WO2007121948A3 - Verfahren zur oberflächenbehandlung einer elektrischen substratoberfläche - Google Patents

Verfahren zur oberflächenbehandlung einer elektrischen substratoberfläche Download PDF

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Publication number
WO2007121948A3
WO2007121948A3 PCT/EP2007/003497 EP2007003497W WO2007121948A3 WO 2007121948 A3 WO2007121948 A3 WO 2007121948A3 EP 2007003497 W EP2007003497 W EP 2007003497W WO 2007121948 A3 WO2007121948 A3 WO 2007121948A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate surface
tool
treating
electrical substrate
metal ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/003497
Other languages
English (en)
French (fr)
Other versions
WO2007121948A2 (de
Inventor
Hans-Joachim Quenzer
Gerfried Zwicker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority to EP07724433A priority Critical patent/EP2010351B1/de
Priority to US12/295,321 priority patent/US8758590B2/en
Priority to JP2009505790A priority patent/JP5140661B2/ja
Publication of WO2007121948A2 publication Critical patent/WO2007121948A2/de
Publication of WO2007121948A3 publication Critical patent/WO2007121948A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00634—Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0146—Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Weting (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Physical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Beschrieben wird ein Verfahren zur Oberflächenbehandlung einer elektrisch leitenden Substratoberfläche (2), bei dem ein festes Ionen leitendes Material aufweisendes Werkzeug (1) wenigstens bereichsweise in Kontakt mit der Substratoberfläche gebracht wird, das Metallionen der Substratoberfläche zu leiten in der Lage ist und an das ein elektrisches Potenzial (U) angelegt wird, so dass zwischen der Substratoberfläche und dem Werkzeug ein elektrisches Potenzialgefälle derart anliegt, dass die Metallionen durch das Werkzeug von der Substratoberfläche abgezogen oder auf die Substratoberfläche abgeschieden werden.
PCT/EP2007/003497 2006-04-21 2007-04-20 Verfahren zur oberflächenbehandlung einer elektrischen substratoberfläche Ceased WO2007121948A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07724433A EP2010351B1 (de) 2006-04-21 2007-04-20 Verfahren zur oberflächenbehandlung einer elektrisch leitenden, metallischen substratoberfläche
US12/295,321 US8758590B2 (en) 2006-04-21 2007-04-20 Method for treating the surface of an electrically conducting substrate surface
JP2009505790A JP5140661B2 (ja) 2006-04-21 2007-04-20 導電性の基体表面の表面処理方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102006019189.7 2006-04-21
DE102006019189 2006-04-21
DE102006030323.7 2006-06-30
DE102006030323A DE102006030323A1 (de) 2006-04-21 2006-06-30 Verfahren zur Oberflächenbehandlung einer metallischen Substratoberfläche

Publications (2)

Publication Number Publication Date
WO2007121948A2 WO2007121948A2 (de) 2007-11-01
WO2007121948A3 true WO2007121948A3 (de) 2008-06-26

Family

ID=38536902

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/003497 Ceased WO2007121948A2 (de) 2006-04-21 2007-04-20 Verfahren zur oberflächenbehandlung einer elektrischen substratoberfläche

Country Status (5)

