WO2007011057A1 - ポリシロキサンおよびその製造方法 - Google Patents
ポリシロキサンおよびその製造方法 Download PDFInfo
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- WO2007011057A1 WO2007011057A1 PCT/JP2006/314716 JP2006314716W WO2007011057A1 WO 2007011057 A1 WO2007011057 A1 WO 2007011057A1 JP 2006314716 W JP2006314716 W JP 2006314716W WO 2007011057 A1 WO2007011057 A1 WO 2007011057A1
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- polysiloxane
- silicon
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- water
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
Definitions
- the present invention relates to a method for producing polysiloxane with a simplified production method and a low environmental load. More specifically, the present invention relates to a method for producing a polysiloxane without a solvent by a condensation reaction without using an acid and a base catalyst.
- Polysiloxane materials are excellent in light transmission, electrical insulation, light stability, thermal stability, cold resistance, etc., so most of them such as electricity / electronics, architecture, automobiles, machinery, chemistry, biochemistry, etc. Used in the industrial field.
- As a production method of polysiloxane As a production method of polysiloxane,
- Japanese Patent Publication No. 63-14013 proposes a production method that uses carbon dioxide, a gas or supercritical fluid, as a polymerization medium. Has been. Although this method does not use an organic solvent, it uses an acid or base catalyst, which requires base treatment or acid treatment of the product. Japanese Patent Application Laid-Open No.
- 2002-3529 proposes a method for producing a silyl group-containing compound using supercritical carbon dioxide as a reaction solvent.
- supercritical carbon dioxide is used as a medium for the hydrosilylation reaction using a catalyst such as platinum-rich compound.
- a waste of a crosslinked silicone compound is hydrolyzed by contacting with a mixed solvent of alcohol and water under heating, thereby obtaining an uncrosslinked silicone compound.
- a method for producing a silicone oil has been proposed.
- polysiloxane is produced with the decomposition of the siloxane bond, so that the substituent on the silicon atom of the product is replaced with the substituent (basically methyl group) of the crosslinked silicone waste that is the starting material. Limited. Even when two or more kinds of substituents are present, it is difficult to control the ratio in the product, and a polycrystal having different bonding modes such as a mono-substituted siloxane unit and a di-substituted siloxane unit in a desired ratio. Siloxane cannot be produced. Furthermore, there is no mention of the detailed chemical structure and molecular weight of the product. To date, no solvent-free and catalyst-free method for producing polysiloxanes involving the formation of siloxane bonds by hydrolysis and condensation reactions has not been proposed.
- An object of the present invention is to propose a simplified production method of polysiloxane with less emission during production. Disclosure of the invention
- R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group
- R 2 is a monovalent hydrocarbon group having 4 or less carbon atoms
- ab is O a 3 0 ⁇ b ⁇ 4 and 0 is a number that satisfies a + b ⁇ 4.
- the method for producing the polysiloxane of the invention according to claim 2 of the present application has an average composition formula (B): R C (R ⁇ ) d (HO) e 10 [( 4- c- d - e ) / 2]
- the silicon-containing compound represented by the above is subjected to a condensation reaction under the conditions of a temperature of 200 ° C. or higher and a pressure of 0.5 ⁇ 5 MPa or higher.
- the method for producing a polysiloxane of the invention according to claim 3 of the present application has an average composition formula (B): R 1 c (R 2 0) d (HO) e SiO [(4 _ c . D. E) / 2]
- the method for producing the polysiloxane of the invention according to claim 4 of the present application comprises:
- R 1 is the same as above, and f and g are numbers satisfying 0 ⁇ f ⁇ 3, 0 ⁇ g ⁇ 3 and 0 ⁇ f + g ⁇ 4.
- a mixture of silicon-containing compounds represented by the formula is characterized by undergoing a condensation reaction under conditions of a temperature of 200 ° C or higher and a pressure of 0.5 MPa or higher.
- the method for producing the polysiloxane of the invention according to claim 5 of the present application is as follows: 'average composition formula (A): R a (j 0) b S 1 [(— b) / 2] _
- a mixture of a silicon-containing compound and water represented by the following is hydrolyzed / condensed under a temperature of 200 ° C or higher and a pressure of 0.5 MPa or higher.
