WO2008077048A3 - Substrate processing apparatus and method - Google Patents

Substrate processing apparatus and method Download PDF

Info

Publication number
WO2008077048A3
WO2008077048A3 PCT/US2007/087953 US2007087953W WO2008077048A3 WO 2008077048 A3 WO2008077048 A3 WO 2008077048A3 US 2007087953 W US2007087953 W US 2007087953W WO 2008077048 A3 WO2008077048 A3 WO 2008077048A3
Authority
WO
WIPO (PCT)
Prior art keywords
stage
angular speed
substrate processing
respect
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/087953
Other languages
French (fr)
Other versions
WO2008077048A2 (en
Inventor
Marek Zywno
Noah Bareket
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/670,896 external-priority patent/US7633070B2/en
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Priority to JP2009541643A priority Critical patent/JP5453104B2/en
Priority to EP07869445A priority patent/EP2097790A2/en
Publication of WO2008077048A2 publication Critical patent/WO2008077048A2/en
Priority to US12/170,361 priority patent/US8058628B2/en
Publication of WO2008077048A3 publication Critical patent/WO2008077048A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
    • F16C32/0406—Magnetic bearings
    • F16C32/044—Active magnetic bearings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Epidemiology (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Linear Motors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

Substrate processing methods and apparatus are disclosed. In some embodiments a substrate processing apparatus may comprise a support structure and a moveable stage including first and second stages. The moveable stage has one or more maglev units attached to the first stage and/or second stage proximate an edge of the first stage. The first stage retains one or more substrates and moves with respect to a first axis that is substantially fixed with respect to the second stage. The second stage translates along a second axis with respect to the support structure. In other embodiments, a primary motor may maintain a rotary stage at an angular speed and/or accelerate or decelerate the stage from a first angular speed to a second angular speed. A secondary motor may accelerate the stage from rest to the first angular speed and/or decelerate the stage from a non-zero angular speed.
PCT/US2007/087953 2006-12-18 2007-12-18 Substrate processing apparatus and method Ceased WO2008077048A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009541643A JP5453104B2 (en) 2006-12-18 2007-12-18 Substrate process equipment
EP07869445A EP2097790A2 (en) 2006-12-18 2007-12-18 Substrate processing apparatus and method
US12/170,361 US8058628B2 (en) 2007-07-09 2008-07-09 Substrate processing apparatus and method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US87052806P 2006-12-18 2006-12-18
US60/870,528 2006-12-18
US11/670,896 US7633070B2 (en) 2006-12-18 2007-02-02 Substrate processing apparatus and method
US11/670,896 2007-02-02
US94866707P 2007-07-09 2007-07-09
US60/948,667 2007-07-09

Publications (2)

Publication Number Publication Date
WO2008077048A2 WO2008077048A2 (en) 2008-06-26
WO2008077048A3 true WO2008077048A3 (en) 2008-12-04

Family

ID=39359425

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/087953 Ceased WO2008077048A2 (en) 2006-12-18 2007-12-18 Substrate processing apparatus and method

Country Status (3)

Country Link
EP (1) EP2097790A2 (en)
JP (3) JP5453104B2 (en)
WO (1) WO2008077048A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11458512B2 (en) 2017-01-27 2022-10-04 Tel Manufacturing And Engineering Of America, Inc. Systems and methods for rotating and translating a substrate in a process chamber
US11476129B2 (en) 2016-11-29 2022-10-18 Tel Manufacturing And Engineering Of America, Inc. Translating and rotating chuck for processing microelectronic substrates in a process chamber
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101847978B1 (en) * 2011-06-10 2018-04-12 엘지디스플레이 주식회사 Apparatus for manufacturing organic light emitting diodes
EP2754173A4 (en) * 2011-09-06 2015-01-28 Kla Tencor Corp Linear stage for reflective electron beam lithography
JP5886084B2 (en) * 2012-03-05 2016-03-16 住友重機械工業株式会社 Stage equipment
JP7297664B2 (en) * 2016-11-09 2023-06-26 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド Magnetically Levitating and Rotating Chuck for Processing Microelectronic Substrates in Process Chambers
DE102017002542A1 (en) * 2017-03-16 2018-09-20 Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) Device for holding, positioning and / or moving an object
CN112165277B (en) * 2020-10-14 2023-05-16 福建师范大学 Magnetic levitation rotating device and three-dimensional display system for three-dimensional display
CN115692300A (en) * 2021-07-22 2023-02-03 北京北方华创微电子装备有限公司 Semiconductor processing equipment
CN113899748B (en) * 2021-10-29 2025-04-01 中航电测仪器(西安)有限公司 A strain gauge defect recognition device and method based on machine vision
US20240153803A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
USD1118552S1 (en) 2023-10-24 2026-03-17 Applied Materials, Inc. Substrate carrier
WO2025223848A1 (en) * 2024-04-23 2025-10-30 Carl Zeiss Smt Gmbh Inspection apparatus for 3D tomography with improved stand-still performance
US12628612B2 (en) 2024-06-06 2026-05-12 Applied Materials, Inc. Magnetic sensor assembly for a substrate process station

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US5641960A (en) * 1994-01-13 1997-06-24 Fujitsu Limited Circuit pattern inspecting device and method and circuit pattern arrangement suitable for the method
US20020047542A1 (en) * 2000-09-07 2002-04-25 Pioneer Corporation Exposure system
US6515742B1 (en) * 2000-11-28 2003-02-04 Memc Electronic Materials, Inc. Defect classification using scattered light intensities
US20030230323A1 (en) * 2002-06-14 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for improving scrubber cleaning
WO2006007167A2 (en) * 2004-06-17 2006-01-19 Nikon Corporation Magnetic levitation lithography apparatus and method
US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films

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WO1997015978A1 (en) * 1995-10-26 1997-05-01 Satcon Technology Corporation Integrated magnetic levitation and rotation system
US20020047542A1 (en) * 2000-09-07 2002-04-25 Pioneer Corporation Exposure system
US6515742B1 (en) * 2000-11-28 2003-02-04 Memc Electronic Materials, Inc. Defect classification using scattered light intensities
US20030230323A1 (en) * 2002-06-14 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for improving scrubber cleaning
WO2006007167A2 (en) * 2004-06-17 2006-01-19 Nikon Corporation Magnetic levitation lithography apparatus and method
US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11476129B2 (en) 2016-11-29 2022-10-18 Tel Manufacturing And Engineering Of America, Inc. Translating and rotating chuck for processing microelectronic substrates in a process chamber
US11458512B2 (en) 2017-01-27 2022-10-04 Tel Manufacturing And Engineering Of America, Inc. Systems and methods for rotating and translating a substrate in a process chamber
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber

Also Published As

Publication number Publication date
JP2010514167A (en) 2010-04-30
WO2008077048A2 (en) 2008-06-26
JP2014042048A (en) 2014-03-06
EP2097790A2 (en) 2009-09-09
JP5453104B2 (en) 2014-03-26
JP2015111714A (en) 2015-06-18

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