WO2008026470A1 - Imide complex, method for producing the same, metal-containing thin film and method for producing the same - Google Patents
Imide complex, method for producing the same, metal-containing thin film and method for producing the same Download PDFInfo
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- WO2008026470A1 WO2008026470A1 PCT/JP2007/066135 JP2007066135W WO2008026470A1 WO 2008026470 A1 WO2008026470 A1 WO 2008026470A1 JP 2007066135 W JP2007066135 W JP 2007066135W WO 2008026470 A1 WO2008026470 A1 WO 2008026470A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G33/00—Compounds of niobium
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G35/00—Compounds of tantalum
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/65—Metal complexes of amines
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
- C07C251/02—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups
- C07C251/04—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C251/06—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of a saturated carbon skeleton
- C07C251/08—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of a saturated carbon skeleton being acyclic
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/005—Compounds of elements of Group 5 of the Periodic Table without metal-carbon linkages
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
Definitions
- the present invention relates to a metal complex useful for the production of a semiconductor element, a production method thereof, a metal-containing thin film, and a production method thereof.
- PVD physical vapor deposition
- CVD chemical vapor deposition
- a material for forming a thin film by a CVD method or an ALD method is selected from materials that have an appropriate vapor pressure and thermal stability and can be vaporized with a stable supply amount. Furthermore, it is one of the necessary conditions that a film with a uniform film thickness can be formed on the surface of a complicated three-dimensional structure. Furthermore, it is preferable that it is liquid at the time of supply.
- amide compounds for example, Patent Document 1 and Non-Patent Document 1
- pentaalkoxides for example, Non-Patent Document 2
- amide compounds for example, Patent Document 1 and Non-Patent Document 1
- pentaalkoxides for example, Non-Patent Document 2
- NMe Nb
- N ⁇ u Nb
- NEt N ⁇ u
- ⁇ & ⁇ 3 ⁇ 4 ⁇
- Nb (OEt) and Ta (OEt) are a liquid at room temperature but has a low vapor pressure. Nb (OEt) and Ta (OEt) etc.
- the 2 3 5 5 pentaalkoxide is also liquid at room temperature but has a low vapor pressure.
- these compounds have their respective problems when used as raw materials for thin film formation by CVD or ALD, and are said to be the optimal raw materials!
- Patent Document 1 Japanese Patent Application Laid-Open No. 2006-131606
- Non-Patent Literature 1 Journal of Chinese Chemical Society, 45, 355 pages (1 998)
- Non-Patent Document 2 Chemistry of Materials, Vol. 12, p. 1914 (2000) Disclosure of Invention
- An object of the present invention is to provide a novel compound having a good vapor pressure and used as a raw material for producing a metal-containing thin film by a method such as a CVD method or an ALD method, a method for producing the compound, and the use thereof.
- the present invention provides a metal-containing thin film and a method for producing the same.
- the present inventors have obtained an imide complex represented by the general formula (1) and a method for producing the same, and a metal-containing thin film using the imide complex (1) as a raw material.
- the present inventors have found that the above problems can be solved by the membrane and the manufacturing method thereof, and have completed the present invention.
- the present invention relates to the general formula (1)
- M 1 represents a niobium atom or a tantalum atom
- R 1 represents an alkyl group having 1 to 12 carbon atoms
- R 2 represents an alkyl group having 2 to 13 carbon atoms
- MR 1 is as defined above, X is a halogen atom, L is a 1,2-dimethoxyethane ligand or a pyridine ligand. L is 1,2-dimethoxyethane coordination. In the case of a child, r is 1, and when L is a pyridine ligand, r is 2.)
- the present invention provides a compound of the general formula (4)
- R 1 represents an alkyl group having 1 to 12 carbon atoms
- the present invention is also a method for producing a niobium- or tantalum-containing thin film characterized by using an imide complex represented by the general formula (1) as a raw material.
- the present invention is a niobium- or tantalum-containing thin film manufactured by the above-described manufacturing method. The invention's effect
- the imide complex (1) of the present invention has a good vapor pressure, and using this as a raw material, a niobium or tantalum-containing thin film can be produced by a technique such as CVD or ALD.
- FIG. 1 shows the results of TG and DSC measured in Example 1.
- FIG. 2 shows the CVD film forming apparatus used in Examples 6 and 57 to 64 and Comparative Examples 3 to 6.
