WO2007144164A2 - Procédé de fabrication d'une série de couches structurée sur un substrat - Google Patents

Procédé de fabrication d'une série de couches structurée sur un substrat Download PDF

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Publication number
WO2007144164A2
WO2007144164A2 PCT/EP2007/005222 EP2007005222W WO2007144164A2 WO 2007144164 A2 WO2007144164 A2 WO 2007144164A2 EP 2007005222 W EP2007005222 W EP 2007005222W WO 2007144164 A2 WO2007144164 A2 WO 2007144164A2
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
lift
printed
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/005222
Other languages
German (de)
English (en)
Other versions
WO2007144164A3 (fr
Inventor
Ulrich Schindler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leonhard Kurz Stiftung and Co KG
Original Assignee
Leonhard Kurz Stiftung and Co KG
Leonhard Kurz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonhard Kurz Stiftung and Co KG, Leonhard Kurz GmbH and Co KG filed Critical Leonhard Kurz Stiftung and Co KG
Publication of WO2007144164A2 publication Critical patent/WO2007144164A2/fr
Publication of WO2007144164A3 publication Critical patent/WO2007144164A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs

Definitions

  • the invention relates to a method for producing a structured layer sequence on a substrate, wherein first electrodes are provided spaced apart from one another on the substrate, a lift-off lacquer layer is partially printed in a subsequent method step, in a subsequent process step after drying of the partial lift -Off- lacquer layer the substrate over the entire surface with an active layer of a low-viscosity and slightly extending layer medium is printed, and in a subsequent process step after drying the active layer, the substrate is covered with a first metal layer, after which the partially printed lift-off lacquer layer of Substrate is removed.
  • the substrate may be a dimensionally stable or flexible substrate, i. Surface element, act of an electrically insulating material.
  • a structured and registered application of partial layers on a substrate is very difficult, in particular, if the media constituting the corresponding layer have a low viscosity, so that the said low-viscosity media can undesirably run light and, for example, registers Marks or partially applied to the substrate surface areas not shown position and / or size can be.
  • the said media may, for example, be paints, solutions or the like. Since the functionality and efficiency of an entire layer structure on a substrate, ie the structured layer sequence, but very much on the registration of the individual structured layers - and their exact surface dimensions - depends, it has been difficult to choose a common way of layer application.
  • a method of the type mentioned above for producing a structured layer sequence on a substrate is known from WO 200413922 A2.
  • the lift-off resist layer is immediately after partially printed on the substrate, the first electrode is partially printed on one of the first electrodes.
  • a method for structuring a substrate wherein in a first process step on the substrate, a drop of a solution of a first organic or inorganic material is applied, which due to its specific surface tension on the substrate a linsenförmiges cross-sectional profile a small contact angle of ⁇ 30 ° occupies.
  • the lenticular cross-sectional profile transforms into an annular profile with a central region, wherein the largest portion of the first material in the outer ring portion and a small portion of the first material is in the central area enclosed by the outer ring portion.
  • an etching process is carried out in which the thin film of material of the central region is removed from the substrate.
  • the invention has for its object to provide a method of the type mentioned, with which the above-mentioned shortcomings of a structured and registered application of partial layers on a substrate are eliminated by simple means and with which it is, for example, possible, inexpensive polymer. Produce solar cells.
  • the first electrodes spaced apart from one another on the substrate may be thin layers, thick layers, foils or the like.
  • the contact locks can be made by screen printing.
  • the contact locks may also be used, for example, in a roller printing process such as e.g. one
  • the substrate may consist of a dimensionally stable or of a flexible material.
  • the same can apply to the partial lift-off lacquer layer to be applied to the substrate and to the at least one at least single-layer active layer. These can also be produced, for example, by screen printing, gravure printing or the like.
  • the at least one active layer may be a semiconductor material if, for example, solar cells are to be realized with the method according to the invention.
  • the first metal layer covering the entire surface of the substrate may e.g. be realized as a thin film by sputtering, vacuum deposition o.
  • a second metal layer may be provided which is structured in such a way that it heats the respective first metal layer via the associated contact barrier and the adjoining free surface area between adjacent ones first electrodes with the adjoining second edge region of the adjacent first electrode, of which provided on this first electrode, at least one at least one layer active layer and the first metal layer spaced, electrically conductively connects.
  • the structured second metal layer results in a series connection of the individual cells which are each formed by a first electrode, the associated first metal layer and the at least one active layer located between them.
  • the at least one active layer is a semiconductor layer for the realization of polymer solar cell elements
  • the said series connection results in a summation of the electrical voltages of the individual cells.
  • the active layers used are, for example, a PE DOT / PSS (poly (3,4-ethylenedioxthiophene) poly (styrene sulfonate)) layer and a SC (semiconductor) layer, it being understood that the active layers are not limited thereto ,
  • the first metal layer in the area between the partially printed lift-off lacquer layers is provided with a resist layer before the partially printed lift-off lacquer layer is removed.
  • the resist layer is removed after removal of the partially printed lift-off lacquer layer.
  • a second metal layer is then provided on the substrate, which is structured in such a way that it contacts the respective first metal layer via the associated contact barrier and the adjoining free area between adjacent first electrodes with the adjoining second edge region of the adjacent first electrode, of which provided on this first electrode at least one at least one layer active layer and the spaced thereon provided on the first metal layer, electrically conductively connects. In this way, in turn results in a series connection of individual cells.
  • At least one cover layer is applied to the substrate after the application of the second metal layer.
