WO2007105009A3 - Ameliorations apportees a des circuits comprenant un substrat portant un ruban conducteur - Google Patents

Ameliorations apportees a des circuits comprenant un substrat portant un ruban conducteur Download PDF

Info

Publication number
WO2007105009A3
WO2007105009A3 PCT/GB2007/001009 GB2007001009W WO2007105009A3 WO 2007105009 A3 WO2007105009 A3 WO 2007105009A3 GB 2007001009 W GB2007001009 W GB 2007001009W WO 2007105009 A3 WO2007105009 A3 WO 2007105009A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive track
substrate
circuits
substrate carrying
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB2007/001009
Other languages
English (en)
Other versions
WO2007105009A2 (fr
Inventor
Keith Fawdington
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UVASOL Ltd
Original Assignee
UVASOL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UVASOL Ltd filed Critical UVASOL Ltd
Publication of WO2007105009A2 publication Critical patent/WO2007105009A2/fr
Publication of WO2007105009A3 publication Critical patent/WO2007105009A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)
  • Thin Film Transistor (AREA)
  • Credit Cards Or The Like (AREA)
  • Waveguide Aerials (AREA)

Abstract

Il arrive qu'un dispositif d'identification radiofréquence tombe en panne suite à une rupture de la connexion entre une micropuce montée sur un substrat en feuille et un ruban conducteur imprimé sur le substrat et formant une antenne du dispositif. Dans le but de résoudre ce problème, l'invention consiste à placer le ruban conducteur à l'intérieur d'un canal réalisé dans la surface du substrat et à disposer la micropuce de manière à ce qu'elle soit noyée dans le canal ou forme un seul tenant avec la matière constituant le substrat.
PCT/GB2007/001009 2006-03-16 2007-03-16 Ameliorations apportees a des circuits comprenant un substrat portant un ruban conducteur Ceased WO2007105009A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0605239.3 2006-03-16
GBGB0605239.3A GB0605239D0 (en) 2006-03-16 2006-03-16 Improvements in the application of conductive tracks to substrates

Publications (2)

Publication Number Publication Date
WO2007105009A2 WO2007105009A2 (fr) 2007-09-20
WO2007105009A3 true WO2007105009A3 (fr) 2008-03-06

Family

ID=36292820

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2007/001009 Ceased WO2007105009A2 (fr) 2006-03-16 2007-03-16 Ameliorations apportees a des circuits comprenant un substrat portant un ruban conducteur

Country Status (2)

Country Link
GB (2) GB0605239D0 (fr)
WO (1) WO2007105009A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
JP5540077B2 (ja) * 2009-04-20 2014-07-02 フレクストロニクス エイピー エルエルシー 小型ｒｆｉｄタグ
DE102013007042A1 (de) * 2013-04-24 2014-10-30 Gottfried Wilhelm Leibniz Universität Hannover Leiterplatte und Verfahren zum Herstellen einer Leiterplatte
WO2019108958A1 (fr) * 2017-12-01 2019-06-06 Avery Dennison Retail Information Services, Llc Étiquette en tissu flexible utilisant des ouvertures dans un substrat
CN116916851A (zh) * 2021-03-05 2023-10-20 圣犹达医疗用品心脏病学部门有限公司 用于超声导管的柔性电子电路

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
WO2001037622A2 (fr) * 1999-11-18 2001-05-25 Orga Kartensysteme Gmbh Couche support de conducteurs imprimes destinee a etre inseree par laminage dans une carte a puce, procede de production de cette couche, moule de moulage par injection permettant de mettre en oeuvre le procede de production de cette couche support
US20050072595A1 (en) * 2003-10-01 2005-04-07 Cho Se-Hoon Method of manufacturing substrate for circuit board and smart label having the substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
EP0676716A1 (fr) * 1994-03-07 1995-10-11 Eric Bauer Support portable d'informations numériques
DE19601202A1 (de) * 1996-01-15 1997-03-06 Siemens Ag Datenträgerkarte und Verfahren zu deren Herstellung
JP2003051646A (ja) * 2001-08-03 2003-02-21 Takagi Seiko Corp 成型回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
WO2001037622A2 (fr) * 1999-11-18 2001-05-25 Orga Kartensysteme Gmbh Couche support de conducteurs imprimes destinee a etre inseree par laminage dans une carte a puce, procede de production de cette couche, moule de moulage par injection permettant de mettre en oeuvre le procede de production de cette couche support
US20050072595A1 (en) * 2003-10-01 2005-04-07 Cho Se-Hoon Method of manufacturing substrate for circuit board and smart label having the substrate

Also Published As

Publication number Publication date
GB0705101D0 (en) 2007-04-25
WO2007105009A2 (fr) 2007-09-20
GB0605239D0 (en) 2006-04-26
GB2436221A (en) 2007-09-19

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