- FIG. 2 shows the CVD film forming apparatus used in Examples 6 and 57 to 64 and Comparative Examples 3 to 6.
- FIG. 3 shows the results of TG and DSC measured in Example 4.
- FIG. 4 shows the results of TG and DSC measured in Example 5.
- FIG. 5 shows the results of TG and DSC measured in Example 7.
- FIG. 6 shows the results of TG and DSC measured in Example 8.
- FIG. 7 shows the results of TG and DSC measured in Example 9.
- FIG. 8 shows the results of TG and DSC measured in Example 10.
- FIG. 9 shows the results of TG and DSC measured in Example 11.
- FIG. 10 shows the results of TG and DSC measured in Example 12.
- FIG. 11 shows the results of TG and DSC measured in Example 13.
- FIG. 12 shows the results of TG and DSC measured in Example 17.
- FIG. 13 shows the results of TG and DSC measured in Example 18.
- FIG. 14 shows the results of TG and DSC measured in Example 21.
- FIG. 15 shows the results of TG and DSC measured in Example 23.
- FIG. 16 shows the results of TG and DSC measured in Example 24.
- FIG. 17 shows the results of TG and DSC measured in Example 25.
- FIG. 18 shows the results of TG and DSC measured in Example 26.
- FIG. 19 is a diagram showing the results of TG measured in Comparative Example 1.
- FIG. 20 shows the results of TG measured in Comparative Example 2.
- Examples of the alkyl group having 1 to 12 carbon atoms represented by R 1 include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec butyl group, tert butyl group, pentyl group, Isopentyl group, neopentyl group, tert pentyl group, 1-methylbutynol group, 2-methylbutyl group, 1,2-dimethylpropyl group, hexyl group, isohexyl group, 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group Group, 1,1 dimethylbutyl group, 1,2-dimethylinobutinore group, 2,2-dimethylenobutinore group, 1,3-dimethylenobutinore group, 2,3 dimethylbutyl group, 3,3 dimethylbutyl group , 1-ethylbutyl group, 2-ethyno
- Examples of the alkyl group having 2 to 13 carbon atoms represented by R 2 include an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec butyl group, a tert butyl group, a pentyl group, and an isopentyl group.
- the imide complex (1) has a favorable vapor pressure, and R 1 is preferably an alkyl group having 1 to 10 carbon atoms, and R 2 is an alkyl group having 2 to 10 carbon atoms. In particular, an isopropyl group or a tert butyl group is preferable. Particularly when M 1 is a niobium atom, R 1 is more preferably a propyl group, an isopropyl group or a tert butyl group, and R 2 is a tert butyl group. When M 1 is a tantalum atom, more preferably, R 1 is an isopropylinole group or a tert butynole group, and R 2 is a tert butynole group.
- Production method 1 is a method for producing the imide complex (1) of the present invention by reacting the compound (2) with an alkali metal alkoxide (3).
- Production method 1 can be carried out in an organic solvent.
- the organic solvent include hydrocarbons such as pentane, hexane, heptane, octane, benzene, tolylene, ethynolebenzene, and xylene, jetyl ether, and diisopropyl ether.
- examples include ethers such as 1,2-dimethoxyethane, dioxane, tetrahydrofuran and cyclopentylmethyl ether, which can be used alone or in combination. From the viewpoint of good yield, it is preferable to use tetrahydrofuran, hexane, toluene, or a mixture of hexane and toluene.
- the reaction temperature is not limited, but the imide complex (1) can be obtained in good yield by reacting at a temperature appropriately selected from the range of -80 ° C to 150 ° C. I can do it.
- the reaction time is not limited, but the imide complex (1) can be obtained in good yield by reacting for a time appropriately selected from the range of 1 hour to 150 hours. Yield of imide complex (1) It is more preferable that the reaction is carried out at a temperature in the range of 15 ° C to 110 ° C for 6 hours to 48 hours.
- the reaction is preferably carried out in an argon or nitrogen atmosphere in terms of good yield of the imide complex (1).
- X is preferably a chlorine atom from the viewpoint of good yield.
- M 2 is a lithium atom, a sodium atom or a potassium atom from the viewpoint of good yield, and it is particularly preferably a lithium atom.
- the obtained imide complex (1) of the present invention can be isolated by ordinary post-treatment.
