式
请参阅图 2及图 3， 图 2为根据本发明的发光二极管群集灯泡的外观视 图。 图 3示出沿图 1中 L-L线的剖面图。 根据本发明的发光二极管群集灯泡 1包括多个二极管灯泡构装 (Light-emitting diode package)12,一控制电路模块 (Control circuit module)14以及一外壳 (Casing)l 6。 在本实施例中， 该多个二 极管灯泡构装排列成一矩阵 (Array)的形式。
该多 个二极管灯泡构装 12 包括一导热 /散热模块（Heat conducting/dissipating module) 122 与一发光二极管模块 (Emitting diode module)124。 该导热 /散热模块 122 包括一导热装置（Heat conducting device) 1222以及至少一散热鳍片 1224(Heat-dissipating fin)。该至少一散热鳍 片 1224设置于该导热装置 1222的一周围。该导热装置 1222具有一平坦部。 该发光二极管模块 124设置于该导热装置 1222的该平坦部， 并与该平坦部 平整且紧密地接合。该发光二极管模块 124将多颗发光二极管或激光二极管 封装在一起， 因此每一个二极管灯泡构装可提供相当于点光源的发光效果。 该控制电路模块 14用以控制该等二极管灯泡构装 12。该外壳 16配合能容纳 该等二极管灯泡构装 12以及该控制电路模块 14。
当该发光二极管群集灯泡 1连接至一电源时， 该控制电路模块 14控制 该等发光二极管模块 124, 选择性地使该等发光二极管模块 124发光。 并且 该等发光二极管模块 124中的一个发光二极管模块 124在发光时所产生的热 由对应该个发光二极管模块 124的该导热装置 1222 自其本身的该平坦部导 引至该至少一散热鳍片 1224, 进而由该至少一散热鳍片 1224散热。
如图 3所示， 由于根据本发明中的的控制电路模块 14与该等发光二极 管模块 124之间有一段距离， 可避免控制电路模块 14直接受到该等发光二 极管模块 124所产生的热能影响。
图 4示出图 2的根据本发明的发光二极管群集灯泡的分解透视图。根据 此图， 可更详细看出各模块间的连结方式。 本发明的发光二极管群集灯泡亦 可以将多个发光二极管构装排列成一行 (Column)的形式。 请参阅图 5A以及 图 5B, 图 5A以及图 5B示出根据本发明的发光二极管群集灯泡的其它实施 方式。
于实际应用中， 该导热装置为一热导管 (Heat pipe)、 一热导柱 (Heat column)或由一高导热系数的材料所成形的柱体。 请参阅图 6。 图 6示出导热 /散热模块 122中的导热及散热机制。该导热 /散热模块 122中的导热装置 1222 内部包括毛细组织 12A以及工作流体 12B。当该发光二极管模块 124产生热 时， 会使导热装置 1222中较靠近发光二极管模块 124的工作流体 12B由液 体蒸发为气体。气化后的工作流体 12B可将热传至导热装置 1222的另一端， 经散热鳍片 1224散热冷却后的工作流体 12B会再度凝结为液体。 毛细組织 12A用以将再度凝结为液体的工作流体 12B传送回导热装置 1222中较靠近 发光二极管模块 124的一端。 借由如图 5所示的循环方式， 可达到导热及散 热效果。
根据本发明， 与该发光二极管群集灯泡连接的电源可为直流电源， 亦可 为交流电源。 当该电源为交流电源时， 控制电路模块进一步包括一交流至直 流 (AC-to-DC)转换器， 将交流电转换为直流电后供该发光二极管群集灯泡使 用。
在一实施例中，本发明的发光二极管群集灯泡中的每一个发光二极管模 块包括一由半导体材料或陶瓷材料所制成的基材（Substrate) , 两电极 (Electrode)以及一发光模块。 发光模块与电极系分别设置于基材之上。 发光 模块分别透过该两电极连接至控制电路模块。
于另一实施例中，发光二极管模块中的每一个发光二极管模块均包括一 发光模块以及两电极， 该发光模块与两电极直接被设置于对应该个发光二极 管模块的导热装置的平坦部之上， 并且该两电极与该导热装置之间存在一绝 缘体。 于实际应用中， 发光模块包括至少一发光二极管 (Light emitting diode, LED)或激光二极管 (Laser diode)。 发光模块中的发光二极管可能为一白光二 极管， 或是由一蓝光二极管与荧光粉所组成的白光二极管。 发光模块亦可能 包括至少一红光二极管、 至少一蓝光二极管以及至少一绿光二极管； 控制电 路模块可选择性地使该红光二极管、 该蓝光二极管以及该绿光二极管发光， 使得该等不同颜色的发光二极管以不同的发光比例组成各种不同颜色的光 线。
才艮据本发明的发光二极管群集灯泡中，由于每一个发光二极管构装将多 颗发光二极管封装在一起，发光模块相对于与发光模块配合的凹面镜或整个 二极管灯泡的体积相当小， 因此每一个发光二极管构装可提供相当于点光源 的发光效果。 本发明所提供的发光二极管群集灯泡， 群集多个发光二极管构 装排列成一矩阵或一行的形式， 即可提供高强度高亮度的照明。
