WO2008083672A3 - Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse - Google Patents
Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse Download PDFInfo
- Publication number
- WO2008083672A3 WO2008083672A3 PCT/DE2008/000029 DE2008000029W WO2008083672A3 WO 2008083672 A3 WO2008083672 A3 WO 2008083672A3 DE 2008000029 W DE2008000029 W DE 2008000029W WO 2008083672 A3 WO2008083672 A3 WO 2008083672A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optoelectronic component
- housing
- arrangement
- recess
- support element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
Abstract
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/521,352 US9054279B2 (en) | 2007-01-11 | 2008-01-09 | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
| JP2009545060A JP2010516050A (ja) | 2007-01-11 | 2008-01-09 | オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置 |
| CNA2008800011668A CN101569023A (zh) | 2007-01-11 | 2008-01-09 | 用于光电子器件的壳体和光电子器件在壳体中的布置 |
| EP08706734.4A EP2062301B1 (de) | 2007-01-11 | 2008-01-09 | Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in dem gehäuse |
| KR1020097014208A KR101410569B1 (ko) | 2007-01-11 | 2008-01-09 | 광전자 장치용 하우징 및 하우징 내의 광전자 장치의 배치 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007001706.7 | 2007-01-11 | ||
| DE102007001706A DE102007001706A1 (de) | 2007-01-11 | 2007-01-11 | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008083672A2 WO2008083672A2 (de) | 2008-07-17 |
| WO2008083672A3 true WO2008083672A3 (de) | 2008-12-18 |
Family
ID=39351542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2008/000029 Ceased WO2008083672A2 (de) | 2007-01-11 | 2008-01-09 | Gehäuse für optoelektronisches bauelement und anordnung eines optoelektronischen bauelementes in einem gehäuse |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9054279B2 (de) |
| EP (1) | EP2062301B1 (de) |
| JP (1) | JP2010516050A (de) |
| KR (1) | KR101410569B1 (de) |
| CN (1) | CN101569023A (de) |
| DE (1) | DE102007001706A1 (de) |
| TW (1) | TWI475715B (de) |
| WO (1) | WO2008083672A2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101453892B1 (ko) | 2010-12-08 | 2014-10-22 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전자 반도체 컴포넌트, 광전자 반도체 컴포넌트를 제조하기 위한 방법 및 이와 같은 광전자 반도체 컴포넌트의 용도 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007001706A1 (de) | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
| DE102007060206A1 (de) | 2007-12-14 | 2009-06-18 | Osram Opto Semiconductors Gmbh | Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement |
| WO2010017831A1 (de) * | 2008-08-11 | 2010-02-18 | Osram Gesellschaft mit beschränkter Haftung | Konversions led |
| JP5440010B2 (ja) | 2008-09-09 | 2014-03-12 | 日亜化学工業株式会社 | 光半導体装置及びその製造方法 |
| TWI380433B (en) | 2009-02-25 | 2012-12-21 | Everlight Electronics Co Ltd | Light emitting diode package |
| EP2224486A3 (de) * | 2009-02-25 | 2012-09-12 | Everlight Electronics Co., Ltd. | QNF-Gehäusestruktur für Chip |
| DE102009023854B4 (de) * | 2009-06-04 | 2023-11-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement |
| JP5493549B2 (ja) * | 2009-07-30 | 2014-05-14 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| TW201128812A (en) | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
| US8525213B2 (en) * | 2010-03-30 | 2013-09-03 | Lg Innotek Co., Ltd. | Light emitting device having multiple cavities and light unit having the same |
| CN102339940A (zh) * | 2010-07-27 | 2012-02-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
| DE102010047303A1 (de) * | 2010-10-01 | 2012-04-05 | Osram Opto Semiconductors Gmbh | Reflektorelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Reflektorelements und eines optoelektronischen Bauelements |
| EP2472579A1 (de) | 2010-12-30 | 2012-07-04 | Baumer Innotec AG | Kontaktierung von Bauelementen auf Substraten |
| DE102011107895B4 (de) * | 2011-07-18 | 2020-11-05 | Heraeus Noblelight Gmbh | Optoelektronisches Modul mit Linsensystem |
| WO2013162125A1 (ko) * | 2012-04-23 | 2013-10-31 | 레이트론(주) | 일체형 광센서 패키지 |
| KR101317233B1 (ko) | 2012-05-11 | 2013-10-15 | (주)트라디아 | 엘이디용 방열장치 |
| DE102013204862A1 (de) * | 2013-03-20 | 2014-10-09 | Osram Gmbh | Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe |
| DE102013206963A1 (de) * | 2013-04-17 | 2014-11-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| KR102408616B1 (ko) * | 2015-07-15 | 2022-06-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
| US10170658B2 (en) * | 2015-11-13 | 2019-01-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and method of manufacturing the same |
| DE102016114483A1 (de) * | 2016-08-04 | 2018-02-08 | Ic-Haus Gmbh | Optoelektronisches Bauelement |
| DE102016116439A1 (de) | 2016-09-02 | 2018-03-08 | Osram Opto Semiconductors Gmbh | Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement |
| DE102017124455A1 (de) * | 2017-10-19 | 2019-04-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil mit einem Wirkungselement |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8424611U1 (de) * | 1984-08-20 | 1989-07-13 | Barlian, Reinhold, Dipl.-Ing. (FH), 6990 Bad Mergentheim | Leuchteinsatz |
| US20020163001A1 (en) * | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
| JP2003008075A (ja) * | 2001-06-27 | 2003-01-10 | Toyoda Gosei Co Ltd | Ledランプ |
| WO2004068594A1 (de) * | 2003-01-30 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Elektromagnetische strahlung aussendendes und/oder empfangendes halbleiter-bauelement und gehäuse-grundkörper für ein derartiges bauelement |
