WO2006126761A1 - Pellicule adhesive pour semi-conducteur - Google Patents

Pellicule adhesive pour semi-conducteur Download PDF

Info

Publication number
WO2006126761A1
WO2006126761A1 PCT/KR2005/003636 KR2005003636W WO2006126761A1 WO 2006126761 A1 WO2006126761 A1 WO 2006126761A1 KR 2005003636 W KR2005003636 W KR 2005003636W WO 2006126761 A1 WO2006126761 A1 WO 2006126761A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive film
adhesive layer
semiconductor
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2005/003636
Other languages
English (en)
Inventor
Dong-Cheon Shin
Byoung-Un Kang
Tae-Hyun Sung
Jai-Hoon Kim
Kyung-Tae Wi
Joon-Mo Seo
Hyuk-Soo Moon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Cable and Systems Ltd
Original Assignee
LS Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050083481A external-priority patent/KR100642889B1/ko
Application filed by LS Cable Ltd filed Critical LS Cable Ltd
Priority to US11/915,280 priority Critical patent/US20090198013A1/en
Publication of WO2006126761A1 publication Critical patent/WO2006126761A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Definitions

  • the present invention relates to an adhesive film, and more specifically to an adhesive film for semiconductor used for adhering a die to a chip-mounting frame in a process of semiconductor packaging.
  • a semiconductor packaging process includes a wafer dicing process for cutting a wafer into units of semiconductor chips; a die adhesion process for adhering the cut semiconductor chips onto a chip-mounting frame, for example a lead frame or substrate such as a printed circuit board (PCB) or a tape wiring board, etc.; a wire adhesion process for electrically connecting the chip-mounting frame to the semiconductor chip; and a packaging process by a epoxy molding compound (EMC) for sealing the semiconductor chip and an adhesive wire.
  • a wafer dicing process for cutting a wafer into units of semiconductor chips
  • a die adhesion process for adhering the cut semiconductor chips onto a chip-mounting frame, for example a lead frame or substrate such as a printed circuit board (PCB) or a tape wiring board, etc.
  • PCB printed circuit board
  • a wire adhesion process for electrically connecting the chip-mounting frame to the semiconductor chip
  • EMC epoxy molding compound
  • An adhesive film or an adhesive has been used generally for carrying out bonds between various corresponding elements, for example a semiconductor chip and a substrate, a lead frame and a chip, and a chip and a chip in such a semiconductor packaging process.
  • reduction in weight, thickness, length and size, and high performance of electronic equipment are required in the semiconductor packaging process as a field of electronics/electrics continues to develop.
  • a more precisely controllable adhesive continues to be developed in order to facilitate contact between microcircuits, or between a micro-part and a microcircuit.
  • the conventional adhesives is a cause that bubbles are formed in the interface between an adhesive and a supporting member such as a lead frame, substrate or other chip etc., resulting in peeling of package interface due to thermal treatment upon mounting a chip.
  • a surface-mounting type which allows the high-density mounting depending on reduction in weight, thickness, length and size of electronic equipment, is mainly used increasingly, but the entire surface-mounting package should be heated because the lead is directly adhered to a printed circuit board in this surface-mounting package. At this time, the package may be cracked by its internal moisture evaporation because it is exposed to high temperature of 200 to 270 °C. That is to say, the moisture adsorbed into the adhesive film is vaporized at a mounting temperature, and then cracks are formed between the adhesive film and the supporting member due to pressure by evaporation.
  • the present invention is designed to solve the problems of the prior art, and it is an object of the present invention to provide an adhesive composition for an adhesive film in the field of semiconductor-packaging, which may prevent bubbles from being formed between an adhesive film and a supporting member by controlling surface tension in an optimum condition, and obtain reliability of semiconductor packaging by controlling tackiness and adhesive force in an optimum condition, and an adhesive film using same.
  • the present invention provides an adhesive film to be used in a semiconductor packaging, comprising an adhesive layer; wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 °C.
  • the adhesive layer may have tackiness of 50 to 400 gf/05.0 mm at 60
  • the adhesive layer may have adhesive force of at least 5 gf/cm .
  • the adhesive layer preferably includes at least one material selected from the group consisting of an epoxy-based resin, an organic filler, an inorganic filler and a curing agent, and further may include at least one modifier selected from the group consisting of a amino-based compound, a silane-based compound, an acrylic compound, metal organic salt, silicon oxide and titanium oxide.
  • FIG. 1 is a cross-sectional view showing an adhesive film according to a preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
  • Fig. 1 is a cross-sectional view showing an adhesive film according to a preferred embodiment of the present invention.
  • an adhesive film 100 includes a base film 110; an adhesive layer 120 adhered to one surface of the base film 110; and a protective film 111 adhered to the other surface of the adhesive layer 120.