- the method for producing a polysiloxane of the invention according to claim 6 of the present application is the method according to any one of claims 1, 3, and 5, wherein the silicon-containing compound and water are continuously added to the reaction vessel, respectively. It is made to react, supplying it.
- the method for producing polysiloxane of the invention according to claim 7 of the present application is the method according to any one of claims 2 and 4, wherein the reaction is carried out while continuously supplying the silicon-containing compound to the reaction vessel. It is characterized by.
- polysiloxane of the invention according to claim 8 of the present application is characterized by being produced by the method according to any one of claims 1 to 7.
- the invention according to claim 9 of the present application is characterized in that the polysiloxane according to claim 8 is a precursor of a silicon-containing inorganic compound.
- the invention's effect is characterized in that the polysiloxane according to claim 8 is a precursor of a silicon-containing inorganic compound.
- FIG. 1 is a conceptual diagram of a flow reactor used in the production method of the present invention.
- Fig. 1 is a storage tank for silicon-containing compounds
- 2 is a feed pump
- 3 is a water storage tank
- 4 is a feed pump
- 5 is a heat exchanger
- 6 is a thermometer
- 7 is a preheating unit
- 8 is a sand pass
- 9 is a reaction vessel
- 10 is a collection container
- 11 is an in-line filter
- 12 is a back pressure regulator.
- R 1 is the same or different substituted or unsubstituted monovalent hydrocarbon group. Specifically, charcoal bonded to silicon atoms A monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 10 carbon atoms, a monovalent substituted aliphatic hydrocarbon group having 1 to 6 carbon atoms, and a carbon atom Number 6 ⁇
- One or two or more monovalent hydrocarbon groups selected from 10 monovalent substituted aromatic hydrocarbon groups are selected from 10 monovalent substituted aromatic hydrocarbon groups.
- the monovalent saturated aliphatic hydrocarbon group having 1 to 6 carbon atoms a methyl group exemplified by a methylol group, an ethyl group, a propyl group, a butyl group, and a hexyl group is preferable.
- the monounsaturated aliphatic hydrocarbon group include a bur group, an aryl group, and a hexel group.
- Examples of the monovalent aromatic hydrocarbon group include a phenyl group, a tolyl group, a xylyl group, and a naphthyl group, but a phenol group is preferred.
- Examples of the monovalent substituted aliphatic hydrocarbon group include a halogen-substituted hydrocarbon group such as a cyclopropyl group; a hydroxy-substituted hydrocarbon group such as a hydroxypropyl group, and the monovalent substituted aromatic hydrocarbon group as Illustrative examples include halogen-substituted hydrocarbon groups such as 2-chlorophenyl group, 4-chlorophenyl group and 2-chloronaphthyl group.
- R 2 is a monovalent hydrocarbon group having 4 or less carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopyl pill group, a butyl group, and a tertiary butyl group. Is preferred.
- a and b are numbers that satisfy 0 ⁇ a ⁇ 3, 0 ⁇ b ⁇ 4, and 0 and a + b ⁇ 4, respectively. As b increases, the molecular weight of the product polysiloxane tends to increase.
- silicon-containing compounds (A) include trimethylmethoxysilane, dimethylphenylmethoxysilane, methyldiphenylmethoxysilane, dimethyldimethylmethoxysilane, methylphenyldimethoxysilane, methylvinyldimethoxysilane, diphenyldimethylmethine.
- Toxisilane Methyltrimethoxysilane, Methyltriethoxysilane, Phenyltrimethoxysilane, Butrimethoxysilane, Tetramethoxysilane, Tetraethoxysilane, Both-end dimethoxy-functional polydimethylsiloxane, Both-end methyldimethoxy-functional polydimethylsiloxane, Both-end trimethoxy-functional poly Examples include dimethylsiloxane and methoxy functional silicate oligomers.
- silicon-containing compound (A) these compounds may be used alone, or a mixture of two or more kinds may be used.
- the amount of water used in the reaction with the silicon-containing compound (A) is not particularly limited.
