WO2007128015A3 - Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens - Google Patents

Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens Download PDF

Info

Publication number
WO2007128015A3
WO2007128015A3 PCT/AT2007/000205 AT2007000205W WO2007128015A3 WO 2007128015 A3 WO2007128015 A3 WO 2007128015A3 AT 2007000205 W AT2007000205 W AT 2007000205W WO 2007128015 A3 WO2007128015 A3 WO 2007128015A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed
circuit board
conductive element
producing
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2007/000205
Other languages
English (en)
French (fr)
Other versions
WO2007128015A2 (de
Inventor
Hannes Voraberger
Markus Riester
Lothar Schneider
Hendrik Weidmueller
Thomas Weissgaerber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical AT&S Austria Technologie und Systemtechnik AG
Publication of WO2007128015A2 publication Critical patent/WO2007128015A2/de
Publication of WO2007128015A3 publication Critical patent/WO2007128015A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/023—Emulsion inks
    • C09D11/0235—Duplicating inks, e.g. for stencil printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Verfahren zur Herstellung wenigstens eines leitfähigen Elements einer Leiterplatte, insbesondere einer leitfähigen Leiterbahn und/oder leitfähigen Verbindung von zwei oder mehreren Leiterplattenlagen, umfassend die folgenden Schritte: Bereitstellen einer aus Mikro- oder Nanopartikeln (1) und einer ein leitfähiges Metall enthaltenden Salzlösung bestehenden Mischung, Auftragen der Mischung auf eine Leiterplatte (6) entsprechend einem herzustellenden leitfähigen Element (7, 8), Wärmebehandeln der aufgetragenen Mischung zur Ausbildung eines durchgehend leitfähigen Elements (7, 8), und Durchführen der Wärmebehandlung unter reduzierender Atmosphäre. Darüber hinaus werden eine Leiterplatte (6) sowie eine Verwendung eines derartigen Verfahrens zur Verfügung gestellt.
PCT/AT2007/000205 2006-05-04 2007-04-30 Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens Ceased WO2007128015A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0036906U AT9473U1 (de) 2006-05-04 2006-05-04 Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens
ATGM369/2006 2006-05-04

Publications (2)

Publication Number Publication Date
WO2007128015A2 WO2007128015A2 (de) 2007-11-15
WO2007128015A3 true WO2007128015A3 (de) 2008-03-27

Family

ID=38180632

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2007/000205 Ceased WO2007128015A2 (de) 2006-05-04 2007-04-30 Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens

Country Status (2)

Country Link
AT (1) AT9473U1 (de)
WO (1) WO2007128015A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8663506B2 (en) * 2009-05-04 2014-03-04 Laird Technologies, Inc. Process for uniform and higher loading of metallic fillers into a polymer matrix using a highly porous host material
CN102598893A (zh) * 2009-08-17 2012-07-18 莱尔德电子材料(深圳)有限公司 具有多种填料的高电导率聚合物复合材料的形成
DE102011122283A1 (de) 2011-12-23 2013-06-27 Schoeller-Electronics Gmbh Elektrisch leitfähiges Bauelement und Verfahren zur Herstellung eines solchen Bauelements
AT512041B1 (de) * 2012-05-04 2013-05-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Verfahren zur Herstellung eines metallisierten Substrats
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1604130A (en) * 1967-08-17 1971-07-12 Production of ti,zr, or hf coatings for use - in printed or integrated circuits, brazing
JPH08199096A (ja) * 1995-01-26 1996-08-06 Mitsubishi Materials Corp 導電膜形成用組成物と透明導電膜被覆ガラス板の製造方法
GB2357281A (en) * 1999-12-16 2001-06-20 Univ Cranfield Fabrication of ceramic films
EP1113091A1 (de) * 1999-12-28 2001-07-04 TDK Corporation Transparenter leitender Film und Verfahren zu dessen Herstellung
EP1113090A1 (de) * 1999-12-28 2001-07-04 TDK Corporation Funktionsfilm und Verfahren zur Herstellung
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
WO2004005413A1 (en) * 2002-07-03 2004-01-15 Nanopowders Industries Ltd. Low sintering temperatures conductive nano-inks and a method for producing the same
JP2004119686A (ja) * 2002-09-26 2004-04-15 Harima Chem Inc 微細配線パターンの形成方法
US20050069648A1 (en) * 2001-12-18 2005-03-31 Mutsuhiro Maruyama Metal oxide dispersion
EP1626614A1 (de) * 2003-05-16 2006-02-15 Harima Chemicals, Inc. Verfahren zur herstellung eines elektrischen leiters des feinkupferpartikelsinterprodukttyps mit feiner form, verfahren zur herstellung einer feinkupferverdrahtung und eines dünnkupferfilms mit dem verfahren
EP1827066A2 (de) * 2006-02-23 2007-08-29 Air Products and Chemicals, Inc. Elektronenanlagerungsunterstützte Erzeugung elektrischer Leiter

