WO2008096579A1 - 絶縁性高分子材料組成物 - Google Patents

絶縁性高分子材料組成物 Download PDF

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Publication number
WO2008096579A1
WO2008096579A1 PCT/JP2008/050511 JP2008050511W WO2008096579A1 WO 2008096579 A1 WO2008096579 A1 WO 2008096579A1 JP 2008050511 W JP2008050511 W JP 2008050511W WO 2008096579 A1 WO2008096579 A1 WO 2008096579A1
Authority
WO
WIPO (PCT)
Prior art keywords
material composition
polymer material
insulating polymer
curing
imidazole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050511
Other languages
English (en)
French (fr)
Inventor
Yasuyuki Kurata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp, Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Corp
Priority to US12/526,146 priority Critical patent/US8461281B2/en
Priority to EP08703366.8A priority patent/EP2133377B1/en
Publication of WO2008096579A1 publication Critical patent/WO2008096579A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/005Drying oils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/20Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

 エポキシ化亜麻仁油に対して、硬化剤(アミン類,酸無水物類,フェノール類、好ましくはイミダゾール類),硬化促進剤等(有機過酸化物,アミン類,イミダゾール類等の硬化促進剤や、パーオキサイド等の反応助剤)を添加し、その添加量に応じた条件で混練し該混練物を熱処理することにより、過酸化物加硫を施し三次元架橋させて絶縁性高分子材料組成物を得る。この絶縁性高分子材料組成物を、高電圧機器等の高分子製品に適用する。
PCT/JP2008/050511 2007-02-09 2008-01-17 絶縁性高分子材料組成物 Ceased WO2008096579A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/526,146 US8461281B2 (en) 2007-02-09 2008-01-17 Insulating polymer material composition
EP08703366.8A EP2133377B1 (en) 2007-02-09 2008-01-17 Insulating polymer material composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007029892A JP5303840B2 (ja) 2007-02-09 2007-02-09 絶縁性高分子材料組成物
JP2007-029892 2007-02-09

Publications (1)

Publication Number Publication Date
WO2008096579A1 true WO2008096579A1 (ja) 2008-08-14

Family

ID=39681490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050511 Ceased WO2008096579A1 (ja) 2007-02-09 2008-01-17 絶縁性高分子材料組成物

Country Status (5)

Country Link
US (1) US8461281B2 (ja)
EP (1) EP2133377B1 (ja)
JP (1) JP5303840B2 (ja)
TW (1) TW200849281A (ja)
WO (1) WO2008096579A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010061879A (ja) * 2008-09-02 2010-03-18 Meidensha Corp 絶縁性高分子材料組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499863B2 (ja) * 2010-04-16 2014-05-21 中部電力株式会社 絶縁性高分子材料組成物及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053699A (ja) 1995-09-18 2002-02-19 Internatl Business Mach Corp <Ibm> 架橋した生物材料およびその使用
JP2002358829A (ja) 2001-03-29 2002-12-13 Mitsui Chemicals Inc 電気絶縁材料
JP2006241331A (ja) * 2005-03-04 2006-09-14 Osaka Univ 硬化性油脂組成物
JP2007031498A (ja) * 2005-07-25 2007-02-08 Meidensha Corp 絶縁性高分子材料組成物
WO2008016119A1 (en) * 2006-08-02 2008-02-07 Meidensha Corporation Insulating polymer material composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4375521A (en) * 1981-06-01 1983-03-01 Communications Technology Corporation Vegetable oil extended polyurethane systems
TW354451B (en) 1995-09-18 1999-03-11 Ibm Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent
TW344191B (en) 1995-09-18 1998-11-01 Ibm Cross-linked biobased materials and uses thereof
US5698631A (en) * 1996-05-30 1997-12-16 Uniroyal Chemical Company, Inc. Epoxy resin compositions for encapsulating signal transmission devices
US6194490B1 (en) * 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
US7105628B2 (en) * 2002-08-27 2006-09-12 Acushnet Company Compositions for golf equipment
US7196124B2 (en) * 2003-01-08 2007-03-27 Texas Tech University Elastomeric material compositions obtained from castor oil and epoxidized soybean oil
JP4961692B2 (ja) * 2005-07-25 2012-06-27 株式会社明電舎 碍子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053699A (ja) 1995-09-18 2002-02-19 Internatl Business Mach Corp <Ibm> 架橋した生物材料およびその使用
JP2002358829A (ja) 2001-03-29 2002-12-13 Mitsui Chemicals Inc 電気絶縁材料
JP2006241331A (ja) * 2005-03-04 2006-09-14 Osaka Univ 硬化性油脂組成物
JP2007031498A (ja) * 2005-07-25 2007-02-08 Meidensha Corp 絶縁性高分子材料組成物
WO2008016119A1 (en) * 2006-08-02 2008-02-07 Meidensha Corporation Insulating polymer material composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2133377A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010061879A (ja) * 2008-09-02 2010-03-18 Meidensha Corp 絶縁性高分子材料組成物
CN102144265A (zh) * 2008-09-02 2011-08-03 株式会社明电舍 绝缘性高分子材料组合物
EP2330600A4 (en) * 2008-09-02 2012-03-07 Meidensha Electric Mfg Co Ltd INSULATING COMPOSITION OF POLYMER MATERIAL

Also Published As

Publication number Publication date
US8461281B2 (en) 2013-06-11
TWI373053B (ja) 2012-09-21
EP2133377B1 (en) 2016-01-06
JP5303840B2 (ja) 2013-10-02
US20100324228A1 (en) 2010-12-23
EP2133377A4 (en) 2011-10-26
TW200849281A (en) 2008-12-16
EP2133377A1 (en) 2009-12-16
JP2008195759A (ja) 2008-08-28

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