WO2006129919A1 - Appareil de refroidissement pour pieces informatiques - Google Patents

Appareil de refroidissement pour pieces informatiques Download PDF

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Publication number
WO2006129919A1
WO2006129919A1 PCT/KR2006/001611 KR2006001611W WO2006129919A1 WO 2006129919 A1 WO2006129919 A1 WO 2006129919A1 KR 2006001611 W KR2006001611 W KR 2006001611W WO 2006129919 A1 WO2006129919 A1 WO 2006129919A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
heat
heat transfer
pressing
transfer block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2006/001611
Other languages
English (en)
Inventor
Sang-Cheol Lee
Sun-Gyu Yoon
Sang-Jun Jung
Sang-Gyu Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050045737A external-priority patent/KR100627236B1/ko
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Publication of WO2006129919A1 publication Critical patent/WO2006129919A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • the present invention relates to a cooling apparatus for computer parts, and more particularly, to a cooling apparatus including a pressing unit that can attach a heat transfer block on an upper surface of a heat generating part in order to cool the heat generating part in a computerregardless of thearrangement of the surrounding parts.
  • Computers include partsthat generate heat such as central processing units (CPUs) or chipsets mounted on substrates of graphic adapters. Such heat generating parts generate a lot of heat when computers operateandunless the heat is effectively removed, these heat generating parts mayoverheat, which can causethe parts tobe damaged ortomalfunction.
  • CPUs central processing units
  • chipsets mounted on substrates of graphic adapters.
  • Such heat generating parts generate a lot of heat when computers operateandunless the heat is effectively removed, these heat generating parts mayoverheat, which can causethe parts tobe damaged ortomalfunction.
  • Conventional cooling apparatuses include a heat transfer block, a heat dissipation unit, and a pressing and fixing unit.
  • the heat transfer block transfers the heat generated by the heat generating parts to the heat dissipation unit.
  • the heat dissipation unit dissipates the heat transferred by the heat transfer block outside of the apparatus.
  • the heat dissipation unit can be formed of a variety of shapes and structures according to the amount of heat generated by the heat generating parts.
  • the heat transfer block should be fixedly attached to the heat generating part in order to effectively transfer the heat generated by the heat generating part to the heat transfer block. To do this, the pressing and fixing unit is used.
  • the pressing and fixing unit generally includes an elastic memberthat is generally V-shaped.
  • a folded central portion of the elastic member is placed on an upper surface of the heat transfer block, and both sides of the elastic member are elastically deformed to be fixed to a substrate. Since the both sides of the elastic member are elastically fixed, the central portion of the elastic member can press the heat transfer block onto the heat generating part by an elastic force.
  • the heat dissipation unit and a cooling fan mounted on the heat dissipation unit are fixed to the heat transfer block. Therefore, the fixing direction of the heat transfer block with respect to the heat generating part determines the direction of airflow generated by the cooling fan.
  • a cooling apparatus including a pressing and fixing unit in which the airflow generated by the cooling fan of the cooling apparatus mounted on the heat generating part can be directed toward the ventilation opening disposed on the outer case of the computer regardless of the kinds of parts it is applied to.
  • the present invention provides a cooling apparatus for computer parts including a pressing and a fixing unit, which can be fixedly attached in any direction with respect to a heat generating part regardless of the type of heat generating part it is applied to.
  • a cooling apparatus for cooling aheat generating partof a computer that ismounted on a substrate in a computer, the apparatus including: a heat transfer blockto be attached onto the heat generating part to receive heat generated by the heat generating part; a heat dissipation unit receiving the heat from the heat transfer block and dissipating the heat outside; and a pressing and fixing unit attaching the heat transfer block onto an upper surface of the heat generating part, and the pressing and fixing unit includes: a boss unit protruding upward from an upper portion of the heat transfer block; and an elastic member comprising a pressing unit having a receiving portion for receiving the boss unit and pressing the upper surface of the heat transfer block, a pair of elastic deformation portions extending from opposite sides of the pressing unit, and fixing units formed on end portions of the elastic deformation portions and fixed to the substrate.