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1604130A (en) * 1967-08-17 1971-07-12 Production of ti,zr, or hf coatings for use - in printed or integrated circuits, brazing
JPH08199096A (ja) * 1995-01-26 1996-08-06 Mitsubishi Materials Corp 導電膜形成用組成物と透明導電膜被覆ガラス板の製造方法
GB2357281A (en) * 1999-12-16 2001-06-20 Univ Cranfield Fabrication of ceramic films
EP1113091A1 (de) * 1999-12-28 2001-07-04 TDK Corporation Transparenter leitender Film und Verfahren zu dessen Herstellung
EP1113090A1 (de) * 1999-12-28 2001-07-04 TDK Corporation Funktionsfilm und Verfahren zur Herstellung
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
US20050069648A1 (en) * 2001-12-18 2005-03-31 Mutsuhiro Maruyama Metal oxide dispersion
WO2004005413A1 (en) * 2002-07-03 2004-01-15 Nanopowders Industries Ltd. Low sintering temperatures conductive nano-inks and a method for producing the same
JP2004119686A (ja) * 2002-09-26 2004-04-15 Harima Chem Inc 微細配線パターンの形成方法
EP1626614A1 (de) * 2003-05-16 2006-02-15 Harima Chemicals, Inc. Verfahren zur herstellung eines elektrischen leiters des feinkupferpartikelsinterprodukttyps mit feiner form, verfahren zur herstellung einer feinkupferverdrahtung und eines dünnkupferfilms mit dem verfahren
EP1827066A2 (de) * 2006-02-23 2007-08-29 Air Products and Chemicals, Inc. Elektronenanlagerungsunterstützte Erzeugung elektrischer Leiter

Also Published As

Publication number Publication date
WO2007128015A2 (de) 2007-11-15
AT9473U1 (de) 2007-10-15

Similar Documents

Publication Publication Date Title
WO2008127282A3 (en) Composition and associated method
TW200635685A (en) Composite wire for electrical discharge machining
WO2004068389A3 (en) Method of forming a conductive metal region on a substrate
WO2004085305A3 (en) Metal oxide-containing nanoparticles
EP2319643A4 (de) Metallische kupferdispersion, verfahren zur herstellung der metallischen kupferdispersion, elektrode, verkabelungsmuster und mithilfe der metallischen kupferdispersion geformter beschichtungsfilm, dekorativer artikel und antimikrobieller artikel mit dem darauf geformten beschichtungsfilm sowie verfahren zur herstellung des dekorativen artikels und des antimikrobiellen artikels
WO2010045594A3 (en) Flexible circuit assemblies without solder and methods for their manufacture
MY158913A (en) Material for electric contact and method of producing the same
WO2009063744A1 (ja) 金属ナノワイヤの製造方法、金属ナノワイヤ及び透明導電体
WO2009126204A8 (en) High aspect ratio openings
WO2008049006A3 (en) Materials for use with interconnects of electrical devices and related methods
WO2007014631A3 (de) Substrat, umfassend zumindest eine voll- oder teilflächige makrostrukturierte schicht, verfahren zu deren herstellung und deren verwendung
WO2007128015A3 (de) Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens
EP1698218A4 (de) Metallstruktur-erzeugungsverfahren, dadurch erhaltene metallstruktur, leiterplatte, verfahren zur erzeugung eines leitfähigen films und dadurch erhaltener leitfähiger film
TW200940743A (en) Copper conductive film and fabricating method thereof, conductive substrate and fabricating method thereof, copper conductive wire and fabricating method thereof and treatinh solution
WO2010030123A3 (ko) 금속 나노벨트, 이의 제조 방법, 이를 포함하는 도전성 잉크 조성물 및 전도성 필름
EP2307584A4 (de) Silberlegierung mit trübungsschutz
TW200644756A (en) Apparatus and method for making circuitized substrates in a continuous manner
WO2008146885A1 (ja) 電気電子部品用金属材料
WO2009125143A3 (fr) Procede de formation d'une couche d'amorcage de depot d'un metal sur un substrat
WO2008031492A8 (en) Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
EP1734068A4 (de) Polymerverbundformkörper, leiterplatte mit dem formkörper und herstellungsverfahren dafür
WO2007119123A3 (en) Interconnects and heat dissipators based on nanostructures
TW200733868A (en) Method for preparing conductive pattern and conductive pattern prepared by the method
WO2002017390A3 (de) Kühleinrichtung und verfahren zu deren herstellung
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit

Legal Events

Date Code Title Description
DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07718419

Country of ref document: EP

Kind code of ref document: A2