WO2008069183A1 - オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 - Google Patents
オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 Download PDFInfo
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- WO2008069183A1 WO2008069183A1 PCT/JP2007/073344 JP2007073344W WO2008069183A1 WO 2008069183 A1 WO2008069183 A1 WO 2008069183A1 JP 2007073344 W JP2007073344 W JP 2007073344W WO 2008069183 A1 WO2008069183 A1 WO 2008069183A1
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- WO
- WIPO (PCT)
- Prior art keywords
- resin material
- oxymethylene polymer
- oxymethylene
- polymer composition
- peak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
- C09J159/02—Polyacetals containing polyoxymethylene sequences only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
- C09J159/04—Copolyoxymethylenes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/40—Applying molten plastics, e.g. hot melt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73115—Melting point
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73115—Melting point
- B29C66/73116—Melting point of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
- B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
- B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2059/00—Use of polyacetals, e.g. POM, i.e. polyoxymethylene or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
- B29K2105/0008—Anti-static agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
- B29K2105/0026—Flame proofing or flame retarding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
- B29K2105/0044—Stabilisers, e.g. against oxydation, light or heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
- B29K2105/126—Whiskers, i.e. reinforcement in the form of monocrystals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/10—Mica
Definitions
- the present invention is obtained by a method for bonding a resin material using an oxymethylene polymer having a specific melting point and a melting peak pattern in order to bond resin materials containing the oxymethylene polymer, and the bonding method. Concerning the structure.
- An oxymethylene polymer is an aliphatic ether type or a polymer mainly composed of an aliphatic ether, and is considered to be a material having a low environmental impact, which is derived from methanol power, which is a raw material independent of petroleum. . It is an excellent material that is currently widely used as engineering plastics with high mechanical properties such as rigidity.
- an oxymethylene polymer is a resin having high crystallinity, and when bonding between an injection molded product, an extrusion molded product, and a stretched material containing the polymer, a heat history at a high temperature or a long time is required for bonding. After that, the heat shrinkage is larger than expected, and further, the melting on the material side cannot be ignored, and there is a problem that it is impossible to manufacture a structure that maintains the shape accurately.
- Patent Document 1 Japanese Patent Laid-Open No. 1132638
- Patent Document 2 JP-A-8-60125
- Patent Document 3 International Publication 2002-077049
- the present invention improves the adhesion between resin materials containing an oxymethylene-based polymer and can suppress the thermal shrinkage and thermal deformation of the structure, and the adhesion method. It aims at providing the structure obtained.
- the inventors of the present invention have compared the melting point of the oxymethylene polymer contained in one resin material when the resin materials containing the oxymethylene polymer are bonded to each other.
- Heat treatment is performed using a resin material containing an oxymethylene polymer having a specific melting point difference and a melting peak by DSC measurement satisfying a predetermined relationship as (1) the other material or (2) an adhesive layer
- the present invention has been conceived. As a result, it has been found that the adhesion between materials can be improved without problems such as thermal shrinkage and thermal deformation.
- the present invention is a resin material bonding method for bonding a resin material (X) containing an oxymethylene polymer (A) and a resin material (Y),
- Resin material (Y) is an oxymethylene polymer composition that satisfies the following conditions (1) and (2): (B) or
- the resin material (Y) is a resin material (X) or another type of resin material, and an oxymethylene polymer composition ( ⁇ ) is interposed between the resin material ( ⁇ ) and the resin material (X). This is a method of adhering resin materials to which heat treatment is applied.
- the oxymethylene polymer composition ( ⁇ ) has a lower melting point than the oxymethylene polymer ( ⁇ ), and the difference in melting point is less than 5 ° C.
- the peak force indicating the melt state of the oxymethylene polymer composition (B) measured by DSC is also more than 50% of the required peak area.
- the peak temperature of the oxymethylene polymer (A) is 5 ° C or more lower than the peak temperature. Exists in the temperature range.
- this invention is a structure obtained by the said adhesion
- a resin material adhesion method capable of improving the adhesion between resin materials containing an oxymethylene polymer and suppressing the thermal shrinkage and thermal deformation of the structure, and A structure obtained by the bonding method can be provided.
- the resin material bonding method of the present invention is a method in which the resin material (X) containing the oxymethylene polymer (A) and the resin material (Y) are bonded by heat treatment.
- the various materials and heat treatment conditions are described below.
- Examples of the oxymethylene polymer (A) include commercially available les, oxymethylene homopolymers and oxymethylene block copolymers. Among these, a copolymer of trioxane and 0.5 to 30.0 parts by mass of at least one comonomer containing a repeating unit represented by the following general formula (1) is preferable with respect to 100 parts by mass of the trioxane. .