  • the boss unit may be formed in a cylindrical shape and the receiving portion of the pressing unit is a circular receiving hole corresponding to the boss unit so that the elastic member can rotate centered on the boss unit and can be coupled in two or more directions with respect to the heat transfer block.
  • a plurality of concave portions or a plurality of convex portions may be formed radially around the boss unitand complimentary convex portions or concave portions that can be coupled to the concave portions or the convex portions formed radially around the boss unit may be formed on a lower surface of the pressing unit of the elastic member, thus a coupling position of the elastic member with respect to the heat transfer block can be guided.
  • the pressing and fixing unit may further include an intermediate supporting member disposed around the heat generating part mounted on the substrate and fixed to the substrate, the elastic member is fixed to the substrate by elastically deforming the elastic deformation portions of the elastic member and fixing the fixing units formed on end portions of the elastic deformation portions on the intermediate supporting member.
  • the intermediate supporting member may surround the heat generating part, and include a plurality of fixing holes, to which the fixing units can be coupled.
  • FIG. 1 is a perspective view of a cooling apparatus for computer parts according to an embodiment of the present invention
  • FIG. 2 is a perspective view of a heat transfer block and a heat pipe of the cooling apparatus of FIG. 1, according to an embodiment of the present invention
  • FIG. 3 is a side view of the cooling apparatus of FIG. 1 according to an embodiment of the present invention
  • FIGS. 4 through 6 are views illustrating a process of fixing an elastic member of the cooling apparatus of FIG. 1, according toanembodiment of the present invention
  • FIG. 1 is a perspective view of a cooling apparatus for computer parts according to an embodiment of the present invention
  • FIG. 2 is a perspective view of a heat transfer block and a heat pipe of the cooling apparatus of FIG. 1, according to an embodiment of the present invention
  • FIG. 3 is a side view of the cooling apparatus of FIG. 1 according to an embodiment of the present invention
  • FIGS. 4 through 6 are views illustrating a process of fixing an elastic member of the cooling apparatus of FIG. 1, according toanembodiment of the present invention
  • FIG. 7 is a cross-sectional view of the cooling apparatus taken along line VII-VII of FIG. 6 according to an embodiment of the present invention
  • FIG. 8 is an enlarged view of the part denoted by the dashed line of FIG. 7 according to an embodiment of the present invention
  • FIG. 9 is a diagram showing examples of various coupling arrangements in which the elastic member is coupled to the heat transfer blockof the cooling apparatus of FIG.
  • FIGS. 10 and 11 are views illustrating the airflow generated by the cooling fan in the cooling apparatus of FIG. 1.
  • FIG. 1 is a perspective view of a cooling apparatus for computer parts according to an embodiment of the present invention
  • FIG. 2 is a perspective view of a heat transfer block and a heat pipe of the cooling apparatus of FIG. 1
  • FIG. 3 is a side view of the cooling apparatus of FIG. 1.
  • the cooling apparatus for computer parts is an apparatus for cooling heat generating parts mounted on a substrate in a computer.
  • the cooling apparatus 1 includes a heat transfer block 10, a heat dissipation unit, and a pressing and fixing unit 40.
  • the heat transfer block 10 receives heat generated by a heat generating part (not shown), such as a central processing unit (CPU), mounted on a substrate in the computer, and the heat transfer block 10 is fixedly attached on an upper surface of the heat generating part.
  • the heat transfer block 10 is formed of a material having high thermal conductivity, for example, copper or aluminum.
  • the heat transfer block 10 includes a lower member 12 and an upper member 14.
  • the lower member 12 is to be fixedly attached to the upper surface of the heat generating part.
  • the upper member 14 is coupled to the lower member 12, and a plurality of coupling holes, to which a heat pipe 20 is coupled, are formed between the upper and lower members 12 and 14.
  • the heat dissipation unit receives the heat from the heat transfer block 10 and dissipates the transferred heat.
  • the heat dissipation unit includes the heat pipe 20 and a plurality of heat dissipating fins 30.
  • Both end portions of the heat pipe 20 are coupled to the heat transfer block 10, and the other portion of the heat pipe 20 forms loop portions 22 as shown in FIG. 2.
  • the plurality of heat dissipating fins 30 are coupled to the loop portion 22atpredetermined distances from the loop portion 22.
  • a cooling fan 35 is disposed on a side of the plurality of heat dissipating fins 30. The airflow generated by the cooling fan 35 moves through paths formed between the heat dissipating fins 30.