  • This at least one cover layer can be applied to the substrate by means of an adhesive layer.
  • the at least one cover layer results in a protection of the formed on the substrate layer structure against mechanical and / or chemical effects from the outside. Further details, features and advantages will become apparent from the following description of the second schematic in the drawing and not to scale illustrated method for producing a patterned layer sequence on a substrate.
  • FIG. 1 in sections, in a side view, a layer sequence on a substrate
  • FIG. 2 in sections, in a side view, the finished layer structure after carrying out further method steps on the structure according to FIG. 1,
  • FIG. 3 is a side view similar to FIG. 1 of another method according to the invention.
  • FIG. 4 shows a side view of a method step following the method step according to FIG. 3,
  • Figure 5 is a similar to Figure 2 representation of the finished manufactured
  • FIG. 1 illustrates a substrate 10 made of an electrically insulating material.
  • the substrate 10 may have a dimensionally stable planar surface or be made of a flexible material.
  • the substrate 10 is provided on a main surface 12 with first electrodes 14 spaced from each other.
  • the first electrodes 14 may be formed by thin films, thick films, metal foils or the like.
  • contact stoppers 18 are printed on a first edge section 16 of the first electrodes 14.
  • a lift-off lacquer layer 20 is printed partially, which extends from the respective contact barrier 18 to the adjoining second edge region 22 of the adjacent first electrode 14 and thus the free area 24 between adjacent first electrodes 14, that is, between the respective contact point 18 and the second edge region 22 of the adjacent first electrode 14 that faces it.
  • the substrate 10 After drying the partial lift-off lacquer layer 20, the substrate 10 is over the entire surface with at least one at least one layer active layer 26, which may consist of a low-viscosity, easily flowing and thus difficult to be printed medium covered. This can be done by rolling, printing or the like.
  • the substrate 10 After drying the at least one at least single-layer active layer 26, the substrate 10 is covered over its entire surface with a first metal layer 28.
  • This metal layer 28 may be e.g. to act a thin film, which is produced by sputtering, vacuum evaporation o.
  • the partially printed lift-off lacquer layer 20 is removed with the located on it surface portion of the metal layer 28 from the substrate 10. This is illustrated schematically in Figure 1 by the arcuate brackets with arrow 30. This removal of the partially printed lift-off lacquer layer 20 is carried out by washing. In this case, not only the partial lift-off lacquer layer 20 is removed from the substrate 10, but also the respective provided on the lift-off lacquer layer 20 portion of the at least one at least one layer active layer 26 and the first metal layer 28.
  • the substrate 10 On the substrate 10 then remain that is to say the spaced-apart first electrodes 14, the surface sections of the at least one at least one active layer 26 provided on the first electrodes 14 and the first metal layer 28 provided thereon, which are bounded on the first edge section 16 of the respective first electrode 14 by the associated contact barrier 18, and the against the second edge region 22 of the respective first electrode 14 - the lift-off lacquer layer 20 according to - are reset area.
  • a second metal layer 32 may then be provided on the substrate 10, which is patterned such that it exposes the respective first metal layer 28 via the associated contact barrier 18 and the thereto adjoining free surface area 24 between adjacent first electrodes 14 with the adjoining second edge region 22 of the adjacent first electrode 14, from the provided on this first electrode 14 at least one at least one active layer 26 and the congruent provided with this first metal layer 28, electrically conductively connects , This spacing is designated A in FIG.
  • the structured second metal layer 32 thus results in a series connection of individual elements 34, which are each formed by a first electrode 14, the associated at least one at least one active layer 26, and the first metal layer 28 provided thereon.
  • FIG. 3 illustrates another method according to the invention, wherein prior to removing the partially printed lift-off lacquer layer 20, the first metal layer 28 is provided with a resist layer 38 in the region 36 between the partially printed lift-off lacquer layers 20. Thereafter, the partially printed lift-off lacquer layer 20 is washed off the substrate 10, i. removed, which is indicated in Figure 3 - as in Figure 1 - by the arcuate bracket with arrow 30. After detachment of the structured lift-off lacquer layer 20, this results
  • Layer substructures as illustrated in Figure 4.
  • the remaining structured resist layer 38 is removed again. This is indicated in Figure 4 by the arcuate bracket with arrow 40.
  • a structured metal layer 32 is provided on the substrate 10 - as has been explained above in connection with FIG. 2, in order to realize a series connection of the individual elements 34.
  • at least one cover layer 44 is applied to the substrate 10 by means of an adhesive layer 42.
  • FIGS. 1, 2 and 3 to 5 The same details are designated in FIGS. 1, 2 and 3 to 5 with the same reference numerals, so that it is not necessary to describe all details in detail in connection with all figures.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une série de couches structurée sur un substrat (10) sur lequel sont disposées des premières électrodes (14) séparées l'une de l'autre. Dans une première étape du procédé, une rupture de contact (18) est imprimée sur une première section périphérique (16) de chaque première électrode (14). Dans une deuxième étape du procédé, est appliquée une couche de vernis amovible (20) qui s'étend depuis les ruptures de contact (18) respectives sur la zone de surface libre (24) entre des premières électrodes (14) adjacentes jusqu'à la deuxième zone à la zone surface périphérique (22) adjacente de la première électrode (14) adjacente. Dans une troisième étape du procédé, le substrat (10) est imprimé sur toute sa surface avec au moins une couche active (26) au moins monocouche d'un fluide de couche à faible viscosité et s'écoulant facilement. Dans une quatrième étape du procédé, le substrat (10) est recouvert sur toute sa surface d'une première couche métallique (28), la couche de vernis amovible (20) partiellement appliquée étant ensuite éliminée du substrat (10).
PCT/EP2007/005222 2006-06-13 2007-06-13 Procédé de fabrication d'une série de couches structurée sur un substrat Ceased WO2007144164A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006027291.9 2006-06-13
DE102006027291A DE102006027291B4 (de) 2006-06-13 2006-06-13 Verfahren zur Herstellung einer strukturierten Schichtenfolge auf einem Substrat