同时， 由于本发明所提供的发光二极管群集灯泡系将导热 /散热模块与 发光二极管模块整合在一起。该导热 /散热模块可借由散热鳍片将该发光二极 管模块所产生的热能立即发散至周围的空气中， 因此大幅提升散热效率。 借 着散热效率的改善， 解决了因过热造成发光二极管效率下降的问题。 因此， 根据本发明的发光二极管群集灯泡的发光效率也较先前技术提升。
借由以上优选具体实施例的详述，希望能更加清楚描述本发明的特征与 相反地， 其目的是希望能涵盖各种改变及具相等性的安排于本发明的范畴 内。

Claims

权利要求书
1. 一种发光二极管群集灯泡， 包括：
多个二极管灯泡构装， 每一个发光二极管构装包括：
一导热 /散热模块， 该导热 /散热模块包括：
一导热装置， 该导热装置具有一平坦部； 以及
至少一散热鳍片， 该至少一散热鳍片设置于该导热装置的周围； 以及 一发光二极管模块， 该发光二极管模块设置于该导热装置的该平坦部； 以及
一控制电路模块， 该控制电路模块用以控制该等二极管灯泡构装； 其中当该发光二极管群集灯泡连接至一电源时，该控制电路模块控制该 等发光二极管模块， 选择性地使该等发光二极管模块发光， 并且该等发光二 极管模块中的一个发光二极管模块在发光时所产生的热由对应该个发光二 极管模块的该导热装置自其本身的该平坦部导引至该至少一散热鳍片，进而 由该至少一散热鳍片散热。
2.根据权利要求 1 所述的发光二极管群集灯泡， 进一步包括一外壳， 该外壳配合能容纳该等二极管灯泡构装以及该控制电路模块。
3.根据权利要求 1所述的发光二极管群集灯泡， 其中该等导热 /散热模 块中的每一个导热装置为一热导管、一热导柱或由一高导热系数的材料所成 形的柱体。
4.根据权利要求 1 所述的发光二极管群集灯泡， 其中该等发光二极管 模块中的每一个发光二极管模块均包括一基材、 一发光模块以及两电极， 该 发光模块以及该两电极分别设置于该基材上。
5.根据权利要求 1 所述的发光二极管群集灯泡， 其中该等发光二极管 模块中的每一个发光二极管模块均包括一发光模块以及两电极，该发光模块 以及该两电极分别安置于对应该个发光二极管模块的该导热装置的平坦部 上， 并且该两电极与该导热装置之间存在一绝缘体。
6.根据权利要求 4所述的发光二极管群集灯泡， 其中每一个发光二极 管模块的该发光模块包括至少一发光二极管或至少一激光二极管。
7.根据权利要求 6所述的发光二极管群集灯泡， 其中该发光模块中的 发光二极管为一白光二极管。
8.根据权利要求 7所述的发光二极管群集灯泡， 其中该白光二极管包 括一蓝光二极管与一荧光粉。
9. 根据权利要求 4所述的发光二极管群集灯泡， 其中每一个发光二极 管模块的该发光模块均包括至少一红光二极管、至少一蓝光二极管以及至少 一绿光二极管。
10.根据权利要求 9所述的发光二极管群集灯泡， 其中该控制电路模块 系选择性地使每一个发光模块中的该至少一红光二极管、该至少一蓝光二极 管以及该至少一绿光二极管发光。
11.根据权利要求 1所述的发光二极管群集灯泡， 其中该电源为交流电 源 , 并且该控制电路模块进一步包括一交流至直流转换器。
12.根据权利要求 1所述的发光二极管群集灯泡， 其中该多个发光二极 管构装排列成一矩阵的形式。
13.根据权利要求 1所述的发光二极管群集灯泡， 其中该多个发光二极 管构装排列成一行的形式。
PCT/CN2006/001023 2005-05-25 2006-05-18 Lampe a groupe de diodes electroluminescentes Ceased WO2006125375A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090249625A1 (en) * 2008-04-02 2009-10-08 Advanced Optoelectronic Technology, Inc. Method for jointing a semiconductor element and a heat pipe
JP2010009814A (ja) * 2008-06-25 2010-01-14 Eye Lighting Syst Corp Ｌｅｄ照明器具

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1873448B1 (en) 2005-03-31 2010-10-20 NeoBulb Technologies, Inc. A high power led illuminating equipment having high thermal diffusivity
CN100565950C (zh) * 2005-10-20 2009-12-02 昭和电工株式会社 发光装置安装基片、发光装置安装组件和平面光源装置
US20090225541A1 (en) * 2005-10-20 2009-09-10 Showa Denko K.K. Luminous device mounting substrate, luminous device mounting package, and planar light source device