  • the pressing and fixing unit 40 which is a characterizing part of the present invention, attaches the heat transfer block 10 onto an upper surface of the heat generating part. It is important that the heat transfer block 10 is firmly attached onto the heat generating part in order to effectively transfer the heat generated by the heat generating part to the heat dissipation unit.
  • the pressing and fixing unit 40 includes a boss unit 41 and an elastic member 42.
  • the boss unit 41 is disposed on an upper central portion of the upper member 14 of the heat transfer block 10.
  • the boss unit 41 protrudes upward from the central portion of the upper member 14.
  • the boss unit 41 is integrally formed with the upper member 14 of the heat transfer block 10, however, the present invention is not limited thereto. That is, an additional boss unit can be coupled to the heat transfer block.
  • the boss unit 41 is formed in a cylindrical shape according to the present embodiment.
  • a recess portion 412 (refer to FIGS. 7 and 8) having a smaller diameter than that of any other part of the boss unit 41 may be formed on a lower portion of the boss unit 41.
  • a protruding portion 414 having larger diameter than that of the boss unit 41 is formed around the boss unit 41.
  • the boss unit 41 can be formed as a square pillar or a hexagonal pillar in addition to a cylinder.
  • a receiving portion 45 of a pressing unit 44 that will be described later has a shape corresponding to the boss unit 41.
  • the elastic member 42 includes a pressing unit 44, an elastic deformation portion 46, and a fixing unit 48.
  • the pressing unit 44 includes a receiving portion 45 corresponding to the boss unit
  • the pressing unit 44 contacts the upper surface of the upper member 14 of the heat transfer block 10 to press the heat transfer block 10 downward when the pressing unit 44 is mounted completely onto the heat transfer block 10 as shown in FIG. 6.
  • the pressing unit 44 contacts the protruding portion 414 that is formed around the boss unit 41.
  • the pressing unit 44 Before mounting the elastic member 42 onto the boss unit 41, the pressing unit 44 has edges which are not flat but which rise up from the boss unit 41. However, after mounting the elastic member 42 onto the boss unit 41 as in FIG. 6, the pressing unit 44 is elastically deformed to become flat, and a lower surface of the pressing unit 44 contacts the upper surface of the heat transfer block 10 to press the heat transfer block 10.
  • the pressing unit 44 includes the receiving portion 45 that has a circular shape to receive the boss unit 41.
  • the receiving portion 45 corresponds to the boss unit 41 having a cylindrical shape, and has a diameter, through which the boss unit 41 can penetrate.
  • the elastic deformation portion 46 can be elastically deformed and extends from a side of the pressing unit 44.
  • a pair of elastic deformation portions 46 can be formed wherein the elastic deformation portions46 extend fromoppositesidesof thepressing unit 44.
  • the elastic deformation portions 46 are integrally formed with the pressing unit 44. According to the present embodiment, elongated holes are formed longitudinally on central portions of the pair of elastic deformation portions 46.
  • Afixing unit 48 is formed on each end portion of the elastic deformation portions
  • each fixing unit 48 is fixed to a substrate (not shown).
  • the fixing units 48 may be directly fixed to the substrate, howeveraccording to the present embodiment, the fixing units 48 are fixed to the substrate via an intermediate supporting member 49 that will be described later.
  • a penetration hole 482 is disposed on each of the fixing units 48 so that ascrew member 484 as shown in FIG. 5can coupleeachfixing unit 48 to the intermediate supporting member 49 by penetratingthrough the penetration hole 482.
  • the pressing and fixing unit further includes the intermediate supporting member 49.
  • the intermediate supporting member 49 is disposed around the heat generating part thatis mounted on the substrate, and isfixed to the substrate. According to the present embodiment, the intermediate supporting member 49 surrounds the heat generating part, and is formed in a generally circular shape as shown in FIGS. 4 through 6.
  • the elastic member 42 is fixed to the substrate by elastically deforming the pair of elastic deformation portions 46 and fixing the fixing units 48 to the intermediate supporting member 49. That is, the elastic member 42 is indirectlyfixed to the substrate by fixing the elastic member 42to the intermediate supporting member 49 that is fixed to the substrate. Meanwhile, the intermediate supporting member 49 includes a plurality of fixing holes 492, to which the fixing units 48 of the elastic member 42 can be fixed. Since the plurality of fixing holes 492 are formed on the intermediate supporting member 49, the fixing units 48 of the elastic member 42 may be fixed to the intermediate supporting member 49 in various directions. Screw members 484 are coupled to the fixing holes 492 through the penetration holes 482 of the fixing units 48.