  • the protective film 111 functions to protect the adhesive layer 120.
  • the base film 110 which maintains a basic form of the adhesive film, may preferably include polyethylene terephthalate (PET) or polyethylene- 2,6-naphthalenedicarboxylate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene- 2,6-naphthalenedicarboxylate
  • the protective film 111 which protects the adhesive layer from foreign substances, may preferably include polyethylene or polyethylene terephthalate (PET).
  • PET polyethylene or polyethylene terephthalate
  • the adhesive layer 120 is adhered between a die and a supporting member, for example a lead frame, a substrate or other dies after the base film 110 and the protective film 111 are removed.
  • An adhesive film 100 is laminated into the supporting member at a ranges of 60 to
  • surface tension of the adhesive layer 120 is set to surface tension of the supporting member, for example a range of 19 to 52 erg/cm 2 to give a smooth surface and good wetness of the supporting member.
  • tackiness of the adhesive layer 120 is set to 50 to 400 gf/05.0 mm. It is because that if the adhesive layer 120 has tackiness of less than 50 gf/05.0 mm, the supporting member and the adhesive film 100 may not be sufficiently adhered each other, causing formation of bubbles in their interface, and that if the adhesive layer 120 has tackiness of at least 400 gf/05.0 mm, it may have a disadvantage that a double- faced adhesive film is strongly adhered to and not detached from the equipment.
  • the adhesive layer 120 has adhesive force of at lease 5 gf/cm . If it has adhesive force of less than 5 gf/cm , it is difficult to obtain enough adhesive force to prevent bubbles being formed in surfaces of the adhesive layer 120 during the adhesion process.
  • a composition constituting the adhesive layer 120 may includes at least one material selected from the group consisting of an epoxy-based resin, an organic filler, a curing agent and an inorganic filler.
  • the epoxy-based resin may be preferably used by mixing a solid-phase epoxy resin and a liquid-phase epoxy resin.
  • bisphenol A, bisphenol F, a phenoxy resin or a cresol novolac resin may be also used.
  • Such epoxy resin may give a high adhesive strength, and has very low reaction shrinkage and no generation of volatile materials. Also it has excellent properties such as a mechanical property, an electric insulating property, water resistance, and thermal resistance.
  • the organic filler may include polyimide, polyamideimide, polyesterimide, nylon, or silicon resin etc.
  • the inorganic filler may include silica, aluminum nitride, or alumina etc.
  • the curing agent may include amines, anhydrides, or amides etc., and further include a latent curing agent and a curing agent with high melting point.
  • the adhesive layer may further include a metal filler to give an electro- conductive property.
  • a composition constituting the adhesive layer 120 preferably includes at least one modifier selected from the group consisting of a amino-based compound, a silane-based compound, an acrylic compound, metal organic salt, silicon oxide and titanium oxide. Such modifier may be added to adjust surface tension, tackiness, and adhesive force of the adhesive layer 120 in an optimum condition.
  • a solid-phase epoxy resin, a liquid-phase epoxy resin, an organic filler, an epoxy curing agent, a UV-curing agent and a UV-curing formulation were mixed in a constant ratio in Examples 1 to 3, and Comparative examples 1 and 2, and various modifiers were further added and mixed in Examples 1 to 3. Subsequently, each mixture was coated into a 50 D-thick polyester film in thickness about 25 D. Ratios of such compositions of Examples and Comparative examples are listed in Table 1 as follows.
  • compositional ratios of Examples and Comparative examples listed in the Table 1 the modifier, the epoxy curing agent, and the UV- curing agent were added in "part by weight", based on 100 % by weight of a solid-phase epoxy, a liquid-phase epoxy, an organic filler and a UV-curing formulation.
  • the adhesive film for semiconductor according to the present invention may be useful to prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition and also obtain higher reliability in use of the adhesive film in semiconductor packaging by controlling tackiness and adhesive force in an optimum condition.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L’invention concerne une pellicule adhésive pour semi-conducteur. La présente invention concerne une pellicule adhésive destinée aux semi-conducteurs utilisée dans l’emballage de semi-conducteurs, comprenant une couche adhésive, où ladite couche adhésive a une tension de surface de 19 à 52 erg/cm at 60 °C. En conséquence, ladite pellicule adhésive destinée aux semi-conducteurs de la présente invention peut empêcher la formation de bulles entre ladite pellicule adhésive et un organe de support en contrôlant la tension de surface de manière optimale, et également obtenir une fiabilité supérieure lors de l’utilisation de ladite pellicule adhésive dans l’emballage de semi-conducteurs en contrôlant le caractère collant et la force adhésive de manière optimale.
PCT/KR2005/003636 2005-02-25 2005-10-31 Pellicule adhesive pour semi-conducteur Ceased WO2006126761A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/915,280 US20090198013A1 (en) 2005-02-25 2005-10-31 Adhesive film for semiconductor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2005-0044218 2005-05-25
KR20050044218 2005-05-25
KR10-2005-0083481 2005-09-08
KR1020050083481A KR100642889B1 (ko) 2005-05-25 2005-09-08 반도체용 접착필름