- Compound (A) in the R 2 ⁇ group represented by 5 0 mole 0/0 above is preferably an amount such that 1 5 0 0 mol% or less. This is preferable because if the amount of water is less than 50 mol%, the concentration of the radical silanol group represented by R 2 O remaining in the polysiloxane that is the product is remarkably increased. Absent. In addition, if an amount exceeding 1500 mol% is used, this is also not preferable because the pressure in the reaction system becomes too high or the amount of excess water recovered is too large.
- Conditions for reacting the silicon-containing compound (A) with water are that the reaction temperature is 200 ° C. or higher and the reaction pressure is 2.5 MPa or higher. If either temperature or pressure or both are less than these values, the reaction will not proceed sufficiently. There is no strict upper limit of temperature and pressure, but the upper limit temperature is 400 ° C. considering the thermal stability of the reaction substrate and the product polysiloxane. In addition, if the reaction pressure is too high, it is difficult to increase the molecular weight of the product polysiloxane, so about 3 OMPa is the upper limit.
- a preferred temperature range is 2300 ° C. or more and 3700 ° C. or less, and a more preferred temperature range is 2550 ° C. or more and 3500 ° C. or less.
- the preferred pressure region is 2.8 MPa or more and 25 MPa or less, and the more preferred pressure region is 3,0 MPa or more and 2 2 MPa or less.
- the time for reacting the silicon-containing compound (A) with water is not greatly limited, but the recommended range is 30 seconds or more and 30 minutes or less after the substrate mixture reaches the set reaction temperature. It is. If the reaction time is too short, the condensation reaction for forming the polysiloxane does not proceed sufficiently, and if the reaction time is too long, energy is wasted.
- the reaction mode when the silicon-containing compound (A) is reacted with water there is no restriction on the reaction mode when the silicon-containing compound (A) is reacted with water, and either a patch type reaction or a flow type reaction can be applied.
- the patch reaction the operation of maintaining the set temperature and pressure for a predetermined time after putting the silicon-containing compound (A) and water into the reaction vessel is common.
- the apparatus shown in FIG. 1 can be used. In this apparatus, the silicon-containing compound (A) and water are generally introduced from separate storage tanks 1 and 3 into a reaction vessel 9 using liquid feed pumps 2 and 4, and mixed and reacted while flowing. Is. At this time, leave both components at room temperature.
- electric heat exchangers organic heat exchange fluids such as Dow Therm manufactured by Dow Chemical Company, organic heat transfer fluids such as Barrel Therm manufactured by Matsumura Oil Co., Ltd., inorganic molten salts such as alkali metal nitrates, sand used as sand baths Etc.
- the sand bath 8 is used as a heating means, but the present invention is not limited to this.
- the above compound (A) and water are hydrolyzed / condensed under predetermined temperature, pressure and time conditions and then cooled to isolate the polysiloxane from the reaction product.
- examples of products other than polysiloxane include alcohol.
- the silicon-containing compound represented by the formula is characterized by undergoing a condensation reaction under the conditions of a temperature of 200 ° C. or higher and a pressure of 0.5 MPa or higher.
- R 1 and R 2 are the same as described above.
- c, d, and e are numbers that satisfy 0 ⁇ c ⁇ 2, 0 ⁇ d ⁇ 3, 0 ⁇ e ⁇ 2, and 0 ⁇ c + d + e ⁇ 4, respectively, l ⁇ c ⁇ 2, 0. 1 ⁇ d ⁇ 2, 0. 0 5 ⁇ e ⁇ 2, and 1.1 5 ⁇ c + d + e ⁇ 4.
- silicon-containing compound (B) examples include a partial hydrolyzate of dimethyldimethoxysilane, a partial hydrolyzate of dimethylmethoxysilane, a partial hydrolyzate of methylphenyldimethoxysilane, and a partial hydrolyzate of methylvinyldimethoxysilane.
- this silicon-containing compound (B) may be reacted alone, or may be subjected to a hydrolysis / condensation reaction in the presence of water.
- polysiloxane having a high molecular weight may be produced by reacting with water.
- the reaction conditions for the silicon-containing compound (B) are that the reaction temperature is 20 ° C. or higher and the reaction pressure is 0.5 MPa or higher. If either temperature or pressure or both are less than these values, the reaction will not proceed sufficiently.