  • the intermediate supporting member 49 has generally circular shape, however, the present invention is not limited thereto. That is, the intermediate supporting member 49 can be formed in a square shape. In addition, a plurality of cylinders can be formed around the heat generating part acting as the intermediate supporting member49 without surrounding the entire heat generating part. That is, cylindrical intermediate supporting members can befixed to the substrate, and the fixing units 48 of the elastic member 42 can be fixed to the cylindrical intermediate supporting members. In addition, besides the elastic member 42 the heat dissipation unit or the cooling fan 35 can also be fixed to the intermediate supporting member 49.
  • concave portions 416 are formed around the boss unit 41, and convex portions 442 are formed on a lower surface of the pressing unit 44 of the elastic member 42 so that coupling operation of the elastic member 42 to the heat transfer block 10 can be guided by the concave portions 416 and the convex portions 442.
  • a plurality of concave portions 416 are formed in the protruding portion 414 of the boss unit 41 along the peripheral portion of the boss unit 41.
  • sets of concave portions 416 are formed on four portions of the protruding portion 414, that is, altogethertwelve concave portions 416, are formed on the protruding portion 414.
  • the convex portions 442 that can be corre- spondingly coupled to the concave portions 416 are formed on the lower surface of the elastic member 42.
  • the elastic member 42 can be easily positioned with respect to the heat transfer block 10. In addition, after fixing the fixing units 48 of the elastic member 42 to the intermediate supporting member 49, rotation of the elastic member 42 on the boss unit 41 can be prevented.
  • the concave portions 416 are formed around the boss unit 41 of the heat transfer block 10 and the convex portions 442 are formed on the elastic member 42, however, the convex portions may be formed on the heat transfer block 10 and the concave portions may be formed on the elastic member 42.
  • the cooling apparatus 1 for computer parts having the above structure includes the boss unit 41 and the elastic member 42 as the pressing and fixing unit, and thus, can be coupled to the heat generating part in an appropriate direction with respect to the structure of the computer. Since the heat pipe 20, to which the heat dissipating fins 30 are coupled, and the cooling fan 35 are fixed to the heat transfer block 10, the direction of the airflow generated by the cooling fan 35 is determined according to the direction in which the heat transfer block 10 is fixed to the heat generating part. Thus,the airflow may be directed toward a ventilation opening that may be disposed on an outer case of the computer.
  • FIGS. 4 through 11 illustrate the heat transferring block 10, the boss unit 41, the elastic member 42, and the intermediate supporting member 49 except for the heat pipe 20 and the plurality of heat dissipating fins 30 for the convenience' sake.
  • FIGS. 4 through 6 are views illustrating processes of moving the heat transferring block 10 on the upper surface of the heat generating part in a desired direction, and fixing the elastic member 42 on the substrate via the intermediate supporting member 49.
  • the intermediate supporting member 49 is formed around the heat generating part (not shown) to surround the heat generating part.
  • Leg portions 491 are formed at four points of the intermediate supporting member 49.
  • a penetration hole492 is formed in each of the leg portions 491 from the top surface of the leg portion 491, andthus the intermediate supporting member 49 can be fixed to the substrate using the penetration holes.
  • the intermediate supporting member 49 is disposed on a desired portion of the substrate (not shown), and after that, screw members 484(see FIG. 5) are coupled to the substrate through the penetration holes 492 of the leg portions 491.
  • the substrate may further include reinforcing members, to which the screw members 484 penetrating the penetration holes 492 of the intermediate supporting member 49 can be coupled, on the lower surface of the substratein order to increase the coupling force of the intermediate supporting member 49.
  • the heat transfer block 10 is disposed on the upper surface of the heat generating part.
  • a material having a high thermal conductivity may be applied on the portion where the lower surface of the heat transfer block 10 and the upper surface of the heat generating partcome into contactwith each other, so that the heat transfer block 10 can effectively receive the heat from the heat generating part, for example, the CPU.
  • the elastic member 42 is located on the heat transfer block 10 byinserting the boss unit 41 formed on the upper surface of the heat transfer block 10 into the receiving portion 45 of the elastic member 42. Since, at this time, the elastic deformation portions 46 on opposite sides of the elastic member 42 are not yet deformed, the fixing units 48 formed on the end portions of the elastic deformation portions 46 are not in contact with the upper surface of the intermediate supporting member 49.
