WO2007110053A3 - Backplane für einen elektronischen baugruppenträger - Google Patents

Backplane für einen elektronischen baugruppenträger Download PDF

Info

Publication number
WO2007110053A3
WO2007110053A3 PCT/DE2007/000526 DE2007000526W WO2007110053A3 WO 2007110053 A3 WO2007110053 A3 WO 2007110053A3 DE 2007000526 W DE2007000526 W DE 2007000526W WO 2007110053 A3 WO2007110053 A3 WO 2007110053A3
Authority
WO
WIPO (PCT)
Prior art keywords
backplane
mounting rack
electronic mounting
electronic
basic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2007/000526
Other languages
English (en)
French (fr)
Other versions
WO2007110053A2 (de
Inventor
Stefan Asch
Falk Steiner
Uwe Groeschner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adva Optical Networking SE
Original Assignee
Adva Optical Networking SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adva Optical Networking SE filed Critical Adva Optical Networking SE
Priority to US12/293,777 priority Critical patent/US8456857B2/en
Publication of WO2007110053A2 publication Critical patent/WO2007110053A2/de
Publication of WO2007110053A3 publication Critical patent/WO2007110053A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Die Erfindung betrifft eine Backplane für einen elektronischen Baugruppenträger mit einer Grundbackplane (1) mit mehreren Kontaktleisten, wobei auf der Grundbackplane (1) ein Freiraum vorgesehen ist, in welchen wenigstens eine Zusatzbackplane (3) einsetzbar ist.
PCT/DE2007/000526 2006-03-22 2007-03-21 Backplane für einen elektronischen baugruppenträger Ceased WO2007110053A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/293,777 US8456857B2 (en) 2006-03-22 2007-03-21 Backplane for an electronic mounting rack

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006013206.8 2006-03-22
DE102006013206A DE102006013206A1 (de) 2006-03-22 2006-03-22 Backplane für einen elektronischen Baugruppenträger

Publications (2)

Publication Number Publication Date
WO2007110053A2 WO2007110053A2 (de) 2007-10-04
WO2007110053A3 true WO2007110053A3 (de) 2007-11-29

Family

ID=38438288

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2007/000526 Ceased WO2007110053A2 (de) 2006-03-22 2007-03-21 Backplane für einen elektronischen baugruppenträger

Country Status (3)

Country Link
US (1) US8456857B2 (de)
DE (1) DE102006013206A1 (de)
WO (1) WO2007110053A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101217379A (zh) 2008-01-10 2008-07-09 华为技术有限公司 一种背板和通信设备
US9072191B2 (en) * 2010-12-30 2015-06-30 Schneider Electric It Corporation Configurable rack and related methods
US8989549B2 (en) 2012-08-29 2015-03-24 Telefonaktiebolaget L M Ericsson (Publ) Topology-defining cards for optically interconnected telecommunication systems
US9488673B1 (en) 2013-09-16 2016-11-08 Advanced Testing Technologies, Inc. Multi-standard instrumentation chassis
US9295169B1 (en) 2013-09-16 2016-03-22 Advanced Testing Technologies, Inc. Common chassis for instrumentation
US12464638B2 (en) * 2023-02-28 2025-11-04 Hyve Solutions Corporation Vibration dampening for high-density storage system structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5896473A (en) * 1996-06-26 1999-04-20 Rockwell International Corporation Re-configurable bus back-plane system
EP1221829A2 (de) * 2001-01-09 2002-07-10 TRW Inc. Segmentierte auswechselbare Rückwandleiterplatte für elektronisches Gerät
WO2003005790A1 (en) * 2001-07-05 2003-01-16 Tropic Networks Inc. Stacked backplane assembly

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5269693A (en) * 1991-11-25 1993-12-14 Nec Corporation Connector for printed circuit boards
US6349037B1 (en) * 1999-05-04 2002-02-19 International Business Machines Corporation Backplane for common building block
CA2354181A1 (en) * 2001-07-26 2003-01-26 Kontron Communications Inc. Modular computer system with passive backplane modules
US20050207134A1 (en) 2004-03-16 2005-09-22 Belady Christian L Cell board interconnection architecture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5896473A (en) * 1996-06-26 1999-04-20 Rockwell International Corporation Re-configurable bus back-plane system
EP1221829A2 (de) * 2001-01-09 2002-07-10 TRW Inc. Segmentierte auswechselbare Rückwandleiterplatte für elektronisches Gerät
WO2003005790A1 (en) * 2001-07-05 2003-01-16 Tropic Networks Inc. Stacked backplane assembly

Also Published As

Publication number Publication date
DE102006013206A1 (de) 2007-09-27
US20100214755A1 (en) 2010-08-26
WO2007110053A2 (de) 2007-10-04
US8456857B2 (en) 2013-06-04

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