WO2008096579A1 - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
- Publication number
- WO2008096579A1 WO2008096579A1 PCT/JP2008/050511 JP2008050511W WO2008096579A1 WO 2008096579 A1 WO2008096579 A1 WO 2008096579A1 JP 2008050511 W JP2008050511 W JP 2008050511W WO 2008096579 A1 WO2008096579 A1 WO 2008096579A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- material composition
- polymer material
- insulating polymer
- curing
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/005—Drying oils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
エポキシ化亜麻仁油に対して、硬化剤(アミン類,酸無水物類,フェノール類、好ましくはイミダゾール類),硬化促進剤等(有機過酸化物,アミン類,イミダゾール類等の硬化促進剤や、パーオキサイド等の反応助剤)を添加し、その添加量に応じた条件で混練し該混練物を熱処理することにより、過酸化物加硫を施し三次元架橋させて絶縁性高分子材料組成物を得る。この絶縁性高分子材料組成物を、高電圧機器等の高分子製品に適用する。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/526,146 US8461281B2 (en) | 2007-02-09 | 2008-01-17 | Insulating polymer material composition |
| EP08703366.8A EP2133377B1 (en) | 2007-02-09 | 2008-01-17 | Insulating polymer material composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007029892A JP5303840B2 (ja) | 2007-02-09 | 2007-02-09 | 絶縁性高分子材料組成物 |
| JP2007-029892 | 2007-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008096579A1 true WO2008096579A1 (ja) | 2008-08-14 |
Family
ID=39681490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/050511 Ceased WO2008096579A1 (ja) | 2007-02-09 | 2008-01-17 | 絶縁性高分子材料組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8461281B2 (ja) |
| EP (1) | EP2133377B1 (ja) |
| JP (1) | JP5303840B2 (ja) |
| TW (1) | TW200849281A (ja) |
| WO (1) | WO2008096579A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010061879A (ja) * | 2008-09-02 | 2010-03-18 | Meidensha Corp | 絶縁性高分子材料組成物 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5499863B2 (ja) * | 2010-04-16 | 2014-05-21 | 中部電力株式会社 | 絶縁性高分子材料組成物及びその製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002053699A (ja) | 1995-09-18 | 2002-02-19 | Internatl Business Mach Corp <Ibm> | 架橋した生物材料およびその使用 |
| JP2002358829A (ja) | 2001-03-29 | 2002-12-13 | Mitsui Chemicals Inc | 電気絶縁材料 |
| JP2006241331A (ja) * | 2005-03-04 | 2006-09-14 | Osaka Univ | 硬化性油脂組成物 |
| JP2007031498A (ja) * | 2005-07-25 | 2007-02-08 | Meidensha Corp | 絶縁性高分子材料組成物 |
| WO2008016119A1 (en) * | 2006-08-02 | 2008-02-07 | Meidensha Corporation | Insulating polymer material composition |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4375521A (en) * | 1981-06-01 | 1983-03-01 | Communications Technology Corporation | Vegetable oil extended polyurethane systems |
| TW354451B (en) | 1995-09-18 | 1999-03-11 | Ibm | Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent |
| TW344191B (en) | 1995-09-18 | 1998-11-01 | Ibm | Cross-linked biobased materials and uses thereof |
| US5698631A (en) * | 1996-05-30 | 1997-12-16 | Uniroyal Chemical Company, Inc. | Epoxy resin compositions for encapsulating signal transmission devices |
| US6194490B1 (en) * | 1998-02-27 | 2001-02-27 | Vantico, Inc. | Curable composition comprising epoxidized natural oils |
| US7105628B2 (en) * | 2002-08-27 | 2006-09-12 | Acushnet Company | Compositions for golf equipment |
| US7196124B2 (en) * | 2003-01-08 | 2007-03-27 | Texas Tech University | Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
| JP4961692B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 碍子 |
-
2007
- 2007-02-09 JP JP2007029892A patent/JP5303840B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-17 EP EP08703366.8A patent/EP2133377B1/en not_active Not-in-force
- 2008-01-17 WO PCT/JP2008/050511 patent/WO2008096579A1/ja not_active Ceased
- 2008-01-17 US US12/526,146 patent/US8461281B2/en not_active Expired - Fee Related
- 2008-02-05 TW TW097104438A patent/TW200849281A/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002053699A (ja) | 1995-09-18 | 2002-02-19 | Internatl Business Mach Corp <Ibm> | 架橋した生物材料およびその使用 |
| JP2002358829A (ja) | 2001-03-29 | 2002-12-13 | Mitsui Chemicals Inc | 電気絶縁材料 |
| JP2006241331A (ja) * | 2005-03-04 | 2006-09-14 | Osaka Univ | 硬化性油脂組成物 |
| JP2007031498A (ja) * | 2005-07-25 | 2007-02-08 | Meidensha Corp | 絶縁性高分子材料組成物 |
| WO2008016119A1 (en) * | 2006-08-02 | 2008-02-07 | Meidensha Corporation | Insulating polymer material composition |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2133377A4 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010061879A (ja) * | 2008-09-02 | 2010-03-18 | Meidensha Corp | 絶縁性高分子材料組成物 |
| CN102144265A (zh) * | 2008-09-02 | 2011-08-03 | 株式会社明电舍 | 绝缘性高分子材料组合物 |
| EP2330600A4 (en) * | 2008-09-02 | 2012-03-07 | Meidensha Electric Mfg Co Ltd | INSULATING COMPOSITION OF POLYMER MATERIAL |
Also Published As
| Publication number | Publication date |
|---|---|
| US8461281B2 (en) | 2013-06-11 |
| TWI373053B (ja) | 2012-09-21 |
| EP2133377B1 (en) | 2016-01-06 |
| JP5303840B2 (ja) | 2013-10-02 |
| US20100324228A1 (en) | 2010-12-23 |
| EP2133377A4 (en) | 2011-10-26 |
| TW200849281A (en) | 2008-12-16 |
| EP2133377A1 (en) | 2009-12-16 |
| JP2008195759A (ja) | 2008-08-28 |
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