  • the elastic member 42 can be orientated in various directions with respect to the heat transfer block 10. That is, besides the positions of the elastic member 42 illustrated in FIGS. 4 and 5, the elastic member 42 can be orientated in various directions based on the boss unit 41 since the elastic member 42 can rotate centered on the boss unit 41. For example, the elastic member 42 can be rotated 90 ° from the coupling position shown in FIG. 6, or can be rotate to other desired directions. In this case, the orientation the intermediate supporting member 49 should be determined in advance and fixed according to the desired orientation of the elastic member 42.
  • FIG. 6 illustrates the situation when the screw members 484 are coupled to the intermediate supporting member 49.
  • FIG. 7 showing the intermediate supporting member 49 taken along line VII-VII of FIG. 6, the elastic deformation portions 46 of the elastic member 42 are elastically deformed and fixed to the intermediate supporting member 49. Therefore, the pressing unit 44 of the elastic member 42 strongly pushes the heat transfer block 10 in a downward direction by the elasticity of the elastic deformation portions 46, and thus, the heat transfer block 10 is fixedly attached onto the heat generating part.
  • FIG. 9 is a diagram showing examples of various coupling arrangements in which the elastic member 42 is coupled to the heat transfer block 10 of the cooling apparatus of FIG. 1 according to embodiments of the present invention.
  • FIG. 9 illustrates the elastic member 42 based on the boss unit 41 that can be easily orientated in many desired directions. Examples of the orientations areshown by virtual lines. The orientation ofthe elastic member 42 denoted by the solid line can be rotated 90 ° angle the orientation of the elastic member 42 illustrated in the previous drawings.
  • the convex portions 442 and the concave portions 416 are formed, the elastic member 42 can be guided to a desired position with respect to the heat transfer block 10.
  • FIGS. 10 and 11 are views illustrating the airflowdirectiongenerated by the cooling fan in the cooling apparatus of FIG. 1 where only the heat transfer block 10 including the boss unit 41, the elastic member 42, and the cooling fan 35, and the cooling fan 35 are shown for convenience.
  • the direction ofairflow can be adjusted to be suitable for the cooling system of the computer. That is, the airflow generated by the cooling fan 35 can be directed toward a desired direction while fixedly attaching the heat transfer block 10 onto the heat generating part.
  • the airflow can be directed toward the ventilation opening of the computer case, or toward another heat generating part of the case.
  • the cooling apparatus for computer parts includes the boss unit and the elastic member as the pressing and fixing unit, and thus, the cooling apparatus can be disposed and fixed in the desired direction with respect to the heat generating part regardlessof the kind of heat generating part, on which the cooling apparatus is installed.
  • the cooling apparatus of the present invention since the pressing and fixing unit includes the boss unit and the elastic member, the cooling apparatus can be mounted on any kind of heat generating part regardless of the coupling structure of the heat generating part in a desired orientation.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un appareil destiné à refroidir des pièces thermogènes, qui est monté sur un substrat dans un ordinateur. L'appareil de refroidissement de l'invention comprend: un bloc de transfert thermique destiné à être attaché sur la pièce thermogène afin de recevoir la chaleur produite par ladite pièce thermogène; une unité de dissipation de chaleur qui reçoit la chaleur en provenance du bloc de transfert thermique et qui dissipe la chaleur à l'extérieur; et une unité de compression et de fixation qui attache le bloc de transfert thermique sur une surface supérieure de la pièce thermogène. L'unité de compression et de fixation comprend: une unité bossage qui fait saillie vers le haut depuis une surface supérieure du bloc de transfert thermique; et un élément élastique qui comprend une unité de compression comportant une partie réceptrice destinée à recevoir l'unité bossage et à comprimer la surface supérieure du bloc de transfert thermique; une paire de parties à déformation élastique qui s'étendent depuis les côtés opposés de l'unité de compression; et des unités de fixation formées sur les parties d'extrémité des parties à déformation élastique et fixées sur le substrat.
PCT/KR2006/001611 2005-05-30 2006-04-28 Appareil de refroidissement pour pieces informatiques Ceased WO2006129919A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050045737A KR100627236B1 (ko) 2005-04-11 2005-05-30 컴퓨터 부품용 냉각장치
KR10-2005-0045737 2005-05-30