Publications (1)

Publication Number Publication Date
WO2006126761A1 true WO2006126761A1 (fr) 2006-11-30

Family

ID=37452162

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2005/003636 Ceased WO2006126761A1 (fr) 2005-02-25 2005-10-31 Pellicule adhesive pour semi-conducteur

Country Status (1)

Country Link
WO (1) WO2006126761A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7585701B2 (en) * 2005-05-24 2009-09-08 Infineon Technologies Ag Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001035460A1 (fr) * 1999-11-10 2001-05-17 Hitachi Chemical Co., Ltd. Film adhesif pour semi-conducteur, grille de connexion et dispositif semi-conducteur comportant une telle grille et procede de fabrication dudit dispositif semi-conducteur
WO2003018703A1 (fr) * 2001-08-27 2003-03-06 Hitachi Chemical Co., Ltd. Feuille adhesive et dispositif semi-conducteur; procede de fabrication
WO2004011356A1 (fr) * 2002-07-30 2004-02-05 Hitachi Chemical Co., Ltd. Ruban en un materiau adhesif, procede de raccordement, de production, et de raccordement sous pression du ruban, bobine de ruban adhesif, dispositif d'adherence, cassette de ruban-agent adhesif, procede de raccordement sous pression de l'agent adhesif au moyen de la cassette, et ruban electroconducteur anisotrope

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001035460A1 (fr) * 1999-11-10 2001-05-17 Hitachi Chemical Co., Ltd. Film adhesif pour semi-conducteur, grille de connexion et dispositif semi-conducteur comportant une telle grille et procede de fabrication dudit dispositif semi-conducteur
WO2003018703A1 (fr) * 2001-08-27 2003-03-06 Hitachi Chemical Co., Ltd. Feuille adhesive et dispositif semi-conducteur; procede de fabrication
WO2004011356A1 (fr) * 2002-07-30 2004-02-05 Hitachi Chemical Co., Ltd. Ruban en un materiau adhesif, procede de raccordement, de production, et de raccordement sous pression du ruban, bobine de ruban adhesif, dispositif d'adherence, cassette de ruban-agent adhesif, procede de raccordement sous pression de l'agent adhesif au moyen de la cassette, et ruban electroconducteur anisotrope

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7585701B2 (en) * 2005-05-24 2009-09-08 Infineon Technologies Ag Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film

Similar Documents

Publication Publication Date Title
TW422874B (en) Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
KR100845092B1 (ko) 접착수지 조성물, 접착필름, 다이싱 다이본딩 필름 및반도체 장치
JPWO1998015975A1 (ja) 半導体装置、半導体チップ搭載用基板、それらの製造法、接着剤、および、両面接着フィルム
EP2960929A1 (fr) Sous-remplissage pre-applique
KR20120130705A (ko) 실페닐렌 구조 및 실록산 구조를 갖는 중합체 및 이의 제조 방법, 접착제 조성물, 접착 시트 및 반도체 장치 보호용 재료, 및 반도체 장치
JP4161544B2 (ja) 半導体素子搭載用接着フィルム
TWI906612B (zh) 接著劑用組成物及膜狀接著劑、以及使用了膜狀接著劑之半導體封裝及其製造方法
JP3617504B2 (ja) 半導体素子搭載用接着フィルム
JP3621337B2 (ja) 半導体装置用接着剤組成物及び接着シート
JP6768188B2 (ja) 接着フィルム用接着剤組成物及びその製造方法
JP6662074B2 (ja) 接着フィルム
CN116670829A (zh) 粘接剂用组合物和膜状粘接剂、以及使用了膜状粘接剂的半导体封装及其制造方法
JP2008038111A (ja) フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
CN1837317B (zh) 半导体装置、粘合剂和双面粘合膜
US20090198013A1 (en) Adhesive film for semiconductor
JP2000144077A (ja) 両面接着フィルム及びこれを用いた半導体装置
US20240150622A1 (en) Adhesive composition and film adhesive, and semiconductor package using film adhesive and producing method thereof
JP3774419B2 (ja) 半導体装置用接着テープ
WO2006126761A1 (fr) Pellicule adhesive pour semi-conducteur
JP2005076023A (ja) 低弾性接着剤並びにこの接着剤を用いた積層物、接着剤付き放熱板、接着剤付き金属箔
JP3578592B2 (ja) 半導体用ダイアタッチ樹脂ペースト
JP2001131501A (ja) 三層接着フィルム、半導体チップ搭載用基板及び半導体装置
TWI828455B (zh) 接著劑用組成物及膜狀接著劑、以及使用膜狀接著劑之半導體封裝及其製造方法
JP2000164607A (ja) 電子部品用接着部材、電子部品用接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2000178526A (ja) 電子部品用接着剤、接着フィルム及びこれらを用いた半導体装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200580049888.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 05817829

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 11915280

Country of ref document: US