WO2008018379A1 - Appareil de scellement à résine - Google Patents

Appareil de scellement à résine Download PDF

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Publication number
WO2008018379A1
WO2008018379A1 PCT/JP2007/065249 JP2007065249W WO2008018379A1 WO 2008018379 A1 WO2008018379 A1 WO 2008018379A1 JP 2007065249 W JP2007065249 W JP 2007065249W WO 2008018379 A1 WO2008018379 A1 WO 2008018379A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
molded product
resin
sealing device
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/065249
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to CN2007800291946A priority Critical patent/CN101501829B/zh
Publication of WO2008018379A1 publication Critical patent/WO2008018379A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Definitions

  • the present invention relates to a technical field of a resin sealing device that seals a semiconductor product with a resin.
  • the semiconductor molding apparatus 1 includes a molding apparatus 11 for resin-molding a semiconductor chip, a take-out means 25 for taking out a workpiece 19 resin-molded by the molding apparatus 11 from the molding apparatus 11, and a take-out means 25.
  • a support 27 that receives the workpiece (molded product) 19; a cooling means 31 that cools the workpiece 19 received by the support 27; and the support 27 that is pressed between the support 27 and the support 27
  • a presser means (gate break means) 30 for collapsing the gate from the workpiece 19 in cooperation, an infrared camera 32 for photographing the workpiece 19 when the workpiece 19 is cooled by the cooling means 31, and an infrared camera 32
  • determining means 33 for determining the quality of the work 19 based on the photographed image.
  • the molded product resin-sealed in the mold is taken out before it is completely cooled (as soon as it is cooled to a level where it can be taken out), and the next Preparations are made for sealing. This is done to improve the cycle time of the apparatus.
  • the molded part immediately after sealing includes a cull part and a runner part that serve as a resin passage in the sealing process.
  • the gate resin unnecessary resin
  • the gate break process for removing the gate portion resin is provided.
  • the molded product immediately after resin sealing (the molded product of the force and the glue taken out from the mold) is still at a very high temperature as described above.
  • This causes inconveniences such as a part of the gate part to be left or a part to be left behind is removed together with the gate part. This is due to the fact that the resin has not been sufficiently cooled, and can be avoided by sufficient cooling.
  • the semiconductor mold apparatus 1 is cooled before the gate break process by the cooling means 31 integrally formed with the holding means (portion for performing the gate break process) 30! Has been done.
  • the molded product can be cooled only immediately before entering the gate break process, and the molded product is arranged at a position where the gate break can be performed. It is necessary to wait for a suitable time until it is sufficiently cooled.
  • This cooling time (the waiting time of the gate break means) directly affects the cycle time of the apparatus, and therefore becomes an impediment to shortening the cycle time.
  • the present invention has been made to solve such problems, and after sufficiently cooling the molded product, entering the gate break step eliminates the waiting time of the gate break means, and seals the resin.
  • the problem is to provide a resin sealing device that enables an accurate gate break while shortening the cycle time of the stopper.
  • the present invention provides a sealing means for sealing a molded product such as a semiconductor chip with a resin, and a gate break means for removing unnecessary resin from the molded product resin-sealed by the sealing means. And a cooling means for cooling the molded product before the molded product is gate-breaked, and a conveying means for conveying the cooled molded product from the cooling means to the gate break means.
  • the cooling means dedicated to cooling (high cooling effect) is interposed between the sealing means and the gate break means, and is conveyed to the gate break means via the conveyance means, thereby forming a molded product. It becomes possible to cool the molded product to a degree sufficient to cause a gate break when it is conveyed to the gate break means.
  • the gate break process can be started, and the “cooling time” of the molded article in the gate break means can be excluded from the cycle time controlling factor of the apparatus.
  • the gate breaks after sufficiently cooling it is possible to prevent remaining gates and gate breakage.
  • a plurality of sealing means are provided in parallel with respect to the specific gate break means.
  • a sealing device so-called multi-press type
  • the molded product is successively conveyed to one gate break means due to its structure.
  • cooling can be performed by utilizing this "waiting time for cooling", and an independent cooling means (that is, via a conveying means) is provided.
  • this does not affect the direction of extending the cycle time of the device.
  • the cooling means is configured so that a plurality of molded products can be cooled at the same time (a molded product conveyed from a plurality of sealing means can be cooled at the same time), the molded product can be sufficiently cooled more quickly.
  • the power to supply to the gate break means S Kurakura.
  • cooling means Various configurations can be adopted as the cooling means. For example, the following configurations are conceivable.