- the starting compound (2) in the production method 1 is obtained by a known method (for example, Inorganic Chemistry, 36, 2647 (1997) or Journal of Chinese Chemical Society, 45, 355 (1998)). It can be easily synthesized with reference.
- Production method 2 is a method for producing the imide complex (1) of the present invention by a reaction between the compound (4) and the alcohol (5).
- Organic solvents include hydrocarbons such as pentane, hexane, heptane, octane, benzene, tolylene, ethynolebenzene, xylene, jetyl ether, diisopropyl ether, 1,2-dimethoxyethane, dioxane, tetrahydrofuran, cyclopentyl.
- Ethers such as methyl ether can be exemplified, and these can be used alone or in combination. Hexane or toluene is preferred because of its good yield.
- the reaction temperature is not limited, but the imide complex (1) can be obtained in a high yield by reacting at a temperature appropriately selected from the range of -20 ° C to 100 ° C. I can do it.
- the reaction time is not limited, the imide complex (1) can be obtained in good yield by reacting for a time appropriately selected from the range of 1 hour to 150 hours. In view of particularly good yield of the imide complex (1), it is more preferable to react at a temperature within the range of 0 ° C to 50 ° C for 6 to 48 hours.
- the reaction is preferably carried out in an argon or nitrogen atmosphere in terms of good yield of the imide complex (1).
- R 3 and R 4 are both methyl groups or both ethyl groups in terms of yield!
- the obtained imide complex (1) of the present invention can be isolated by ordinary post-treatment.
- the raw material compound (4) in the production method 2 is obtained by a known method (for example, Journal of Chinese Chemical Society, Vol. 45, d55 Hessie (1998) or Inorganic Chemistry, Vol. 22, p. 965 (1983)). It can be easily synthesized with reference.
- the raw material compound (4) in production method 2 is preferably produced by the following steps in terms of a high yield. That is, it is a method for producing compound (4) by reaction of compound (2) with lithium dialkylamide (6).
- compound (4) is obtained by reacting compound (2) with lithium dialkylamide (6).
- This reaction can be carried out in an organic solvent.
- the organic solvent include hydrocarbons such as pentane, hexane, heptane, octane, benzene, tonolene, ethynolebenzene, and xylene, jetyl ether, diisopropyl ether, 1,2-dimethoxetane, dixanthane, tetrahydrofuran, cyclohexane.
- ethers such as pentinolemethinoreethenore can be used, and these can be used alone or in combination. From the viewpoint of good yield, it is preferable to use hexane, toluene or a mixture of hexane and toluene.
- the reaction temperature is not limited, but the compound (4) can be obtained in a high yield by reacting at a temperature appropriately selected from the range of 80 ° C to 100 ° C. .
- the reaction time is not limited, but the compound (4) can be obtained in good yield by reacting for a time appropriately selected from the range of 4 hours to 150 hours. It is more preferable to react at a temperature in the range of 0 ° C to 50 ° C for 6 hours to 72 hours, in that the yield is much better.
- the reaction is preferably carried out in an argon or nitrogen atmosphere because of the high yield of the compound (4).
- X is preferably a chlorine atom from the viewpoint of good yield.
- both R 3 and R 4 are methyl groups or both ethyl groups.
- the compound (4) obtained in this step can be used as a raw material compound in the above-mentioned production method 2 without isolation, and can be used for the reaction as it is. You may use for reaction of the manufacturing method 2.
- Production method 3 is a method for producing an imide complex (1) by reaction of compound (la) with amine (7).
- Production method 3 can be carried out in an organic solvent, but can be carried out without using an organic solvent.
- the organic solvent include hydrocarbons such as pentane, hexane, heptane, octane, benzene, toluene, ethylbenzene, and xylene, jetyl ether, diisopropyl ether, 1,2-dimethoxyethane, dioxane, tetrahydrofuran, cyclohexane.
- Examples include ethers such as pentyl methyl ether, and these can be used alone or in combination. From the viewpoint of good yield, it is preferable to carry out the reaction in a method without using a solvent or in hexane or toluene.
- the reaction temperature is not limited, but the imide complex (1) can be obtained in good yield by reacting at a temperature appropriately selected from the range of 10 ° C to 150 ° C. I can do it.
