BRPI1015480B8 - composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico - Google Patents

composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico Download PDF

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Publication number
BRPI1015480B8
BRPI1015480B8 BRPI1015480A BRPI1015480A BRPI1015480B8 BR PI1015480 B8 BRPI1015480 B8 BR PI1015480B8 BR PI1015480 A BRPI1015480 A BR PI1015480A BR PI1015480 A BRPI1015480 A BR PI1015480A BR PI1015480 B8 BRPI1015480 B8 BR PI1015480B8
Authority
BR
Brazil
Prior art keywords
cured product
curable composition
component
making
electrical insulation
Prior art date
Application number
BRPI1015480A
Other languages
English (en)
Inventor
Beisele Christian
Baer Daniel
Grindling Josef
Original Assignee
Huntsman Adv Mat Switzerland
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Switzerland, Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Switzerland
Publication of BRPI1015480A2 publication Critical patent/BRPI1015480A2/pt
Publication of BRPI1015480B1 publication Critical patent/BRPI1015480B1/pt
Publication of BRPI1015480B8 publication Critical patent/BRPI1015480B8/pt

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico resina epóxi e uma composição de carga, um produto curado obtido através da cura da referida composição curável, assim como o uso do produto curado como um material de construção eletricamente isolante para componentes elétricos ou eletrônicos.
BRPI1015480A 2009-04-02 2010-02-24 composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico BRPI1015480B8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09157142 2009-04-02
PCT/EP2010/052317 WO2010112272A1 (en) 2009-04-02 2010-02-24 Direct overmolding

Publications (3)

Publication Number Publication Date
BRPI1015480A2 BRPI1015480A2 (pt) 2016-04-26
BRPI1015480B1 BRPI1015480B1 (pt) 2019-12-31
BRPI1015480B8 true BRPI1015480B8 (pt) 2020-01-14

Family

ID=40602664

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1015480A BRPI1015480B8 (pt) 2009-04-02 2010-02-24 composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico

Country Status (13)

Country Link
US (1) US8999433B2 (pt)
EP (1) EP2414444B1 (pt)
JP (1) JP5756082B2 (pt)
KR (1) KR20120042714A (pt)
CN (1) CN102388096B (pt)
AU (1) AU2010230455B2 (pt)
BR (1) BRPI1015480B8 (pt)
ES (1) ES2411462T3 (pt)
PL (1) PL2414444T3 (pt)
RU (1) RU2528845C2 (pt)
SI (1) SI2414444T1 (pt)
TW (1) TWI537298B (pt)
WO (1) WO2010112272A1 (pt)

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* Cited by examiner, † Cited by third party
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CN103059268B (zh) * 2011-10-19 2016-06-08 上海雷博司电气股份有限公司 一种电器绝缘件用环氧树脂材料
JP5849156B2 (ja) * 2012-06-13 2016-01-27 株式会社日立製作所 絶縁材料並びにこれを用いた高電圧機器
EP2873687B1 (en) * 2013-11-13 2018-06-06 GVK Coating Technology Oy A polymer composition and a method for its preparation
WO2016032795A1 (en) * 2014-08-29 2016-03-03 3M Innovative Properties Company Inductively curable composition
CN117285698A (zh) * 2015-03-26 2023-12-26 亨斯迈先进材料特许（瑞士）有限公司 用于制备室外制品的热固性环氧树脂组合物以及由此获得的制品
CA2988827C (en) * 2015-06-16 2023-08-22 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Epoxy resin composition
RU2598861C1 (ru) * 2015-09-28 2016-09-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Электроизоляционный заливочный компаунд
US10279519B2 (en) * 2015-12-30 2019-05-07 The United States Of America, As Represented By The Secretary Of The Navy Mold assembly and method of molding a component
JP7365118B2 (ja) 2016-03-15 2023-10-19 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 電気工学用の絶縁系の製造方法、それから得られる製品及びその使用
RU2652251C1 (ru) * 2017-08-14 2018-04-25 Акционерное общество "Научно-исследовательский институт полимерных материалов" Эпоксидный состав для исправления дефектов технологической оснастки
KR102312468B1 (ko) * 2017-12-11 2021-10-13 미쓰비시덴키 가부시키가이샤 소호용 절연 재료 성형체 및 회로 차단기
EP4168466B1 (en) * 2020-06-22 2024-07-31 Huntsman Advanced Materials Licensing (Switzerland) GmbH A photocurable composition
CN116685617A (zh) * 2020-12-22 2023-09-01 亨斯迈先进材料许可(瑞士)有限公司 可固化的两部分树脂体系
KR20250091262A (ko) 2022-10-18 2025-06-20 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 모서리가 날카로운 인서트의 캡슐화에서 균열을 방지하는 방법

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JPS5819136B2 (ja) * 1979-03-06 1983-04-16 日東電工株式会社 半導体封止用エポキシ樹脂組成物
US4287115A (en) * 1979-11-13 1981-09-01 The Dow Chemical Company Filler mixtures and thermoset resins containing same
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
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EP0633286A1 (de) * 1993-07-09 1995-01-11 Ciba-Geigy Ag Härtbare, Füllstoffe enthaltende Epoxidharzzusammensetzung
JPH104270A (ja) * 1996-06-18 1998-01-06 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
HU217112B (hu) * 1997-01-21 1999-11-29 Furukawa Electric Institute Of Technology Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók
EP1165688B1 (de) 1999-03-16 2007-01-24 Huntsman Advanced Materials (Switzerland) GmbH Härtbare zusammensetzung mit besonderer eigenschaftskombination
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Also Published As

Publication number Publication date
BRPI1015480A2 (pt) 2016-04-26
BRPI1015480B1 (pt) 2019-12-31
TWI537298B (zh) 2016-06-11
KR20120042714A (ko) 2012-05-03
EP2414444B1 (en) 2013-04-17
ES2411462T3 (es) 2013-07-05
PL2414444T3 (pl) 2013-09-30
RU2011144365A (ru) 2013-05-10
CN102388096A (zh) 2012-03-21
JP5756082B2 (ja) 2015-07-29
JP2012522854A (ja) 2012-09-27
RU2528845C2 (ru) 2014-09-20
EP2414444A1 (en) 2012-02-08
US20120022184A1 (en) 2012-01-26
WO2010112272A1 (en) 2010-10-07
CN102388096B (zh) 2014-07-09
SI2414444T1 (sl) 2013-08-30
AU2010230455B2 (en) 2015-05-07
US8999433B2 (en) 2015-04-07
AU2010230455A1 (en) 2011-09-15
TW201037003A (en) 2010-10-16

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/02/2010, OBSERVADAS AS CONDICOES LEGAIS.

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: REF. RPI 2556 DE 31/12/2019 QUANTO AO INVENTOR.