- the comonomer with respect to 100 parts by mass of trioxane is more preferably from 0.5 to 10.0 parts by mass.
- R and R each independently represent a hydrogen atom, an alkyl group, an organic group having an alkyl group, a phenyl group, or an organic group having a phenyl group.
- m represents an integer of;! ⁇ 6.
- Examples of the alkyl group include an alkyl group having 1 to 8 carbon atoms.
- Examples of the comonomer include cyclic formal and cyclic ether. Specifically, 1,3-dioxolan and derivatives thereof; 1,3-dioxepane and derivatives thereof; 1,3,5-trioxepane and derivatives thereof; 1,3,6-trioxocane and derivatives thereof; and monofunctional Glycidyl ether is preferred!
- the oxymethylene polymer (A) in the resin material (X) is preferably 50 vol% or more, and the resin material (X) preferably has an oxymethylene polymer (A) force. ,.
- the oxymethylene polymer composition (B) contained in the resin material (Y) satisfies the following conditions (1) and (2).
- the melting point of the oxymethylene polymer composition (B) is lower than that of the oxymethylene polymer (A), and the difference in melting point is less than 5 ° C. When the melting point difference is 5 ° C or more, the component (B) is significantly deformed by melting during bonding.
- the temperature for bonding becomes very close to the melting point of the oxymethylene polymer (A), and thus the heat shrinkage of the resin material (X). If the thickness is large, there is a risk of damaging the shape due to the force, thermal deformation with the glue, or even melting. It is preferable that 50% or more of the peak area of the oxymethylene polymer composition (B) exists in a temperature range that is 10 ° C or more lower than the peak temperature of the oxymethylene polymer (A). Yes.
- the oxymethylene-based polymer composition (B) is also represented by the above-mentioned general formula (1), but it is 5.0-50. 0 parts by mass with respect to trioxane and 100 parts by mass of the trioxane. A copolymer with at least one comonomer is preferred. The above comonomer with respect to 100 parts by mass of trioxane is more preferably 10.0 to 5.0 parts by mass.
- a method may be used in which the comonomer component in the component (B) is distributed.
- the comonomer component in the component (B) is distributed.
- two or more oxymethylene polymers having different comonomer contents may be mixed.
- the polymer composition (B) is preferably 50 vol% or more of the polymer composition (B ) Only.
- the resin material (Y) does not contain the oxymethylene polymer composition (B), that is, the oxymethylene polymer composition (B) contains the resin material (X) and the resin material (Y).
- the oxymethylene polymer composition (B) contains the resin material (X) and the resin material (Y).
- other materials may be used in combination as long as the polymer composition (B) is a main component.
- the resin material (Y) may be the same material as the resin material (X) or another kind of material.
- examples of other types of materials include materials having different contents of the oxymethylene-based polymer (A), and materials having components other than the oxymethylene-based polymer (A).
- the heat treatment conditions are preferably less than the melting point of the oxymethylene polymer (A) and not less than the melting start temperature of the oxymethylene polymer composition (B).
- the melting point By making the melting point lower than the above melting point, the thermal shrinkage of the material containing the oxymethylene polymer (A) can be suppressed. It is possible to prevent the shape from being damaged due to thermal deformation or even melting. Moreover, sufficient adhesive strength can be provided by setting it as the melting start temperature or more.
- the temperature be 5 ° C or more lower than the melting point of the oxymethylene polymer (A) and the melting start temperature of the oxymethylene polymer composition (B).
- the material containing the oxymethylene polymer of the present invention mainly contains the above oxymethylene polymer, but any known additive or the like may be used as long as the original purpose of the present invention is not impaired. It is possible to add a filler.
- additives include crystal nucleating agents, antioxidants, plasticizers, matting agents, foaming agents, lubricants, mold release agents, antistatic agents, ultraviolet absorbers, light stabilizers, heat stabilizers, Examples include deodorants, flame retardants, sliding agents, fragrances, and antibacterial agents.
- the filler include glass fiber, talc, my strength, calcium carbonate, and potassium titanate whisker. It is also possible to add pigments and dyes to achieve the desired color. It is also possible to modify by adding various monomers, cutting agents, end treatment agents, other resins, wood flour, starch and the like.
- the form of the resin material (X) and the resin material (Y) according to the present invention is not limited. I like it.
- Other examples include, but are not limited to, blow molded products, films, sheets, fibers, multifilaments, monofilaments, ropes, nets, woven fabrics, knitted fabrics, nonwoven fabrics, filters, and materials obtained by secondary processing thereof. It is not something.