- the reaction time is not limited, but the imide complex (1) can be obtained in good yield by reacting for a time appropriately selected from the range of 4 hours to 150 hours. Yield power of imide complex (1) S It is more preferable that the reaction is carried out at a temperature in the range of 20 ° C to 50 ° C for 8 hours to 72 hours.
- the reaction is preferably carried out in an argon or nitrogen atmosphere in terms of good yield of the imide complex (1).
- the obtained imide complex (1) of the present invention can be isolated by ordinary post-treatment.
- Production method 4 includes niobium or tantalum pentahalide (8) and alkali metal alkoxide (3
- Production method 4 can be carried out in an organic solvent.
- the organic solvent include hydrocarbons such as pentane, hexane, heptane, cyclohexane, octane, benzene, tonolene, ethynolebenzene, and xylene, and jetyl.
- Ethers such as ether, diisopropyl ether, 1,2-dimethoxy shetan, di-xane, tetrahydrofuran, cyclopentinolemethinole ethere Tellurium can be exemplified, and these can be used alone or in combination.
- Pentane, hexane, heptane, and cyclohexane are preferred, and hexane is more preferred from the viewpoint of good yield.
- the reaction temperature is not limited, but the imide complex (1) can be obtained in good yield by reacting at a temperature appropriately selected from the range of -80 ° C to 150 ° C. I can do it.
- the reaction time is not limited, but the imide complex (1) can be obtained in good yield by reacting for a time appropriately selected from the range of 4 hours to 150 hours. Yield of imide complex (1) It is more preferable that the reaction is carried out at a temperature in the range of 15 ° C to 110 ° C for 6 hours to 48 hours.
- the reaction is preferably carried out in an argon or nitrogen atmosphere because the yield of the imide complex (1) is good.
- the metal halide (8) as a raw material niobium pentachloride or tantalum pentachloride is preferable in terms of a good yield.
- M 2 is a lithium atom, a sodium atom or a potassium atom in terms of a good yield, and it is particularly preferably a lithium atom.
- Alkali metal alkoxide (3) for example an alcohol R 2 OH and how reacting an alkali metal or an alcohol R 2 OH and can be prepared by a method of reacting alkyl lithium.
- the raw material lithium amide (9) is, for example, an alkyl lithium and an amine ⁇ ⁇ ⁇ ⁇
- alkali metal alkoxide (3) and lithium amide (9) prepared by these methods can be used with or without purification.
- Alkali metal alkoxide (3) and lithium amide (9) can be prepared as a mixed solution in the same system and used as they are.
- the resulting imide complex (1) of the present invention can be isolated by ordinary post-treatment.
- a niobium or tantalum-containing thin film can be produced.
- the method for producing the niobium or tantalum-containing thin film For example, when producing a niobium or tantalum-containing thin film by the CVD method or the ALD method, the imidazole complex (1) is gasified and supplied onto the substrate. .
- an imide complex (1) is put in a heated thermostat and a carrier gas such as helium, neon, argon, krypton, xenon or nitrogen is blown into a gas, or an imide complex ( 1) that There is a method in which it is used as a solution or as a solution, and these are sent to a vaporizer and heated to be gasified in the vaporizer.
- a carrier gas such as helium, neon, argon, krypton, xenon or nitrogen
- Solvents used in the case of a solution include ethers such as 1,2-dimethoxyethane, diglyme, triglyme, dioxane, tetrahydrofuran, cyclopentylmethyl ether, hexane, cyclohexane, methylcyclohexane, and ethylcyclohexane. , Hydrocarbons such as heptane, octane, nonane, decane, benzene, tonolene, ethynolebenzene, and xylene.
- ethers such as 1,2-dimethoxyethane, diglyme, triglyme, dioxane, tetrahydrofuran, cyclopentylmethyl ether, hexane, cyclohexane, methylcyclohexane, and ethylcyclohexane.
- Hydrocarbons such as heptane,
- a metal-containing thin film can be produced by reacting a gas. Decomposition is possible only by heating, but plasma or light may be used in combination.
- Me is a methyl group
- Et is an ethynole group
- Pr is a propyl group
- 3 ⁇ 4 ⁇ is a tert-butyl group
- 3 ⁇ 4u is a sec-butyl group
- dme represents a 1,2-dimethoxyethane ligand.
