WO2007020214A2 - Procede et dispositif pour realiser un element organique - Google Patents

Procede et dispositif pour realiser un element organique Download PDF

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Publication number
WO2007020214A2
WO2007020214A2 PCT/EP2006/065180 EP2006065180W WO2007020214A2 WO 2007020214 A2 WO2007020214 A2 WO 2007020214A2 EP 2006065180 W EP2006065180 W EP 2006065180W WO 2007020214 A2 WO2007020214 A2 WO 2007020214A2
Authority
WO
WIPO (PCT)
Prior art keywords
printing
component
organic
stencil
organic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2006/065180
Other languages
German (de)
English (en)
Other versions
WO2007020214A3 (fr
Inventor
Jens FÜRST
Debora Henseler
Hagen Klausmann
Georg Wittmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE112006002045T priority Critical patent/DE112006002045A5/de
Publication of WO2007020214A2 publication Critical patent/WO2007020214A2/fr
Publication of WO2007020214A3 publication Critical patent/WO2007020214A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method and a device for producing an organic component.
  • the technical field of the invention relates to the production of polymer electronic components such as organic light-emitting diodes, organic solar cells, organic photodetectors or organic transistors.
  • Polymer electronics components are generally characterized by the fact that the application of the active organic layers on large areas by low-cost processes is possible. These processes include, on the one hand
  • the printing process offer process advantages, since in these subsequent removal of the organic layers, in particular at the contact pads and on the respective encapsulation edges, can be avoided.
  • the subsequent removal not only means an additional process step, but caused by the removal of the material also an undesirable contamination with particles. This is accompanied by a reduction of the process yield.
  • a structured application of the organic material enables easier contacting and encapsulation.
  • the object of the present invention is therefore to provide a simple and cost-effective method for To provide an organic component having sharp edge definitions.
  • a further object of the present invention is to provide a simple and, in particular, cost-effective method for producing an organic component, which ensures a homogeneous printed image when structuring the component.
  • the invention proposes a method for producing an organic component, in which at least one printing method step for structuring the component is carried out, wherein the printing method step comprises the following steps: providing a printing stencil which constitutes one of
  • Plastic-made adhesive film is formed on the component
  • a printing device for structuring an organic component by means of a printing stencil is also provided, wherein the stencil sheet is formed as an adhesive film made of plastic.
  • the adhesion printing stencil applied to the structuring adheres to the component to be structured so that the organic material can not run in under the stencil.
  • a very good homogeneity of the printed image and sharp edge definitions are possible.
  • the printing stencil is pressed against the component before the printing of the component with the applied organic material.
  • pressing the adhesive film printing stencil adherence to the component is improved and thus completely prevents the capillary underflow of the template. In addition, this will further increase the edge quality of the printed image.
  • the pressing of the printing stencil is performed on the component by means of a rigid, planar plate or by means of a roller.
  • a plurality of printing process steps are provided, and for each printing process step, a separate printing stencil, which is used only once, is used.
  • a peculiarity of the use of polymeric printing foils as templates for the coating with organic solutions is that the adhesion foils could absorb the solution and thereby swell. Therefore, it is advantageous to use a new film template for each printing step. This has the further advantage that it can not lead to contamination on the film bases. A cleaning of the film stencils is omitted and there is still no carryover of the organic solution between the individual printing steps.
  • the individual printing stencils of successive printing process steps are arranged on a film roll, wherein the film roll is further wound for each printing process step by means of a roll-to-roll process by one printing stencil.
  • the individual printing stencils of successive printing process steps are arranged on an additional carrier film, from which the printing stencil is detached after being pressed onto the component, and the carrier film is rolled up with the arranged printing stencils on a film roll.
  • the individual printing stencils of the successive printing process steps are arranged separably on the carrier film.
  • the printing stencils can be applied in a simple manner one behind the other on the organic component to be structured.
  • Printing device on: - first means, which provide the printing stencil on the component; second means applying an organic material to the provided printing stencil; and third means, which print the component with the applied organic material by means of the provided printing stencil.
  • a pressing device which presses the printing template to the component before the printing of the component with the organic material.
  • the pressing device is designed as a rigid, planar plate or as an additional carrier foil, from which the pressure stencil (2, 21-23) can be removed after being pressed onto the component (1).
  • the individual printing templates of the successive printing process steps and / or the carrier film have at least one positioning device in their edge region, which serves as a positioning aid for an exact positioning of the respective
  • Print template is used on the component to be printed.
  • the positioning device is designed for example as a recess or hole. As a result, the positioning of the printing stencil on the component to be structured is improved and the production process is further accelerated.
  • the organic component is designed as an organic light-emitting diode, organic solar cell, organic photodetector or as an organic transistor.
  • the organic material comprises an electron-transporting material, in particular a fullerene derivative and / or a material transporting holes, in particular a polythiophene.
  • an electron-transporting material in particular a fullerene derivative and / or a material transporting holes, in particular a polythiophene.
  • Figure 1 is a schematic view of a first embodiment of the present invention
  • Figure 2 is a schematic view of a second embodiment of the present invention.
  • Figure 3 is a schematic flow diagram of a preferred embodiment of the method according to the invention.
  • FIG. 1 shows a schematic view of a first embodiment of the present invention for producing an organic component 1.
  • the method according to the invention is characterized in that at least one printing process step for structuring the component 1 is carried out, in which an organic material is structured by means of a printing stencil 2 on the component 1, which is designed as an adhesive film made of plastic.
  • An adhesive film is, for example, a soft, very smooth plastic film made of PVC or PE, which adheres to smooth surfaces without adhesive. This adhesion is caused by loose molecular bonds (van der Waals bonds) between the boundary layers of the surfaces of the film and of the component 1 or of the substrate of the component 1.
  • the printing stencil 2 is pressed against the structuring of the organic material to the component 1.
  • the printing stencil 2 is pressed against the component 1 by means of a rigid, planar plate 3.
  • the plate 3 pin 6 and in the stencil 2 corresponding holes 5 are provided which serve as positioning aids for accurate positioning of the printing stencil 2 on the component to be printed 1.
  • the pin 6 engage in the positioning or holes 5 and hold the stencil 2 in a predetermined position, wherein at least the weight of the plate 3 presses the stencil 2 to the component 1. After fixing the printing film 2 can then start using a doctor blade, the actual printing.
  • the organic component 1 is preferably designed as an organic light-emitting diode, organic solar cell, organic photodetector or as an organic transistor.
  • the organic material preferably has an electron-transporting material, in particular a fullerene derivative and / or a hole-transporting material, in particular a polythiophene.
  • FIG. 2 shows a schematic view of a second embodiment of the present invention for producing an organic component 1, in which at least one printing process step for structuring the component 1 is performed.
  • an organic material is structured by means of a printing stencil 21-23 on the component 1, wherein the printing stencil 21-23 is formed as a made of plastic adhesive film.
  • the second exemplary embodiment according to FIG. 2 differs from the exemplary embodiment depicted in FIG. 1 in that the printing stencil 21-23 is pressed against the component 1 before structuring or before printing by means of an additional carrier film 4.
  • the carrier film 4 is detached after pressing on the component 1 of the printing stencil 21-23.
  • a separate printing stencil 21-23 used for each printing process step.
  • the individual printing stencils 21-23 of the successive printing process steps are arranged on a film roll which has a first roll 7 and a second roll 8 for winding and unwinding. By means of a roll-to-roll process between the first roll 7 and the second roll 8, a printing stencil 21-23 is further wound for each printing process step.
  • FIG. 2 shows the carrier film 4, from which a first printing stencil 21 has already been applied to the component 1 and which still carries a second printing stencil 22 and a third printing stencil 23.
  • the successive printing templates 21-23 are arranged on the carrier film 4 and are preferably separable from one another.
  • the successive printing stencils 21-23 and / or the carrier film 4 are provided with holes 5 in the edge region (see FIG. 1), which serve as positioning aids for exact positioning of the respective printing stencil 21-23 on the component 1 to be printed.
  • FIG. 3 shows a schematic flow diagram of a preferred exemplary embodiment of the method according to the invention for producing the organic component 1, in which at least one printing method step for structuring the component 1 is carried out.
  • the printing method step has the following method steps a to c:

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroluminescent Light Sources (AREA)
  • Printing Methods (AREA)

Abstract

La structure d'un élément organique est réalisée au moyen d'un écran d'impression constitué par une feuille adhésive en matière plastique.
PCT/EP2006/065180 2005-08-17 2006-08-09 Procede et dispositif pour realiser un element organique Ceased WO2007020214A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112006002045T DE112006002045A5 (de) 2005-08-17 2006-08-09 Verfahren und Vorrichtung zur Herstellung eines organischen Bauteils

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005038869.8 2005-08-17
DE102005038869 2005-08-17

Publications (2)

Publication Number Publication Date
WO2007020214A2 true WO2007020214A2 (fr) 2007-02-22
WO2007020214A3 WO2007020214A3 (fr) 2007-04-19

Family

ID=37654778

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/065180 Ceased WO2007020214A2 (fr) 2005-08-17 2006-08-09 Procede et dispositif pour realiser un element organique

Country Status (2)

Country Link
DE (1) DE112006002045A5 (fr)
WO (1) WO2007020214A2 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2924294B2 (ja) * 1991-06-06 1999-07-26 ブラザー工業株式会社 スタンプ装置
DE69304775T2 (de) * 1992-04-20 1997-05-15 Riso Kagaku Corp Schablonendruckverfahren und Druckvorrichtung mit Plattenherstellung
US6767774B2 (en) * 1999-12-28 2004-07-27 Intel Corporation Producing multi-color stable light emitting organic displays
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US7432124B2 (en) * 2003-11-04 2008-10-07 3M Innovative Properties Company Method of making an organic light emitting device

Also Published As

Publication number Publication date
WO2007020214A3 (fr) 2007-04-19
DE112006002045A5 (de) 2008-08-07

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