Country Link
US (1) US8758590B2 (de)
EP (3) EP2058076B1 (de)
JP (3) JP5140661B2 (de)
DE (1) DE102006030323A1 (de)
WO (1) WO2007121948A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009000073A1 (de) 2009-01-08 2010-07-15 Robert Bosch Gmbh Verfahren und Vorrichtung zur elektrochemischen Bearbeitung von Substraten
KR101613066B1 (ko) * 2011-12-06 2016-04-29 고꾸리쯔 다이가꾸 호우징 오사까 다이가꾸 고체산화물의 가공방법
US10838297B2 (en) 2016-09-16 2020-11-17 3M Innovative Properties Company Method of making a nanostructured cylindrical roll
US12071733B2 (en) 2022-08-18 2024-08-27 Wirtgen Gmbh Milling attachment with adjustable cover
CN117817059A (zh) * 2023-12-14 2024-04-05 南京工业职业技术大学 含活性金属成分非晶合金微细电解加工离子扩散控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825488A (ja) * 1981-08-10 1983-02-15 Tatsuya Suzuki 金の回収装置
US5795653A (en) * 1993-01-19 1998-08-18 International Business Machines Corporation Method for polishing a diamond or carbon nitride film by reaction with oxygen transported to the film through a superionic conductor in contact with the film
US20020197761A1 (en) * 2001-05-22 2002-12-26 Reflectivity, Inc. Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
WO2005008783A1 (ja) * 2003-07-18 2005-01-27 Nec Corporation スイッチング素子、スイッチング素子の駆動方法、書き換え可能な論理集積回路およびメモリ素子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL204868A (de) * 1955-02-25
US3653968A (en) 1970-05-04 1972-04-04 Union Carbide Corp Solid state electrochemical cells
US4155735A (en) * 1977-11-30 1979-05-22 Ppg Industries, Inc. Electromigration method for making stained glass photomasks
JP2515510B2 (ja) * 1986-08-26 1996-07-10 株式会社 ケミカル山本 鉄鋼材表面に施した亜鉛系被膜の除去方法
US5034023A (en) 1989-12-21 1991-07-23 Corning Incorporated Ceramic honeycomb structures as oxygen separators or concentrators
DE4242728A1 (de) * 1992-12-17 1994-06-23 Dornier Gmbh Keramische Gasanschlußbauteile für Brennstoffzellen mit Zirkonoxid-Festelektrolyt
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
DE19960790B4 (de) * 1999-12-16 2006-02-09 Mtu Aero Engines Gmbh Elektrode zum elektrochemischen Feinbohren von Werkstücken sowie Verfahren zu ihrer Herstellung
WO2005042810A2 (en) * 2003-10-31 2005-05-12 E.I Du Pont De Nemours And Company Membrane -mediated electropolishing
JP2005238420A (ja) * 2004-02-27 2005-09-08 Rikogaku Shinkokai 固体中のイオンおよび／または原子の操作方法
DE102004040217A1 (de) * 2004-08-19 2006-03-02 Mtu Aero Engines Gmbh Elektrode zum elektrochemischen Senken
JP2008539334A (ja) * 2005-04-29 2008-11-13 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 地形状にパターン化された膜を使用した膜介在電解研磨
JP5365829B2 (ja) * 2005-12-15 2013-12-11 日本電気株式会社 スイッチング素子およびその製造方法
US20070215480A1 (en) * 2006-03-16 2007-09-20 Fang Nicholas X Pattern transfer by solid state electrochemical stamping

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825488A (ja) * 1981-08-10 1983-02-15 Tatsuya Suzuki 金の回収装置
US5795653A (en) * 1993-01-19 1998-08-18 International Business Machines Corporation Method for polishing a diamond or carbon nitride film by reaction with oxygen transported to the film through a superionic conductor in contact with the film
US20020197761A1 (en) * 2001-05-22 2002-12-26 Reflectivity, Inc. Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
WO2005008783A1 (ja) * 2003-07-18 2005-01-27 Nec Corporation スイッチング素子、スイッチング素子の駆動方法、書き換え可能な論理集積回路およびメモリ素子
US20060164880A1 (en) * 2003-07-18 2006-07-27 Toshitsugu Sakamoto Switching element method of driving switching element rewritable logic integrated circuit and memory

Also Published As

Publication number Publication date
JP5640055B2 (ja) 2014-12-10
JP2009534523A (ja) 2009-09-24
EP2058076B1 (de) 2014-05-07
JP5484538B2 (ja) 2014-05-07
EP2010351A2 (de) 2009-01-07
EP2058076A2 (de) 2009-05-13
EP2058075A3 (de) 2013-02-13
EP2058076A3 (de) 2013-02-13
EP2058075B1 (de) 2014-06-18
JP5140661B2 (ja) 2013-02-06
US20090283416A1 (en) 2009-11-19
EP2058075A2 (de) 2009-05-13
EP2010351B1 (de) 2012-06-27
JP2013032593A (ja) 2013-02-14
JP2013040406A (ja) 2013-02-28
WO2007121948A2 (de) 2007-11-01
DE102006030323A1 (de) 2007-10-25
US8758590B2 (en) 2014-06-24

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