- tert-butanoic acid tert-butylimido tris (dimethylamido) niobium (Nb ( ⁇ 3 ⁇ 4 u) (NMe)
- tert-butylimido tris (dimethylamido) niobium (Nb ( ⁇ 3 ⁇ 4 u) (NMe)
- NMe niobium
- step 2 To the light yellow solution obtained in step 1, 2.37 g (32. Ommol) of tert-butanol was added and stirred at room temperature for 6 hours. The solvent was distilled off under reduced pressure, and the residue was distilled to obtain a colorless solution. 2.98 g of liquid was obtained (step 2; yield 73%, yield 58% through steps 1 and 2). Dissolve this liquid in CD
- Nb (N'Pr) (O ⁇ u) The vapor pressure of Nb (N'Pr) (O ⁇ u) was measured and found to be 0.1 lTorr at 49 ° C.
- the film was formed on the / Si substrate for 1 hour.
- the prepared film was measured with a fluorescent X-ray analyzer
- the Nb characteristic X-ray was detected, and the film composition was confirmed by X-ray photoelectron spectroscopy. It was niobium oxide. When the film thickness was confirmed by SEM, it was about 40 nm.
- Nb (NtBu) Cl (dme) 2.96 g (8.21 mmol)
- a slurry of potassium tert-butoxide (2 ⁇ 77 g, 24.6 mmol) suspended in 15 mL of hexane was added, and the mixture was stirred at room temperature for 15 hours. Insoluble matter was filtered, and the solvent was distilled off under reduced pressure. The residue obtained was distilled to obtain 1.79 g of colorless liquid (yield 57%). This liquid was dissolved in CD and measured for 1 H NMR and 13 C NMR spectra.
- tert pentanol 8 was added to a solution of 1.45 g (3. 29 mmol) in 7 ml of tonolene (Ta (NEt) (N Et)) in 6 ml of tonolene.
- tert-butanol 9.26 g was added to 79 mL of butyllithium in hexane (1.58 M) and stirred at room temperature for 12 hours to prepare a lithium tert-butoxide solution. This was added to a solution of (tert-butylimido) triclo (1,2,2-dimethoxyethane) tantalum (Ta (N ⁇ u) CI (dme)) 18.6g (41.6 mmol) dissolved in 80ml of toluene,
- the vapor pressure of Ta CN ⁇ u) (O ⁇ u) was measured and found to be O.lTorr at 50 ° C.
- tert-butanol 1.73 g was added to 14.9 mL of butyllithium hexane solution (1.57 M), and the mixture was stirred at room temperature for 1 hour to prepare a lithium tert-butoxide solution.
- Fig. 19 shows the results of TG measured under the condition of a heating rate of 10 ° C / min in an atmosphere in which argon was circulated at 400 ml / min. It is clear that the vaporization characteristics are worse than the imide complex (1) of the present invention.
- Nb (OEt) vapor pressure measured was 120. In C, it was 0 ⁇ lTorr.
- Fig. 20 shows the results of TG measured under the condition of a heating rate of 10 ° C / min in an atmosphere in which argon was circulated at 400 ml / min. Vaporization characteristics compared to the imide complex (1) of the present invention It is clear that the sex is bad.
- tert-butanol 1.39 g and tert-pentylamine 1.09 g were added to 18.9 mL of butyllithium hexane solution (1.65 M), and the mixture was stirred at room temperature for 12 hours.
- This solution was added to 2.24 g (6.25 mmol) of tantalum pentachloride in a hexane (5 mU suspension) and stirred at room temperature for 24 hours, insoluble matters were filtered off, and the solvent was distilled off from the filtrate under reduced pressure. The residue was distilled under reduced pressure to obtain 2.04 g of colorless liquid (yield 67%), which was dissolved in CD and measured for 1 H NMR and 13 C NMR spectra.
- dipentyl chloride 7 ⁇ 63 g (28.2 mmol) was suspended in a mixture of 50 mL toluene and 5 mL jetyl ether, and 6 ⁇ 89 g sodium metasilicate and 1, 1, 3, 3 -tetra 7.30 g of methyl butylamine was added in order.
- 15. OmL of pyridine was added and further stirred for 24 hours. Insoluble matters were filtered off, and the solvent and excess pyridine were distilled off from the filtrate under reduced pressure to obtain 10.7 g (22. Ommol) of a pale yellow solid. Yield 78%.
