WO2007149705A3 - Dispositif et procédé de modification de bord - Google Patents
Dispositif et procédé de modification de bord Download PDFInfo
- Publication number
- WO2007149705A3 WO2007149705A3 PCT/US2007/070617 US2007070617W WO2007149705A3 WO 2007149705 A3 WO2007149705 A3 WO 2007149705A3 US 2007070617 W US2007070617 W US 2007070617W WO 2007149705 A3 WO2007149705 A3 WO 2007149705A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- edge
- modifying
- disc
- apparatuses
- abrasive article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
L'invention concerne des dispositifs de modification de bord comprenant un porte-disque, une unité de modification de bord de disque comprenant un support d'article abrasif, et un moteur d'entraînement à oscillation linéaire et à vitesse uniforme couplé au porte-disque et/ou au support d'article abrasif. Le moteur d'entraînement à oscillation linéaire et à vitesse uniforme présente une vitesse sensiblement constante pendant au moins 80% de chaque demi-cycle d'oscillation. L'invention concerne également des procédés pour modifier le bord d'un disque au moyen de ces dispositifs.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/425,957 US20070298687A1 (en) | 2006-06-22 | 2006-06-22 | Apparatus and method for modifying an edge |
| US11/425,957 | 2006-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2007149705A2 WO2007149705A2 (fr) | 2007-12-27 |
| WO2007149705A3 true WO2007149705A3 (fr) | 2008-02-14 |
Family
ID=38834231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/070617 Ceased WO2007149705A2 (fr) | 2006-06-22 | 2007-06-07 | Dispositif et procédé de modification de bord |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20070298687A1 (fr) |
| TW (1) | TW200808492A (fr) |
| WO (1) | WO2007149705A2 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10328989A (ja) * | 1997-06-02 | 1998-12-15 | Speedfam Co Ltd | ウエハエッジの鏡面研磨方法及び装置 |
| US5868605A (en) * | 1995-06-02 | 1999-02-09 | Speedfam Corporation | In-situ polishing pad flatness control |
| JPH1148109A (ja) * | 1997-06-04 | 1999-02-23 | Speedfam Co Ltd | ワークエッジの鏡面研磨方法及び装置 |
| JPH11104942A (ja) * | 1997-10-02 | 1999-04-20 | Speedfam Co Ltd | ワークエッジの研磨方法及び装置 |
| US6283837B1 (en) * | 1998-08-20 | 2001-09-04 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Grinding machine |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1287900A (fr) * | 1969-08-29 | 1972-09-06 | ||
| US3986433A (en) * | 1974-10-29 | 1976-10-19 | R. Howard Strasbaugh, Inc. | Lap milling machine |
| US4067701A (en) * | 1975-12-03 | 1978-01-10 | Neway Manufacturing, Inc. | Grinding machine for carbide cutting elements |
| US4038783A (en) * | 1976-09-03 | 1977-08-02 | Leon Rosenthal | Method and apparatus for generating optic lenses |
| US4294042A (en) * | 1979-09-05 | 1981-10-13 | Johns-Manville Corporation | Apparatus and method for grinding a helical surface on a flat blade |
| US4365444A (en) * | 1980-06-24 | 1982-12-28 | Chwae John C | Drill point grinding machine |
| US4517769A (en) * | 1981-05-20 | 1985-05-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Method and apparatus for forming oblique groove in semiconductor device |
| JPS60197394A (ja) * | 1984-03-15 | 1985-10-05 | 日本たばこ産業株式会社 | 回転ドラム形カツタ−のナイフ研磨装置 |
| WO1993009397A1 (fr) * | 1991-10-28 | 1993-05-13 | A.E. Bishop & Associates Pty Limited | Appareil destine a la fabrication de soupapes pour des organes de direction assistee hydraulique_______________________________ |
| JPH06190709A (ja) * | 1992-12-28 | 1994-07-12 | Ryobi Ltd | 研磨盤 |
| JPH0815718B2 (ja) * | 1993-08-20 | 1996-02-21 | 株式会社島精機製作所 | 裁断刃の刃幅測定装置 |
| US5749769A (en) * | 1994-12-16 | 1998-05-12 | International Business Machines Corporation | Lapping process using micro-advancement for optimizing flatness of a magnetic head air bearing surface |
| US6159081A (en) * | 1997-09-09 | 2000-12-12 | Hakomori; Shunji | Method and apparatus for mirror-polishing of workpiece edges |
| JP3632489B2 (ja) * | 1999-03-02 | 2005-03-23 | 日本精工株式会社 | 内面研削方法および内面研削盤 |
| JP2005305586A (ja) * | 2004-04-20 | 2005-11-04 | Nihon Micro Coating Co Ltd | 研磨装置 |
-
2006
- 2006-06-22 US US11/425,957 patent/US20070298687A1/en not_active Abandoned
-
2007
- 2007-06-07 WO PCT/US2007/070617 patent/WO2007149705A2/fr not_active Ceased
- 2007-06-21 TW TW096122326A patent/TW200808492A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5868605A (en) * | 1995-06-02 | 1999-02-09 | Speedfam Corporation | In-situ polishing pad flatness control |
| JPH10328989A (ja) * | 1997-06-02 | 1998-12-15 | Speedfam Co Ltd | ウエハエッジの鏡面研磨方法及び装置 |
| JPH1148109A (ja) * | 1997-06-04 | 1999-02-23 | Speedfam Co Ltd | ワークエッジの鏡面研磨方法及び装置 |
| JPH11104942A (ja) * | 1997-10-02 | 1999-04-20 | Speedfam Co Ltd | ワークエッジの研磨方法及び装置 |
| US6283837B1 (en) * | 1998-08-20 | 2001-09-04 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Grinding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007149705A2 (fr) | 2007-12-27 |
| US20070298687A1 (en) | 2007-12-27 |
| TW200808492A (en) | 2008-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NENP | Non-entry into the national phase |
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