- the upper limit temperature is 400 ° C. considering the thermal stability of polysiloxane as a reaction substrate and product.
- the reaction pressure is too high, it is difficult to increase the molecular weight of the product polysiloxane, so that the upper limit is about 3 OMPa.
- a preferred temperature range is 2300 ° C. or more and 370 ° C. or less, and a more preferred temperature range is 2550 ° C. or more and 3500 ° C. or less.
- the preferred pressure region is 0.8 MPa or more and 25 MPa or less, and the more preferred pressure region is 1.0 MPa or more and 2 2 MPa or less.
- This silicon-containing In the case where the reaction of (B) is carried out in a flow system, for example, in the apparatus shown in FIG. 1, an apparatus excluding the water storage tank 3, the liquid feed pump 4, and the preheating unit 7 can be used. the method of manufacturing a polysiloxane of another aspect of the present invention, the average composition formula (a): R 1 a ( R 2 0) b SiO [(. 4 a _ b) / 2]
- R 1 R 2 is the same group as described above.
- f and g are 0 ⁇ f 3, 0 ⁇ g ⁇ 3, and 0 and satisfy f + g ⁇ 4.
- Examples of the silicon-containing compound (A) include the same compounds as described above. These compounds may be used alone or in combination of two or more. Specific examples of the silicon-containing compound (C) include trimethylsilanol, dimethylphenylsilanol, methyldiphenylsilanol, diphenylsilanediol, hexaphenyltrisiloxane-1,5-diol, and both ends.
- OH-functional polydimethylsiloxane both ends OH-functional polymethylphenylsiloxane, phenylsilanetriol, hydrolyzate of methyltrimethoxysilane, hydrolyzate of methyltriethoxysilane, hydrolyzate of phenyltrimethoxysilane, vinyltrimethyl
- hydrolyzate of toxisilane and water-dispersed colloidal silica As the silicon-containing compound (C), these compounds may be used alone, or a mixture of two or more kinds may be used.
- the mixture of the silicon-containing compound (A) and silicon-containing compound (C) can be used for the reaction as it is, but it may be subjected to a hydrolysis / condensation reaction in the presence of water.
- polysiloxane having a high molecular weight may be produced by reacting with water.
- the amount of water at this time is not particularly limited, but is preferably 10 mol% or more and 1,500 mol% or less of the group represented by R 2 0 in (A). This is because when the amount of water is less than 10 mol%, the effect of increasing the molecular weight is small, and an amount exceeding 1500 mol% is used. If used, this is also not preferable because the pressure in the reaction system becomes too high and the amount of excess water recovered is too large.
- reaction conditions for the mixture of the silicon-containing compound (A) and the silicon-containing compound (C) are as follows.
- the reaction temperature is 200 ° C or higher and the reaction pressure is the same as in the case of the compound (A). It must be 0.5 MPa or more.
- the preferred temperature range is 230 ° C or higher and 37 ° C.
- a preferable pressure region is 0.8 MPa or more and 25 MPa or less, and a more preferable pressure region is l. OMPa or more and 22 MPa or less.
- the polysiloxane of the present invention is produced by the above-described method.
- Such a polysiloxane does not use an acid or basic compound catalyst usually used in the production method of the polysiloxane, so that a neutralization step during the production is unnecessary. Since it does not contain neutralized salts, it is expected to have excellent heat resistance and electrical properties.
- polysiloxane of the present invention and the production method thereof will be described in detail with reference to examples and comparative examples.
- the molecular weight and identification of polysiloxane were carried out as follows.
- the molecular weight of the product polysiloxane was calculated using a high-speed GPC apparatus HLC-8020 manufactured by Tosoh Corporation as the relative value of the weight average molecular weight with respect to the polystyrene standard sample using chloroform as an eluent.
- the heat resistance of the polysiloxane product is the weight of the residue after heating to 800 ° C at a rate of 1 ⁇ ⁇ ⁇ in air using a thermogravimetry measuring device TGA-50 manufactured by Shimadzu Corporation. The percentage was evaluated.