- Nb (NCMe CH CMe) C1 (pyridine) 1.6 in 5 mL of toluene under argon atmosphere
- Nb (NCMe CH CMe) (NMe) 410 mg (l. 16 mmol) A solution dissolved in 4 mL of toluene was cooled to ⁇ 78 ° C., and a solution of isopropyl alcohol (210 mg) in toluene (4 mL) was added dropwise over 30 minutes. After stirring at room temperature for 4 hours, the solvent was distilled off under reduced pressure. The residue was sublimed under reduced pressure to give 310 mg of white solid (yield 67%)
- the film was formed on the / Si substrate for 1 hour.
- Nb characteristic X-rays were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was niobium oxide.
- the film thickness was about 210 nm.
- the film was formed on the / Si substrate for 1 hour.
- Nb characteristic X-rays were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was niobium oxide.
- the film thickness was about 220 nm.
- the film was formed on the Si substrate for 1 hour.
- characteristic X-rays of Nb were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was a niobium oxide.
- the film thickness was about 250 nm.
- the film was formed on the Si substrate for 1 hour.
- the produced film was measured with a fluorescent X-ray analyzer, characteristic X-rays of Nb were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was a niobium oxide.
- the film thickness was about 240 nm.
- the raw material temperature is 98 ° C and the carrier gas (Ar)
- the raw material temperature is 98 ° C and the carrier gas (Ar)
- the film was formed on the Si substrate for 1 hour.
- the produced film was measured with a fluorescent X-ray analyzer, Ta characteristic X-rays were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was tantalum oxide.
- the film thickness was about 270 nm.
- the raw material temperature is 40 ° C
- the carrier gas is
- the film was formed on the Si substrate for 1 hour.
- the produced film was measured with a fluorescent X-ray analyzer, Ta characteristic X-rays were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was tantalum oxide.
- the film thickness was about 340 nm.
- the raw material temperature is 40 ° C
- the carrier gas is
- the film was formed on the Si substrate for 1 hour.
- the produced film was measured with a fluorescent X-ray analyzer, Ta characteristic X-rays were detected.
- the film composition was confirmed by X-ray photoelectron spectroscopy, it was tantalum oxide.
- the film thickness was about 120 nm.
- the imide complex (1) of the present invention has a good vapor pressure and is used as a raw material, for example, CVD.
- Niobium or tantalum-containing thin films can be produced by techniques such as the ALD method or the ALD method. The industrial value of the present invention is remarkable.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007800322925A CN101511772B (zh) | 2006-08-28 | 2007-08-20 | 酰亚胺络合物、其制造方法、含金属薄膜及其制造方法 |
| US12/439,364 US7906668B2 (en) | 2006-08-28 | 2007-08-20 | Imide complex, method for producing the same, metal-containing thin film and method for producing the same |
| EP07792748A EP2058295B1 (en) | 2006-08-28 | 2007-08-20 | Imide complex, method for producing the same, metal-containing thin film and method for producing the same |
| KR1020097003915A KR101369366B1 (ko) | 2006-08-28 | 2007-08-20 | 이미드 착체, 그 제조방법, 금속 함유 박막 및 그 제조방법 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-231081 | 2006-08-28 | ||
| JP2006231081 | 2006-08-28 | ||
| JP2007079924 | 2007-03-26 | ||
| JP2007-079924 | 2007-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008026470A1 true WO2008026470A1 (en) | 2008-03-06 |
Family