- the oxymethylene polymer (B) is interposed between these materials and thermally bonded, the intervening form is, for example, that the oxymethylene polymer composition (B) is previously applied to the surface of the resin material (A). The ability to exist as a layer or as a domain.
- the surface containing the oximethylene-based polymer (A) is simultaneously or sequentially applied to the surface in advance. It may be interposed, or may be interposed in the process from the primary processing of the material containing the oxymethylene polymer (A) to the formation of the structure.
- the structure of the present invention can be obtained by the above-described method for bonding a resin material of the present invention.
- This structure has good adhesion between resin materials containing an oxymethylene polymer, and heat shrinkage and thermal deformation are suppressed.
- Such a structure may be used as it is, or may be further processed.
- the structure once bonded can be bonded to a resin material containing another oxymethylene polymer (A) having a different shape to form a more advanced structure.
- the layer structure in the case where the structure is a multilayer fiber has two or more layers exposed on the fiber surface in the cross section of the same fiber, and the components constituting the layer are It consists of at least two components of the above resin materials (X) and (Y).
- the exposure ratio on the surface is not particularly limited, but the exposure ratio of the resin material (Y) (particularly the oxymethylene polymer (B) component) that functions as an adhesive layer during secondary processing is low! Thus, the adhesive strength becomes better. Therefore, the resin material (Y) may be formed as a plurality of separate layers.
- melter-spun Upital A40 (hereinafter referred to as oxymethylene polymer (a) and! /, U) made by Mitsubishi Engineering Plastics Co., Ltd., which has a melting point of 172 ° C, a draw ratio of 4, a single fineness
- oxymethylene polymer (a) and! /, U) made by Mitsubishi Engineering Plastics Co., Ltd., which has a melting point of 172 ° C, a draw ratio of 4, a single fineness
- the molded product processed into 5dtex multifilament was used.
- resin material (Y) an oxymethylene-based polymer (a) and Upital V40 (hereinafter referred to as resin (b)! ) And are melt blended at a mass ratio of 1: 1, 1: 2, and 3: 1 (referred to as (b-1), (b-2), and (b-3), respectively). Then, a molded product processed into a multifilament with a draw ratio of 1 and a single fineness of 5 dtex was used. [0038] (Measuring method of melting point)
- the temperature was raised from 30 ° C. to 210 ° C. at a rate of 10 ° C./min, and the melting peak temperature was measured using a differential scanning calorimeter (DSC6200 manufactured by Seiko Instruments Inc.) to obtain the melting point.
- the ratio of the peak area of the resin material Y in the temperature range 5 ° C and 10 ° C or more lower than the melting peak temperature of the oxymethylene polymer (a) is determined by using the manual split integral analysis mode.
- the heat absorption (mj / mg) was calculated as the ratio of the endothermic amount in the corresponding region.
- Resin material (X) multifilament cut to 10 cm length is placed on an iron plate in a straight line, then resin material (Y) multifilament cut to 3 cm length is resin material (X) It was placed at the top so that it intersects with another iron plate. This was subjected to heat bonding treatment (heating treatment) under a heating and pressurizing condition for a predetermined time by a hydraulic hot press apparatus preheated to the temperature shown in Table 1 below.
- the adhesive state between the resin material (X) and the resin material (Y) was visually confirmed, and each melted and unmelted were confirmed. Further, the length of the resin material (X) after the treatment was measured, and the heat shrinkage ratio before and after the treatment was measured.