Publications (1)

Publication Number Publication Date
WO2006129919A1 true WO2006129919A1 (fr) 2006-12-07

Family

ID=37481816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2006/001611 Ceased WO2006129919A1 (fr) 2005-05-30 2006-04-28 Appareil de refroidissement pour pieces informatiques

Country Status (3)

Country Link
CN (1) CN100383703C (fr)
TW (1) TWI309762B (fr)
WO (1) WO2006129919A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009123618A1 (fr) * 2008-04-01 2009-10-08 Hewlett-Packard Development Company, L.P. Appareils et procédés pour dissiper la chaleur provenant d'un composant d'ordinateur

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US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6826047B1 (en) * 2003-05-15 2004-11-30 Uniwill Computer Corporation Cool air-supplying device for a computer system
US6879485B2 (en) * 2000-12-19 2005-04-12 Hitachi, Ltd. Method of controlling cooling system for a personal computer and personal computer
US20050103477A1 (en) * 2003-11-14 2005-05-19 Lg Electronics Inc. Cooling apparatus for portable computer

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Publication number Priority date Publication date Assignee Title
CN2433666Y (zh) * 2000-06-27 2001-06-06 富准精密工业(深圳)有限公司 散热器扣合装置
CN2598042Y (zh) * 2003-01-16 2004-01-07 刘阿生 具有两个弹性臂的扣具
CN2684254Y (zh) * 2003-09-19 2005-03-09 邵再禹 一种计算机中央处理器（cpu）用的散热器的固定装置
CN2696034Y (zh) * 2004-05-10 2005-04-27 鈤新科技股份有限公司 旋控式散热器扣具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6879485B2 (en) * 2000-12-19 2005-04-12 Hitachi, Ltd. Method of controlling cooling system for a personal computer and personal computer
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6826047B1 (en) * 2003-05-15 2004-11-30 Uniwill Computer Corporation Cool air-supplying device for a computer system
US20050103477A1 (en) * 2003-11-14 2005-05-19 Lg Electronics Inc. Cooling apparatus for portable computer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009123618A1 (fr) * 2008-04-01 2009-10-08 Hewlett-Packard Development Company, L.P. Appareils et procédés pour dissiper la chaleur provenant d'un composant d'ordinateur
US8520393B2 (en) 2008-04-01 2013-08-27 Hewlett-Packard Development Company, L.P. Apparatuses and methods for dissipating heat from a computer component

Also Published As

Publication number Publication date
CN100383703C (zh) 2008-04-23
TW200641588A (en) 2006-12-01
TWI309762B (en) 2009-05-11
CN1873584A (zh) 2006-12-06

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