ID=39135752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/066135 Ceased WO2008026470A1 (en) | 2006-08-28 | 2007-08-20 | Imide complex, method for producing the same, metal-containing thin film and method for producing the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7906668B2 (ja) |
| EP (1) | EP2058295B1 (ja) |
| JP (1) | JP5148186B2 (ja) |
| KR (1) | KR101369366B1 (ja) |
| CN (1) | CN101511772B (ja) |
| TW (1) | TWI380974B (ja) |
| WO (1) | WO2008026470A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| HUE042926T2 (hu) * | 2010-05-28 | 2019-07-29 | Nippon Catalytic Chem Ind | Fluorszulfonil-imid alkálifém só, és eljárás annak elõállítására |
| EP2573097A1 (en) * | 2011-09-22 | 2013-03-27 | L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Niobium-organic compounds and their use for thin films deposition |
| EP2573096A1 (en) * | 2011-09-22 | 2013-03-27 | L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Tantalum-organic compounds and their use for thin films deposition |
| TWI618712B (zh) | 2012-12-28 | 2018-03-21 | 東曹股份有限公司 | 第五族金屬側氧基-烷側氧基錯合物及其製造方法、製膜用材料及第五族金屬氧化物膜的製作方法 |
| JP6337116B2 (ja) * | 2013-11-13 | 2018-06-06 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 第5族遷移金属含有膜を蒸着させるための第5族遷移金属含有化合物 |
| US20210140048A1 (en) * | 2015-08-04 | 2021-05-13 | Samsung Electronics Co., Ltd. | Semiconductor manufacturing apparatus |
| CN106800572B (zh) * | 2016-11-24 | 2019-09-20 | 苏州复纳电子科技有限公司 | 一种三(二乙基氨基)叔丁酰胺钽的合成方法 |
| KR102627457B1 (ko) * | 2019-08-06 | 2024-01-19 | 삼성전자주식회사 | 나이오븀 화합물과 이를 이용하는 박막 형성 방법 |
| KR20210065861A (ko) | 2019-11-27 | 2021-06-04 | 주식회사 레이크머티리얼즈 | 신규한 탄탈 화합물, 이의 제조방법 및 이를 포함하는 탄탈 함유 박막증착용 조성물 |
| CN115943227B (zh) * | 2020-07-28 | 2025-06-24 | 乔治洛德方法研究和开发液化空气有限公司 | 形成介电膜的方法,新型前体及其在半导体制造中的用途 |
| KR102713888B1 (ko) | 2020-11-24 | 2024-10-08 | 주식회사 레이크머티리얼즈 | 탄탈 화합물, 이의 제조방법 및 이를 포함하는 탄탈 함유 박막증착용 조성물 |
| CN119708046B (zh) * | 2024-12-25 | 2025-12-30 | 合肥安德科铭半导体科技有限公司 | 一种Nb前驱体及其制备方法和应用 |
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| WO2006049059A1 (ja) * | 2004-11-02 | 2006-05-11 | Adeka Corporation | 金属化合物、薄膜形成用原料及び薄膜の製造方法 |
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2007
- 2007-07-17 JP JP2007186071A patent/JP5148186B2/ja not_active Expired - Fee Related
- 2007-08-20 EP EP07792748A patent/EP2058295B1/en not_active Ceased
- 2007-08-20 CN CN2007800322925A patent/CN101511772B/zh not_active Expired - Fee Related
- 2007-08-20 US US12/439,364 patent/US7906668B2/en active Active
- 2007-08-20 WO PCT/JP2007/066135 patent/WO2008026470A1/ja not_active Ceased
- 2007-08-20 KR KR1020097003915A patent/KR101369366B1/ko not_active Expired - Fee Related
- 2007-08-27 TW TW096131715A patent/TWI380974B/zh not_active IP Right Cessation
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| JP2003335740A (ja) * | 2002-05-15 | 2003-11-28 | Mitsubishi Materials Corp | タンタル錯体及び該錯体を含む有機金属化学蒸着法用溶液原料並びにこれを用いて作製されたタンタル含有薄膜 |
| WO2006049059A1 (ja) * | 2004-11-02 | 2006-05-11 | Adeka Corporation | 金属化合物、薄膜形成用原料及び薄膜の製造方法 |
| JP2006131606A (ja) | 2004-11-08 | 2006-05-25 | Kojundo Chem Lab Co Ltd | ターシャリーアミルイミドトリス(ジメチルアミド)ニオブとその製造方法及びそれを用いたald用原料溶液並びにそれを用いた窒化ニオブ膜もしくは酸化ニオブ膜の形成方法。 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2008266280A (ja) | 2008-11-06 |
| US20100010248A1 (en) | 2010-01-14 |
| JP5148186B2 (ja) | 2013-02-20 |
| EP2058295A1 (en) | 2009-05-13 |
| CN101511772A (zh) | 2009-08-19 |
| EP2058295A4 (en) | 2011-03-30 |
| TWI380974B (zh) | 2013-01-01 |
| EP2058295B1 (en) | 2012-12-05 |
| KR101369366B1 (ko) | 2014-03-04 |
| CN101511772B (zh) | 2013-04-24 |
| KR20090059112A (ko) | 2009-06-10 |
| TW200833648A (en) | 2008-08-16 |
| US20110087039A2 (en) | 2011-04-14 |
| US7906668B2 (en) | 2011-03-15 |
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