WO2008033563A3 - Support permettant le soudage face dessous d'une puce émettrice de lumière - Google Patents

Support permettant le soudage face dessous d'une puce émettrice de lumière Download PDF

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Publication number
WO2008033563A3
WO2008033563A3 PCT/US2007/020194 US2007020194W WO2008033563A3 WO 2008033563 A3 WO2008033563 A3 WO 2008033563A3 US 2007020194 W US2007020194 W US 2007020194W WO 2008033563 A3 WO2008033563 A3 WO 2008033563A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
support
chip
emitting chip
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/020194
Other languages
English (en)
Other versions
WO2008033563A2 (fr
Inventor
Boris Kolodin
Michael Hsing
Stanton Earl Weaver Jr
Ivan Eliashevich
Srinath K Aanegola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Lumination LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumination LLC filed Critical Lumination LLC
Publication of WO2008033563A2 publication Critical patent/WO2008033563A2/fr
Publication of WO2008033563A3 publication Critical patent/WO2008033563A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Led Device Packages (AREA)

Abstract

Dans un dispositif émetteur de lumière, une puce émettrice de lumière (12, 112) comprend un empilement de couches semiconductrices (14) et une électrode (24, 141, 142) disposée sur l'empilement de couches semiconductrices. Un support (10, 10', 110, 210) présente une surface généralement plane (30) supportant la puce émettrice de lumière face dessous. Un matériau (40, 41, 141, 142) de fixation de puce conducteur de l'électricité est placé en retrait dans la surface généralement plane du support de façon à ne pas dépasser sensiblement de celle-ci. Le matériau de fixation établit une liaison électrique entre l'électrode de la puce émettrice de lumière et un chemin (36, 36') conducteur de l'électricité du support. L'empilement de couches semiconductrices et l'électrode de la puce émettrice de lumière peuvent éventuellement également être placés en retrait dans la surface généralement plane du support.
PCT/US2007/020194 2006-09-14 2007-09-14 Support permettant le soudage face dessous d'une puce émettrice de lumière Ceased WO2008033563A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/520,905 2006-09-14
US11/520,905 US7635869B2 (en) 2006-09-14 2006-09-14 Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip

Publications (2)

Publication Number Publication Date
WO2008033563A2 WO2008033563A2 (fr) 2008-03-20
WO2008033563A3 true WO2008033563A3 (fr) 2008-06-26

Family

ID=39047764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/020194 Ceased WO2008033563A2 (fr) 2006-09-14 2007-09-14 Support permettant le soudage face dessous d'une puce émettrice de lumière

Country Status (2)

Country Link
US (1) US7635869B2 (fr)
WO (1) WO2008033563A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN101621101A (zh) * 2008-06-30 2010-01-06 展晶科技(深圳)有限公司 发光二极管及其制造方法
US8502257B2 (en) * 2009-11-05 2013-08-06 Visera Technologies Company Limited Light-emitting diode package
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US20120119345A1 (en) * 2010-11-15 2012-05-17 Cho Sungwon Integrated circuit packaging system with device mount and method of manufacture thereof
US9375130B2 (en) 2013-09-30 2016-06-28 General Electric Company Spray control assembly for a dishwashing appliance with directional control for spray arms

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854520A2 (fr) * 1997-01-20 1998-07-22 Oki Electric Industry Co., Ltd. Méthode de fixation d'un dispositif semiconducteur optique sur un substrat
DE19829197A1 (de) * 1998-06-30 2000-01-13 Siemens Ag Strahlungsaussendendes und/oder empfangendes Halbleiter-Bauelement
US20050253159A1 (en) * 2004-04-28 2005-11-17 Creswick Steven B Semiconductor (LED) chip attachment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163419A (ja) * 1997-11-26 1999-06-18 Rohm Co Ltd 発光装置
DE10035399A1 (de) * 2000-07-19 2002-01-31 Alcatel Sa Subträger, elektronische Baugruppe und Verfahren zur Herstellung derselben
DE10163799B4 (de) * 2000-12-28 2006-11-23 Matsushita Electric Works, Ltd., Kadoma Halbleiterchip-Aufbausubstrat und Verfahren zum Herstellen eines solchen Aufbausubstrates
US6888167B2 (en) 2001-07-23 2005-05-03 Cree, Inc. Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
KR100567559B1 (ko) * 2002-07-25 2006-04-05 마츠시다 덴코 가부시키가이샤 광전소자부품
US20040188696A1 (en) * 2003-03-28 2004-09-30 Gelcore, Llc LED power package
US6720664B1 (en) 2003-04-22 2004-04-13 Tyntek Corporation Submount-holder for flip chip package
US7285801B2 (en) * 2004-04-02 2007-10-23 Lumination, Llc LED with series-connected monolithically integrated mesas

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854520A2 (fr) * 1997-01-20 1998-07-22 Oki Electric Industry Co., Ltd. Méthode de fixation d'un dispositif semiconducteur optique sur un substrat
DE19829197A1 (de) * 1998-06-30 2000-01-13 Siemens Ag Strahlungsaussendendes und/oder empfangendes Halbleiter-Bauelement
US20050253159A1 (en) * 2004-04-28 2005-11-17 Creswick Steven B Semiconductor (LED) chip attachment

Also Published As

Publication number Publication date
WO2008033563A2 (fr) 2008-03-20
US20080067537A1 (en) 2008-03-20
US7635869B2 (en) 2009-12-22

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