Publications (2)

Publication Number Publication Date
WO2007144164A2 true WO2007144164A2 (fr) 2007-12-21
WO2007144164A3 WO2007144164A3 (fr) 2008-03-27

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PCT/EP2007/005222 Ceased WO2007144164A2 (fr) 2006-06-13 2007-06-13 Procédé de fabrication d'une série de couches structurée sur un substrat

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DE (1) DE102006027291B4 (fr)
TW (1) TW200814389A (fr)
WO (1) WO2007144164A2 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2373095A (en) * 2001-03-09 2002-09-11 Seiko Epson Corp Patterning substrates with evaporation residues
JP3975779B2 (ja) * 2002-03-01 2007-09-12 株式会社日立製作所 有機エレクトロルミネッセンス装置およびその製造方法
KR20050032114A (ko) * 2002-08-06 2005-04-06 아베시아 리미티드 유기 전기 소자
JP2005116193A (ja) * 2003-10-02 2005-04-28 Toyota Industries Corp 有機電界発光素子及び当該素子を備えた有機電界発光デバイス
DE102004024461A1 (de) * 2004-05-14 2005-12-01 Konarka Technologies, Inc., Lowell Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht

Also Published As

Publication number Publication date
DE102006027291B4 (de) 2010-06-17
WO2007144164A3 (fr) 2008-03-27
TW200814389A (en) 2008-03-16
DE102006027291A1 (de) 2007-12-27

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