- Resin material (X) (A) and (B). 7k, '1 * «Bg * i * a
- Example 1 (a) (b-1) 1 56 51 155 90 contact >> Not sensitive 4.9
- Example 2 (a) (b-1) 1 56 51 160 30 Contact not a 8.7
- Example 3 (a ) (b-2) 2 64 56 55 90 Adhesive undissolved 4.9
- Example 4 (a) (b-2) 2 64 56 160 30 Adhesive dissolvable 8.7 Comparative example 1 (a) (b-3) 0 35 25 165 90 No contact * No melt ft-Comparative example 2 (a). (B— 3) 0 35 25 170 30 Adhesion slightly soluble 122 Comparative example 3 (a) (b-3) 0 35 25 175 30 7.1
- (b-1) a multifilament containing (a) and Upital V40 (resin (b)) having a 155 point of 155 ° C in a 1: 1 (mass ratio) and showing a 171 point of 171 ° C
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020097010870A KR101359283B1 (ko) | 2006-12-04 | 2007-12-03 | 옥시메틸렌계 중합체를 포함하는 수지 재료의 접착 방법 및 구조체 |
| JP2008548281A JPWO2008069183A1 (ja) | 2006-12-04 | 2007-12-03 | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
| EP07832964A EP2098577B1 (en) | 2006-12-04 | 2007-12-03 | Method for adhesion of resin material comprising oxymethylene polymer, and structure |
| CN2007800441411A CN101611111B (zh) | 2006-12-04 | 2007-12-03 | 含有甲醛系聚合物的树脂材料的粘接方法以及结构体 |
| US12/517,472 US8377250B2 (en) | 2006-12-04 | 2007-12-03 | Method for adhesion of resin material comprising oxymethylene polymer, and structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006327654 | 2006-12-04 | ||
| JP2006-327654 | 2006-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008069183A1 true WO2008069183A1 (ja) | 2008-06-12 |
Family
ID=39492071
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/073344 Ceased WO2008069183A1 (ja) | 2006-12-04 | 2007-12-03 | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8377250B2 (ja) |
| EP (1) | EP2098577B1 (ja) |
| JP (1) | JPWO2008069183A1 (ja) |
| KR (1) | KR101359283B1 (ja) |
| CN (1) | CN101611111B (ja) |
| WO (1) | WO2008069183A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008069182A1 (ja) * | 2006-12-04 | 2010-03-18 | 三菱瓦斯化学株式会社 | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
| KR102854083B1 (ko) | 2022-05-23 | 2025-09-03 | 주식회사 유엑스엔 | 연속식 분석물 측정기 및 전도성 패치 부착 방법 |
| KR102863152B1 (ko) | 2022-09-13 | 2025-09-24 | 주식회사 유엑스엔 | 연속식 분석물 측정기 및 전도성 패치 부착 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132638A (ja) | 1987-09-14 | 1989-05-25 | Hoechst Celanese Corp | アセタールポリマー接合物品 |
| JPH02166184A (ja) * | 1988-10-11 | 1990-06-26 | Hoechst Celanese Corp | アセタールコポリマー接合樹脂を用いた物品 |
| JPH0860125A (ja) | 1994-08-25 | 1996-03-05 | Polyplastics Co | ポリアセタール樹脂用接着剤、接合方法およびその接合物 |
| WO2002077049A1 (en) | 2001-03-27 | 2002-10-03 | Mitsubishi Gas Chemical Company, Inc. | Polyoxymethylene copolymer and molded article thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02166484A (ja) * | 1988-12-21 | 1990-06-27 | Ricoh Co Ltd | 現像装置 |
| US4954900A (en) * | 1989-01-06 | 1990-09-04 | Ball Corporation | Imaging and wide sector searching apparatus |
| DE10061767B4 (de) * | 1999-12-17 | 2009-10-15 | Asahi Kasei Kabushiki Kaisha | Polyacetalharzzusammensetzung |
-
2007
- 2007-12-03 EP EP07832964A patent/EP2098577B1/en active Active
- 2007-12-03 KR KR1020097010870A patent/KR101359283B1/ko active Active
- 2007-12-03 JP JP2008548281A patent/JPWO2008069183A1/ja active Pending
- 2007-12-03 WO PCT/JP2007/073344 patent/WO2008069183A1/ja not_active Ceased
- 2007-12-03 CN CN2007800441411A patent/CN101611111B/zh active Active
- 2007-12-03 US US12/517,472 patent/US8377250B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132638A (ja) | 1987-09-14 | 1989-05-25 | Hoechst Celanese Corp | アセタールポリマー接合物品 |
| JPH02166184A (ja) * | 1988-10-11 | 1990-06-26 | Hoechst Celanese Corp | アセタールコポリマー接合樹脂を用いた物品 |
| JPH0860125A (ja) | 1994-08-25 | 1996-03-05 | Polyplastics Co | ポリアセタール樹脂用接着剤、接合方法およびその接合物 |
| WO2002077049A1 (en) | 2001-03-27 | 2002-10-03 | Mitsubishi Gas Chemical Company, Inc. | Polyoxymethylene copolymer and molded article thereof |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2098577A4 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101611111B (zh) | 2012-09-05 |
| US8377250B2 (en) | 2013-02-19 |
| JPWO2008069183A1 (ja) | 2010-03-18 |
| KR101359283B1 (ko) | 2014-02-05 |
| KR20090094434A (ko) | 2009-09-07 |
| US20100041854A1 (en) | 2010-02-18 |
| EP2098577B1 (en) | 2013-02-20 |
| EP2098577A4 (en) | 2011-07-20 |
| CN101611111A (zh) | 2009-12-23 |
| EP2098577A1 (en) | 2009-09-09 |
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