| US20050121686A1 (en) * | 2003-12-09 | 2005-06-09 | Bernd Keller | Semiconductor light emitting devices and submounts and methods for forming the same |
| US20050180698A1 (en) * | 2004-02-12 | 2005-08-18 | Ralf Hauffe | Light transmitting modules with optical power monitoring |
| WO2005104248A1 (ja) * | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | 発光素子駆動用半導体チップ、発光装置及び照明装置 |
| DE102004031391A1 (de) * | 2004-06-29 | 2006-01-26 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektronisches Bauteil |
| EP1622237A1 (de) * | 2004-07-28 | 2006-02-01 | Infineon Technologies Fiber Optics GmbH | Optisches oder elektronisches Modul und Verfahren zu dessen Herstellung |
| DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| WO2006111907A2 (en) * | 2005-04-20 | 2006-10-26 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a ceramic luminescence converter |
| WO2006114082A2 (de) * | 2005-04-26 | 2006-11-02 | Osram Opto Semiconductors Gmbh | Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung |
| US20060267040A1 (en) * | 2005-05-31 | 2006-11-30 | Samsung Electro-Mechanics Co., Ltd. | High-brightness LED with protective function of electrostatic discharge damage |
| US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
| WO2008031391A1 (de) * | 2006-09-15 | 2008-03-20 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares gehäuse für einen halbleiterchip |
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| JPS59132147A (ja) | 1983-01-19 | 1984-07-30 | Toshiba Corp | 半導体装置の気密封止方法 |
| JP2966591B2 (ja) | 1991-08-02 | 1999-10-25 | 三洋電機株式会社 | 光半導体装置 |
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| JPH08287719A (ja) | 1995-04-10 | 1996-11-01 | Copal Co Ltd | 発光装置 |
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| DE102006004397A1 (de) | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
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| DE102007001706A1 (de) | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
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2007
- 2007-01-11 DE DE102007001706A patent/DE102007001706A1/de not_active Withdrawn
-
2008
- 2008-01-07 TW TW097100601A patent/TWI475715B/zh active
- 2008-01-09 JP JP2009545060A patent/JP2010516050A/ja active Pending
- 2008-01-09 US US12/521,352 patent/US9054279B2/en active Active
- 2008-01-09 EP EP08706734.4A patent/EP2062301B1/de active Active
- 2008-01-09 KR KR1020097014208A patent/KR101410569B1/ko active Active
- 2008-01-09 CN CNA2008800011668A patent/CN101569023A/zh active Pending
- 2008-01-09 WO PCT/DE2008/000029 patent/WO2008083672A2/de not_active Ceased
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8424611U1 (de) * | 1984-08-20 | 1989-07-13 | Barlian, Reinhold, Dipl.-Ing. (FH), 6990 Bad Mergentheim | Leuchteinsatz |
| US20020163001A1 (en) * | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
| JP2003008075A (ja) * | 2001-06-27 | 2003-01-10 | Toyoda Gosei Co Ltd | Ledランプ |
| WO2004068594A1 (de) * | 2003-01-30 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Elektromagnetische strahlung aussendendes und/oder empfangendes halbleiter-bauelement und gehäuse-grundkörper für ein derartiges bauelement |
| US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
| US20050121686A1 (en) * | 2003-12-09 | 2005-06-09 | Bernd Keller | Semiconductor light emitting devices and submounts and methods for forming the same |
| US20050180698A1 (en) * | 2004-02-12 | 2005-08-18 | Ralf Hauffe | Light transmitting modules with optical power monitoring |
| WO2005104248A1 (ja) * | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | 発光素子駆動用半導体チップ、発光装置及び照明装置 |
| US20070257901A1 (en) * | 2004-04-19 | 2007-11-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip for driving light emitting element, light emitting device, and lighting device |
| DE102004031391A1 (de) * | 2004-06-29 | 2006-01-26 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektronisches Bauteil |
| EP1622237A1 (de) * | 2004-07-28 | 2006-02-01 | Infineon Technologies Fiber Optics GmbH | Optisches oder elektronisches Modul und Verfahren zu dessen Herstellung |
| DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| WO2006111907A2 (en) * | 2005-04-20 | 2006-10-26 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a ceramic luminescence converter |
| WO2006114082A2 (de) * | 2005-04-26 | 2006-11-02 | Osram Opto Semiconductors Gmbh | Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung |
| US20060267040A1 (en) * | 2005-05-31 | 2006-11-30 | Samsung Electro-Mechanics Co., Ltd. | High-brightness LED with protective function of electrostatic discharge damage |
| WO2008031391A1 (de) * | 2006-09-15 | 2008-03-20 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares gehäuse für einen halbleiterchip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101453892B1 (ko) | 2010-12-08 | 2014-10-22 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전자 반도체 컴포넌트, 광전자 반도체 컴포넌트를 제조하기 위한 방법 및 이와 같은 광전자 반도체 컴포넌트의 용도 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102007001706A1 (de) | 2008-07-17 |
| EP2062301B1 (de) | 2019-04-03 |
| JP2010516050A (ja) | 2010-05-13 |
| TWI475715B (zh) | 2015-03-01 |
| US9054279B2 (en) | 2015-06-09 |
| TW200841496A (en) | 2008-10-16 |
| US20110002587A1 (en) | 2011-01-06 |
| KR20090104020A (ko) | 2009-10-05 |
| EP2062301A2 (de) | 2009-05-27 |
| WO2008083672A2 (de) | 2008-07-17 |
| KR101410569B1 (ko) | 2014-06-23 |
| CN101569023A (zh) | 2009-10-28 |
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