  • a set unit in which the molded product is set a cooling medium passage provided adjacent to the molded product set in the set unit, and a cooling medium supplied to the cooling medium passage If it is set as the structure provided with these, a cooling means is realizable with a simple structure.
  • the cooling medium is air and the set portion is provided with an air ejection hole for guiding the air to the molded product set from the cooling medium passage, A certain air can be directly injected to the molded product, and the molded product can be efficiently cooled. Furthermore, it is possible to easily and freely adjust the air at the desired temperature (cold air) at the desired timing, and to flexibly respond to the optimum conditions according to the size of the molded product and the type of resin S It becomes Kanakura.
  • the cooling efficiency by the cooling medium can be further improved.
  • the molded product when cooling is performed by ejecting air, the molded product can be effectively cooled without the ejected air (cold air) scattering around.
  • the set portion is covered with the cover. If the structure is provided with a set movement mechanism that can be contacted and separated, the warpage that can occur in the molded product during cooling can be minimized.
  • the cover has a two-divided structure and can be opened and closed at a predetermined timing, it can be configured to facilitate delivery of a molded product by the transport mechanism.
  • the molded product can be sufficiently cooled in a short time, and it is possible to prevent a gate break defect (gate remaining, gate breakage, adhesion remaining, etc.) due to insufficient cooling and adopt a configuration dedicated to cooling. Because it is easy, it is possible to minimize the warpage of the molded part if necessary.
  • a gate break defect gate remaining, gate breakage, adhesion remaining, etc.
  • FIG. 1 is a schematic configuration diagram of a resin sealing device that is an example of an embodiment of the present invention.
  • FIG. 5 Top view of another configuration example of cooling means (cooling means 200)
  • FIG. 9 Semiconductor mold device (resin sealing device) described in Patent Document 1.
  • the resin sealing device S includes a sealing means 300 for sealing a molded product such as a semiconductor chip with a resin, and a sealing means, as schematically shown in FIG. Cooling means 100 for cooling the molded product sealed with resin 300, gate break means 400 for removing unnecessary resin from the molded product cooled by the cooling means 100, and cooling the molded product after cooling Conveying means 600 for conveying from means 100 to gate break means 400 It is said that.
  • the resin sealing device S is a so-called multi-press type resin sealing device in which a plurality of sealing means 300 are provided in parallel to one gate break means 400.
  • the molded product from each sealing means 300 to the cooling means 100 is conveyed by the first conveying means 500, and the conveying from the cooling means 100 to the gate break means 400 is the second conveying. This is done by means 600.
  • the first transfer means 500 and the second transfer means 600 are configured as independent means, the cooling from the sealing means 300 is performed using the same transfer means. It is also possible to adopt a configuration in which the transport from the cooling means 100 to the gate break means 400 is performed up to the means 100.
  • 2 is a top view of the cooling means 100
  • FIG. 3 is a right side view thereof
  • FIG. 4 is a front view thereof.
  • the cooling means 100 includes a set portion 102 for placing a molded product after resin sealing, and four leg portions 130 that support the set portion 102.
  • the set part 102 is connected and fixed integrally with the leg part 130 by a set part fixing bolt 120.
  • the set part 102 is composed of a jig part 102A and a base part 102B. On the flat plate-like base part 102B, a jig part 102A having substantially the same size as the base part 102B is provided. The structure is arranged hierarchically. The jig portion 102A is positioned and fixed with respect to the base portion 102B by the positioning pins 103. A regulating valve 110 is provided on the right side surface of the base portion 102B, and a cooling medium pipe 111 extends from the regulating valve 110. With this regulating valve 110, it is possible to regulate the amount of the cooling medium passing through the regulating valve 110. The cooling medium pipe 111 is connected to a cooling medium supply device (not shown). Further, an air passage 112 is formed inside the base portion 102B, and the air passage 112 and the adjustment valve 110 communicate with each other!
  • the surface of jig part 102A (the upper surface in FIG. 3) has a shape corresponding to the shape of molded product 180 (for example, a shape imitated along the shape of molded product 180).
  • 180 is set.
  • the molded product 180 includes a package portion 180A in which a semiconductor chip or the like is sealed with a resin, and an unnecessary resin corresponding to a runner portion or a cull portion that becomes a resin passage in the sealing process (hereinafter, this unnecessary resin). Is simply referred to as the runner section 180B or the cal section 180C. The ) And multiple.
  • the jig portion 102A is provided with an air ejection hole 114 at the position of the cull portion 180C and the position of the runner portion 180B when the above-described molded product 180 is set.
  • the air ejection hole 114 communicates with the air passage 112 described above, and the cooling medium (air) supplied to the air passage 112 via the cooling medium pipe 111 and the regulating valve 110 can be ejected to the molded product 180. It is said that.