- the solid product was confirmed to be a phenylsilsesquioxane containing an OH group and a methoxy group from the IR and NMR spectrum data summarized below.
- Example 1 the reaction was performed in the same manner as in Example 1 except that the reaction temperature was 300 ° C and the reaction time was 10 minutes. The pressure in the reaction tube during heating was 4.3 MPa. A phase-separated mixture similar to Example 1 was obtained, and the IR and NMR spectra of the solid product were the same as in Example 1.
- This solid product was a ferrosilsesqui, containing OH and methoxy groups, Was confirmed to be oxane. The isolation yield was 92% and the molecular weight was 13,600.
- Example 1 the amount of phenyltrimethoxysilane was 4 m 1 and the amount of water was 2 m. 1.
- the reaction was performed in the same manner as in Example 1 except that the reaction temperature was 350 ° C. and the reaction time was 10 minutes. The internal pressure of the reaction tube during heating was 14.3 MPa.
- a phase separation mixture similar to that in Example 1 was obtained, and the IR and NMR spectra of the solid product were the same as in Example 1.
- This solid product contained a phenylsilsesquioxane containing OH groups and methoxy groups. Was confirmed to be oxane.
- the isolation yield is 8 2%, and the molecular weight is 2,900.
- Example 1 the reaction was performed in the same manner as in Example 1 except that the reaction substrate was tetramethoxysilane 2.5 ml, the amount of water was 1.83 ml 1, and the reaction time was 10 minutes. The pressure in the reaction tube during heating was 13.5 MPa. A phase separation mixture similar to that in Example 1 was obtained, and the solid product was insoluble in the organic solvent. The IR and NM R spectra of this product confirmed that the product was silicon dioxide containing OH groups. The isolation yield was 99%.
- Example 1 a mixture of methinoretrimethoxysilane 0.5 1 ml and phenyltrimethoxysilane 2 ml 1 was used as a reaction substrate, the amount of water was 1.1 6 ml, the reaction temperature was 300 ° C, and the reaction time was 10 minutes. The reaction was performed in the same manner as in Example 1 except that. The internal pressure of the reaction tube during heating was 12.0 MPa. A phase separation mixture similar to Example 1 was obtained, and from the IR and NMR spectral data summarized below, this solid product was a methyl silsesquioxane phenoyl siloxane containing OH and methoxy groups. It was confirmed that the polymer [copolymerization composition ratio (molar ratio): 25/75]. The isolation yield was 89% and the molecular weight was 1,780.
- reaction substrate is an average composition formula:
- Example 7 The reaction was conducted in the same manner as in Example 1 except that the reaction temperature was 300 ° C and the reaction time was 10 minutes. The pressure in the reaction tube during heating was 3.5 MPa. A phase separation mixture similar to that in Example 1 was obtained, and the IR and NMR spectra of the solid product were the same as in Example 1. This solid product was a phenylsilsesquide containing OH and methoxy groups. Was confirmed to be oxane. The isolation yield was 95% and the molecular weight was 2,100. , [Example 7]
- reaction substrate is an average composition formula:
- the reaction was carried out in the same manner as in Example 1 except that the amount of water was lm 1, the amount of water was lm 1, the reaction temperature was 300 ° C, and the reaction time was 10 minutes. The internal pressure of the reaction tube during heating was 8. OMPa.
- a phase separation mixture similar to that in Example 1 was obtained, and the IR and NMR spectra of the solid product were the same as in Example 1.
- This solid product was a phenylsilyl containing OH groups and methoxy groups. It was confirmed to be sesquioxane.
- the isolation yield was 92% and the molecular weight was 3,400.
- Example 1 a mixture of both end-terminated hydroxyl functional polydimethylsilane having an average degree of polymerization of 4.08 ml and methylphenyldimethoxysilane 0.97 ml was used as a reaction substrate, the reaction temperature was 300 ° C., and the reaction time was 10 minutes. The reaction was performed in the same manner as in Example 1 except that. The pressure in the reaction tube during heating was 0.9 MPa. A uniform oily product was obtained. From the IR and NMR spectrum data summarized below, this solid product was a dimethylsiloxane / phenylmethylsiloxane copolymer with OH and methoxy groups at the polymer ends.