WO2008131584A1 (en) * 2007-04-27 2008-11-06 Jenshyan Chen Light emitting diode lighting device
CN101430081B (zh) * 2007-11-06 2011-11-09 金松山 栅栏型led照明灯具
CN101532646B (zh) * 2008-03-14 2012-06-13 富准精密工业(深圳)有限公司 照明装置
CN101539275A (zh) * 2008-03-19 2009-09-23 富准精密工业(深圳)有限公司 照明装置及其光引擎
CN101566316B (zh) * 2008-04-23 2012-03-14 富准精密工业(深圳)有限公司 发光二极管灯具
KR100982046B1 (ko) * 2008-05-14 2010-09-14 유트로닉스주식회사 Ｌｅｄ 어레이 모듈의 방열 구조
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
TW201022582A (en) * 2008-12-12 2010-06-16 Foxconn Tech Co Ltd Illuminating apparatus and light engine thereof
JP2011509533A (ja) * 2009-01-06 2011-03-24 ネオバルブ テクノロジーズ，インコーポレイテッド エネルギー変換装置及びエネルギー変換機器
TWM362362U (en) * 2009-03-06 2009-08-01 Acpa Energy Conversion Devices Co Ltd Heat conduction structure for heating element
US8188685B1 (en) 2009-06-10 2012-05-29 Johnston John F Light-generating system
TW201109581A (en) * 2009-09-07 2011-03-16 Thermoshuttle Co Ltd LED road light module
US20110090669A1 (en) * 2009-10-20 2011-04-21 Tsung-Ting Sun Led lighting device and light source module for the same
DE102009044388A1 (de) 2009-11-02 2011-05-05 Semperlux Aktiengesellschaft - Lichttechnische Werke - Außenleuchte und Hochdrucklampenersatz
JP2012015082A (ja) * 2010-07-05 2012-01-19 Neobulb Technologies Inc 発光ダイオード照明プラットホーム
EP2405194A1 (en) * 2010-07-05 2012-01-11 NeoBulb Technologies, Inc. Light-emitting diode illumination platform
KR20120080022A (ko) * 2011-01-06 2012-07-16 삼성엘이디 주식회사 조명 장치
KR101282128B1 (ko) * 2011-11-30 2013-07-04 주식회사 삼진엘앤디 리플렉터를 포함한 ｌｅｄ 램프
KR101286301B1 (ko) 2012-02-01 2013-07-19 주식회사 제코스 소켓 타입의 엘이디 램프
USD715479S1 (en) 2012-10-26 2014-10-14 John F. JOHNSTON Light-generating system
JP5673705B2 (ja) * 2013-02-27 2015-02-18 三菱電機株式会社 照明装置
JP6340753B2 (ja) * 2013-03-18 2018-06-13 三菱電機株式会社 発光装置
KR101478989B1 (ko) * 2013-06-19 2015-01-05 (주)퓨쳐 라이팅 엘이디 등기구
KR101474994B1 (ko) * 2013-09-09 2014-12-22 (주) 로하스티엠월드 Led 조명등기구
JP6539033B2 (ja) * 2014-02-04 2019-07-03 株式会社ルイファン・ジャパン 発光体
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
CN106287571A (zh) * 2015-05-30 2017-01-04 广州市夜太阳舞台灯光音响设备有限公司 光学透镜组件及具有该光学透镜组的灯具
CN106287400A (zh) * 2015-05-30 2017-01-04 广州市夜太阳舞台灯光音响设备有限公司 多个灯泡集成光斑的灯具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