  • This air may be air that has been cooled in advance, or air at room temperature. Further, an inert gas such as nitrogen that is only air may be used.
  • clamp claws 160 capable of gripping the molded product 180 conveyed to the cooling means 100 are provided at substantially four corners of the jig portion 102A.
  • the clamp claw 160 is rotatably supported with respect to the jig portion 102A, and the molded product 180 conveyed to the set portion 102 can be held on the surface of the set portion 102 by a spring 162.
  • reference numeral 170 shown in the drawing is a part of the first conveying means 500 (the front end of the claw portion of the conveying means) in the resin sealing device S, and is not a component constituting the cooling means 100.
  • the set portion 102 is provided with four guide pins 116, and the guide pins 116 pass through guide holes (not shown) provided in the lead frame of the molded product 180, whereby the set portion 102 is set.
  • the molded product 180 can be positioned with respect to the portion 102.
  • the molded products 180 are sequentially formed by a plurality of sealing means 300 provided in parallel.
  • the molded product 180 is taken out from the sealing means 300 by the first conveying means (for example, unloader) 500 and simultaneously conveyed toward the cooling means 100.
  • the first conveying means for example, unloader
  • the molded product 180 is conveyed to the upper part of the cooling means 100, it is subsequently set in the setting unit 102.
  • the clamp claw 160 provided in the set unit 102 is released at a predetermined timing, and the set (placement) of the molded product 180 on the set unit 102 is allowed.
  • the clamp claw 160 is closed by the action of the spring 162, whereby the molded product 180 is clamped (gripped).
  • air cooling medium
  • the air temperature is optimally adjusted as appropriate depending on the type of molded product 180, the type of resin, and the like.
  • the amount of air supplied to the air passage 112 is also adjusted by the regulating valve 110. It can be adjusted optimally.
  • the air supplied to the air passage 112 is ejected from the air ejection hole 114 to the force nodule portion 180C and the runner portion 180B of the molded product 180. As a result, the temperature of the molded part 180, particularly the cull part 180C and the runner part 180B, is rapidly cooled.
  • the molded product 180 set in the setting unit 102 is securely held and fixed by the clamp claws, and the molded product 180 is not scattered or displaced by air injection.
  • the cooling time is shortened, cooling to a further lower temperature becomes possible.
  • the gate residue, gate breakage, adhesion remaining, etc. caused by insufficient resin cooling occur at the cull portion 180C and the runner portion 180B. That is very effective.
  • the molded product 180 is transported by the second transport means 600 to the goto break means 400.
  • unnecessary resin portions the cull portion 180 C and the runner portion 180B of the molded product 180 are removed.
  • the molded product 180 is conveyed to the gate break means 400 by disposing the cooling means 100 between the sealing means 300 and the gate break means 400 via the second conveyance means 600. It becomes possible to cool to a level sufficient for a gate break at that time. As a result, as soon as the molded article 180 is supplied to the gate break means 400, the gate break process can be started, and the “cooling time” for cooling the molded article can be eliminated from the cycle time controlling factor of the apparatus. In addition, since the gate breaks after sufficiently cooling, it is possible to prevent remaining gates and gate breakage.
  • the cooling means 100 is configured so that a plurality of molded products 180 can be cooled at the same time (a molded product 180 conveyed from a plurality of sealing means 300 can be cooled at the same time), More swift It becomes possible to supply the molded article 180 sufficiently cooled at a high speed to the gate break means 400.
  • the surface of the set portion 102 is cooled by circulating air through the closed air passage without providing the air ejection holes 114, and the molded product 180 is further cooled. It is also possible to configure as so-called “indirect cooling”. With this configuration, it is possible to cool the molded product more slowly than by directly injecting the cooling medium into the molded product, thus preventing “warping and cracking due to rapid cooling” that may occur depending on the type of resin. It is possible to prevent scattering of resin burrs and the like. In the case of such indirect cooling, it is possible to use a liquid such as water that cannot be directly injected to the molded product, and the cooling medium is not necessarily air. In the case of indirect cooling, not only a part of the molded product is extremely cooled, but the entire molded product is gradually cooled through the surface of the set part. It is possible to prevent warping and cracking due to the temperature difference.
  • FIG. 5 is a top view of the cooling means 200
  • FIG. 6 is a right side view thereof
  • FIG. 7 is a right side view thereof showing a state in which the set cover is closed
  • FIG. Fig. 7 arrow VIII direction is a direction in which the set cover is closed
  • the cooling means 200 is characterized in that the surface side (that is, the molded product) of the set part 202 is covered with the set part cover 240 at a predetermined timing compared to the cooling means 100 described above. .