- Example 1 a mixture of both end hydroxyl group-functionalized polydimethylsilane with a mean degree of polymerization of 13 and 81 ml of fuel trimethoxysilane and 2m 1 was used as a reaction substrate, and the amount of water was 0.87 ml.
- the reaction was performed in the same manner as in Example 1 except that the temperature was 300 ° C and the reaction time was 10 minutes. The pressure in the reaction tube during heating was 9. OMPa. A phase separation mixture similar to that of Example 1 was obtained. From the IR and N MR spectrum data summarized below, this solid product was a dimethylsiloxane / phenylsilsesquioxane copolymer containing OH and methoxy groups. It was confirmed to be a polymer [copolymerization composition ratio (molar ratio): 50 Z 50]. The isolation yield was 88% and the molecular weight was 3,280.
- the phenylsilsesquioxane obtained in Examples 1 and 2 was heated to 800 ° C.
- the proportion of residue weight after heating was 47.5% and 46.5% of the weight before heating, respectively.
- Example 1 the same procedure as in Example 1 was conducted, except that water was not added and only phenyltrimethoxysilane 3m 1 was charged and the reaction temperature was 300 ° C. The pressure in the reaction tube during heating was 0.4 MPa. The product was phenyltrimethoxysilane, and it was confirmed that no reaction occurred.
- Example 1 the reaction was carried out in the same manner as in Example 1 except that the amount of phenyltrimethoxysilane was 2 m 1, the amount of water was lm 1 and the reaction temperature was 300 ° C. The internal pressure of the reaction tube during heating was 1.1 MPa. The product was a two-component phase-separated mixture. From the organic phase, a polymer with a molecular weight of 1,500 was observed. However, gas chromatography analysis confirmed that a large amount of phenyltrimethoxysilane remained, indicating that the hydrolysis was inadequate.
- a phenyl silsesquioxane having a molecular weight of 11,000 was obtained using phenyltrimethoxysilane as a starting material by a method according to the synthesis method described in Examples of JP-A-2005-179541.
- This phenolic resilsesquioxane was heated to 800 ° C.
- the ratio of the weight of the residue after heating was 28.0% of the weight before heating, which was remarkably lower than the conversion rate to silicon oxide calculated from the chemical structure, and was found to be inferior in heat resistance.
- the production method of the present invention has less emissions during production, eliminates the need for a neutralization step during production, and simplifies the process, thereby shortening the time required to produce polysiloxane and reducing production costs. It is also effective for reduction.
- a condensation reaction is used, It is also possible to produce polysiloxanes having a desired ratio with different bonding modes.
- organic waste liquid is not discharged from the production process, which is suitable as a method for producing polysiloxane that reduces the environmental load.
- the polysiloxane produced by the production method of the present invention does not contain a catalyst residue and a neutralized salt, it is expected to have excellent heat resistance and electrical properties, such as silicon oxide and silicon nitride. It is useful as a silicon-containing inorganic compound precursor.