CN2644878Y (zh) * 2003-08-14 2004-09-29 葛世潮 发光二极管灯
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
CN1680749A (zh) * 2004-04-08 2005-10-12 吴裕朝 发光二极管装置、发光二极管散热系统及含其的照明装置
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243441A (ja) * 1992-03-03 1993-09-21 Ito Gijutsu Kenkiyuushitsu:Kk 放熱装置
US20050279949A1 (en) * 1999-05-17 2005-12-22 Applera Corporation Temperature control for light-emitting diode stabilization
JP2002163907A (ja) * 2000-11-24 2002-06-07 Moriyama Sangyo Kk 照明システム及び照明ユニット
EP1393374B1 (en) * 2001-05-26 2016-08-24 GE Lighting Solutions, LLC High power led lamp for spot illumination
JP3668438B2 (ja) * 2001-06-07 2005-07-06 シャープ株式会社 チップ発光ダイオード
DE10216085A1 (de) * 2002-04-11 2003-11-06 Sill Franz Gmbh Farbwechselstrahler
US7048412B2 (en) * 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
JP2004354852A (ja) * 2003-05-30 2004-12-16 Natsume Kk 外部制御式管状発光具および電光表示装置
JP2005044699A (ja) * 2003-07-24 2005-02-17 Koito Mfg Co Ltd 車両用灯具及び光源モジュール
US7204607B2 (en) * 2003-09-16 2007-04-17 Matsushita Electric Industrial Co., Ltd. LED lamp
US7198386B2 (en) * 2003-09-17 2007-04-03 Integrated Illumination Systems, Inc. Versatile thermally advanced LED fixture
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
DE602005015778D1 (de) * 2005-01-11 2009-09-17 Neobulb Technologies Inc Beleuchtungseinrichtung mit Vorrichtung zur Wärmeableitung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
CN2644878Y (zh) * 2003-08-14 2004-09-29 葛世潮 发光二极管灯
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
CN1680749A (zh) * 2004-04-08 2005-10-12 吴裕朝 发光二极管装置、发光二极管散热系统及含其的照明装置
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
US20060092639A1 (en) * 2004-10-29 2006-05-04 Goldeneye, Inc. High brightness light emitting diode light source

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1933085A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090249625A1 (en) * 2008-04-02 2009-10-08 Advanced Optoelectronic Technology, Inc. Method for jointing a semiconductor element and a heat pipe
JP2010009814A (ja) * 2008-06-25 2010-01-14 Eye Lighting Syst Corp Ｌｅｄ照明器具

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