  • the configuration of the set unit 202 in the cooling unit 200 is substantially the same as the configuration of the set unit 102 in the cooling unit 100 described above, and therefore, the same or similar parts are denoted by the same reference numerals in the last two digits. For the sake of brevity, explanations of duplicated configurations and actions are omitted.
  • the set part 202 in the cooling means 200 has a predetermined cylinder in the vertical direction (vertical direction in FIG. 6) by the first cylinder (set part moving mechanism) 250 via the leg part 230. It is possible to move up and down by imming.
  • a set cover 240 is provided on the left and right sides of the leg 230 (left and right in FIG. 6).
  • the set portion cover 240 is connected to the turning shaft 244 via a joint 256.
  • the rotating shaft 244 is supported on the base 290 by a shaft fixing block 254 having a bearing 245. ing. That is, the set cover 240 is supported so as to be rotatable about the axis of the turning shaft 244.
  • the swing shaft 244 is provided with an open / close sensor 258 (see FIG. 8) so that the open / close state of the set cover 240 can be detected.
  • the set cover 240 has a substantially “U” shape (see FIGS. 6 and 7) when viewed from the side, and is connected to the turning shaft 244 at the bottom portion of the “U”.
  • a cushioning material 249 is attached to the inner side (the first cylinder 250 side) of the connecting portion with the turning shaft 244 in the set cover 240.
  • the cushioning material 249 comes into contact with the stopper 246, the closing position of the set portion cover 240 is determined.
  • the outer side (on the side opposite to the first cylinder 250) of the connecting portion with the turning shaft 244 in the set portion cover 240 is connected to the second cylinder 252 (cylinder connecting portion 248).
  • the cylinder connecting portion 248 is driven up and down by the second cylinder 252, the set portion cover 240 is opened and closed.
  • the portion corresponding to the upper surface of the “U” is a cover portion 241 that covers the set portion 202, and this cover portion 241 is integrated with the bottom surface side of the “U” via the arm portion 242.
  • the cover part 241 has a configuration similar to the set part 202, and a base part 241B is placed on the substantially plate-shaped jig part 241A. Further, an air passage 247 is provided in the base portion 241B, and an air ejection hole 243 is provided in the jig portion 241A. That is, the cover part 241 is similar to the cover part 241 configured by reversing the vertical direction of the set part 202.
  • a cooling medium pipe (not shown) is also connected to the air passage 247 provided in the cover part 241 via the adjusting valve 260, so that air can be supplied from a cooling medium supply mechanism (not shown).
  • Delivery of the molded product 280 to the cooling means 200 is in the state shown in FIG. 6, that is, in the state where the set part cover 240 is opened and the set part 202 is raised by the first cylinder (set part moving mechanism) 250 Is done. In this state, the molded product 280 is received by the setting unit 202.
  • the set portion cover 240 has a two-divided structure and can be opened and closed at a predetermined timing, so that the molded product 280 can be easily delivered.
  • the set unit 202 is lowered by the action of the first cylinder 250 (lower side in FIG. 6), and the set unit cover 240 is closed, resulting in the state shown in FIG. Thereafter, the set part 202 rises again, and the molded product 280 set in the set part 202 rises in the direction of the cover part 241 (the jig part 24 1A). At this time, the molded product 280 is placed on the cover part 241 (the jig part 241A). Whether or not they are directly brought into contact with each other is appropriately changed according to the shape of the molded product 280, the allowable amount of warpage, the material, and the like.
  • the set part 202 and the molded product 280 are covered with the set part cover 240 (the cover part 241).
  • the set part cover 240 the cover part 241.
  • the opening / closing structure of the set portion cover 240 is not limited to the above-described configuration, but may be opened and closed, for example, in a sliding manner as long as the set portion can be effectively covered.
  • the present invention does not exclude application to a force single press type resin sealing device particularly effective for a so-called multi-press type resin sealing device.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Appareil de scellement à résine qui réalise une rupture de pont précise tout en assurant un réduction du temps de cycle de l'appareil de scellement à résine par l'entrée d'un objet moulé après un refroidissement satisfaisant dans une opération de rupture de pont. L'appareil de scellement à résine comprend des moyens (300) de scellement pour sceller un objet moulé, telle qu'une puce semi-conductrice, avec une résine, et des moyens (400) de rupture de pont pour retirer toute résine non désirée de l'objet moulé ayant subit le scellement à résine par les moyens (300) de scellement, et comprenant encore des moyens (100) de refroidissement pour refroidir l'objet moulé avant la rupture de pont de celui-ci, et des moyens (600) de distribution pour distribuer l'objet moulé après refroidissement, depuis les moyens (100) de refroidissement jusqu'au moyens (400) de rupture de pont.
PCT/JP2007/065249 2006-08-07 2007-08-03 Appareil de scellement à résine Ceased WO2008018379A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007800291946A CN101501829B (zh) 2006-08-07 2007-08-03 树脂密封装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-214326 2006-08-07
JP2006214326A JP4916810B2 (ja) 2006-08-07 2006-08-07 樹脂封止装置