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Abstract
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/996,220 US20090253884A1 (en) | 2005-07-19 | 2006-07-19 | Polysiloxane And Method For Producing Same |
| JP2007525521A JPWO2007011057A1 (ja) | 2005-07-19 | 2006-07-19 | ポリシロキサンおよびその製造方法 |
| EP06781628A EP1905795A4 (en) | 2005-07-19 | 2006-07-19 | POLYSILOXAN AND MANUFACTURING METHOD THEREFOR |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-208902 | 2005-07-19 | ||
| JP2005208902 | 2005-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007011057A1 true WO2007011057A1 (ja) | 2007-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2006/314716 Ceased WO2007011057A1 (ja) | 2005-07-19 | 2006-07-19 | ポリシロキサンおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090253884A1 (ja) |
| EP (1) | EP1905795A4 (ja) |
| JP (1) | JPWO2007011057A1 (ja) |
| KR (1) | KR20080026188A (ja) |
| CN (1) | CN101248106A (ja) |
| WO (1) | WO2007011057A1 (ja) |
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| WO2008102256A1 (en) * | 2007-02-20 | 2008-08-28 | Az Electronic Materials Usa Corp. | Silicone coating composition |
| WO2008104881A1 (en) * | 2007-02-27 | 2008-09-04 | Az Electronic Materials Usa Corp. | Silicon-based antifrelective coating compositions |
| WO2009057817A1 (en) * | 2007-10-31 | 2009-05-07 | Dow Corning Toray Co., Ltd. | Polysiloxane composition and method for producing the same |
| JP2012521458A (ja) * | 2009-03-26 | 2012-09-13 | ダウ コーニング コーポレーション | オルガノシロキサンポリマーの調製 |
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| GB0905205D0 (en) * | 2009-03-26 | 2009-05-13 | Dow Corning | Preparation of organosiloxane polymer |
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| JP6199686B2 (ja) * | 2013-10-04 | 2017-09-20 | 信越化学工業株式会社 | レジスト組成物の製造方法 |
| US9006355B1 (en) | 2013-10-04 | 2015-04-14 | Burning Bush Group, Llc | High performance silicon-based compositions |
| JP6466650B2 (ja) * | 2014-04-03 | 2019-02-06 | 信越化学工業株式会社 | レジスト組成物の製造方法 |
| KR102556244B1 (ko) * | 2017-01-31 | 2023-07-18 | 킴벌리-클라크 월드와이드, 인크. | 중합체 물질 |
| CN109319750B (zh) * | 2018-11-13 | 2020-10-09 | 江西宏柏新材料股份有限公司 | 一种微波加热制备α-氮化硅纳米带的方法 |
| US20230081969A1 (en) * | 2020-02-17 | 2023-03-16 | Zhejiang Third Age Material Technology Co., Ltd | Preparation method for spherical silica powder filler, powder filler obtained thereby and use thereof |
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- 2006-07-19 CN CNA2006800261310A patent/CN101248106A/zh active Pending
- 2006-07-19 KR KR1020087001498A patent/KR20080026188A/ko not_active Withdrawn
- 2006-07-19 JP JP2007525521A patent/JPWO2007011057A1/ja not_active Abandoned
- 2006-07-19 EP EP06781628A patent/EP1905795A4/en not_active Withdrawn
- 2006-07-19 US US11/996,220 patent/US20090253884A1/en not_active Abandoned
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008102256A1 (en) * | 2007-02-20 | 2008-08-28 | Az Electronic Materials Usa Corp. | Silicone coating composition |
| CN101617010B (zh) * | 2007-02-20 | 2012-09-05 | Az电子材料美国公司 | 有机硅涂料组合物 |
| KR101429317B1 (ko) | 2007-02-20 | 2014-09-19 | 에이제토 엘렉토로닉 마티리알즈 아이피 (재팬) 가부시키가이샤 | 실리콘 코팅 조성물 |
| WO2008104881A1 (en) * | 2007-02-27 | 2008-09-04 | Az Electronic Materials Usa Corp. | Silicon-based antifrelective coating compositions |
| CN101622296A (zh) * | 2007-02-27 | 2010-01-06 | Az电子材料美国公司 | 硅基抗反射涂料组合物 |
| US8524441B2 (en) | 2007-02-27 | 2013-09-03 | Az Electronic Materials Usa Corp. | Silicon-based antireflective coating compositions |
| CN101622296B (zh) * | 2007-02-27 | 2013-10-16 | Az电子材料美国公司 | 硅基抗反射涂料组合物 |
| JP2015038221A (ja) * | 2007-02-27 | 2015-02-26 | エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション | ケイ素に基づく反射防止膜用組成物 |
| WO2009057817A1 (en) * | 2007-10-31 | 2009-05-07 | Dow Corning Toray Co., Ltd. | Polysiloxane composition and method for producing the same |
| JP2012521458A (ja) * | 2009-03-26 | 2012-09-13 | ダウ コーニング コーポレーション | オルガノシロキサンポリマーの調製 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090253884A1 (en) | 2009-10-08 |
| CN101248106A (zh) | 2008-08-20 |
| EP1905795A4 (en) | 2010-08-11 |
| JPWO2007011057A1 (ja) | 2009-02-05 |
| EP1905795A1 (en) | 2008-04-02 |
| KR20080026188A (ko) | 2008-03-24 |
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