Publications (1)

Publication Number Publication Date
WO2008018379A1 true WO2008018379A1 (fr) 2008-02-14

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Application Number Title Priority Date Filing Date
PCT/JP2007/065249 Ceased WO2008018379A1 (fr) 2006-08-07 2007-08-03 Appareil de scellement à résine

Country Status (5)

Country Link
JP (1) JP4916810B2 (fr)
KR (1) KR20090026819A (fr)
CN (1) CN101501829B (fr)
TW (1) TW200816331A (fr)
WO (1) WO2008018379A1 (fr)

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EP4099367A3 (fr) * 2021-06-03 2022-12-28 NXP USA, Inc. Contrôle de déformation de boîtier de dispositif à semiconducteur
US11791283B2 (en) 2021-04-14 2023-10-17 Nxp Usa, Inc. Semiconductor device packaging warpage control

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CN102756454B (zh) * 2011-04-27 2016-03-09 松下知识产权经营株式会社 树脂密封成形品的制造方法
JP2012044199A (ja) * 2011-10-04 2012-03-01 Sumitomo Heavy Ind Ltd 樹脂封止装置
JP5774538B2 (ja) * 2012-04-11 2015-09-09 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6304435B1 (ja) * 2017-07-25 2018-04-04 第一精工株式会社 基材の変形止め機構及び基材の変形止め方法
CN110976689B (zh) * 2019-12-02 2021-07-30 广东戴卡旭汽车零部件有限公司 一种轮毂旋压工艺
JP7275060B2 (ja) * 2020-02-05 2023-05-17 Ｔｏｗａ株式会社 除去機構、樹脂成形装置及び製造方法

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JPH0359813U (fr) * 1989-10-16 1991-06-12
JPH03173445A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 半導体プラスチックパッケージの製造装置
JPH0722544U (ja) * 1993-09-16 1995-04-21 住友精密工業株式会社 半導体モールド成形用ワーク取り出し装置
JP2001300976A (ja) * 2000-04-21 2001-10-30 Apic Yamada Corp 樹脂封止装置

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TW200816331A (en) 2008-04-01
JP4916810B2 (ja) 2012-04-18
JP2008041933A (ja) 2008-02-21

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