WO2008099732A1 - 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 - Google Patents

硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 Download PDF

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Publication number
WO2008099732A1
WO2008099732A1 PCT/JP2008/051944 JP2008051944W WO2008099732A1 WO 2008099732 A1 WO2008099732 A1 WO 2008099732A1 JP 2008051944 W JP2008051944 W JP 2008051944W WO 2008099732 A1 WO2008099732 A1 WO 2008099732A1
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WO
WIPO (PCT)
Prior art keywords
composition
film
thermosetting
cured film
film pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051944
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English (en)
French (fr)
Inventor
Takenori Kakutani
Hidekazu Miyabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to CN2008800051203A priority Critical patent/CN101611353B/zh
Priority to EP08710841A priority patent/EP2116902A4/en
Priority to JP2008558058A priority patent/JP5219846B2/ja
Publication of WO2008099732A1 publication Critical patent/WO2008099732A1/ja
Priority to US12/539,610 priority patent/US20090306243A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)

Abstract

　主剤と硬化剤を混合した後のポットライフ（可使時間）を長くでき、あるいは一液としての保存安定性に優れたものとするために、硬化皮膜パターン形成用組成物は、熱硬化触媒を含有しないアルカリ現像型の光硬化性・熱硬化性組成物と、窒素含有複素環式化合物からなる熱硬化反応促進用の塩基性硬化触媒の水溶液からなる現像液との組合せからなる。好適には、上記塩基性硬化触媒は、アミジン部位を有する複素環式化合物である。上記光硬化性・熱硬化性組成物の皮膜を活性エネルギー線の照射により選択的に露光した後、未露光部を上記現像液で現像して除去する。この際、上記塩基性硬化触媒が光硬化した塗膜に浸透し、ドーピングされることにより、現像パターニング性に加えて熱硬化性にも優れたものとなる。
PCT/JP2008/051944 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 Ceased WO2008099732A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800051203A CN101611353B (zh) 2007-02-16 2008-02-06 固化皮膜图案形成用组合物及使用其的固化皮膜图案的制作方法
EP08710841A EP2116902A4 (en) 2007-02-16 2008-02-06 COMPOSITION FOR FORMING A CURED FILM STRUCTURE AND METHOD FOR PRODUCING A CURED FILM STRUCTURE THEREOF BY USING THEREOF
JP2008558058A JP5219846B2 (ja) 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法
US12/539,610 US20090306243A1 (en) 2007-02-16 2009-08-12 Composition for forming cured film pattern and method for producing cured film pattern by using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-036764 2007-02-16
JP2007036764 2007-02-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/539,610 Continuation US20090306243A1 (en) 2007-02-16 2009-08-12 Composition for forming cured film pattern and method for producing cured film pattern by using the same

Publications (1)

Publication Number Publication Date
WO2008099732A1 true WO2008099732A1 (ja) 2008-08-21

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ID=39689970

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PCT/JP2008/051944 Ceased WO2008099732A1 (ja) 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法

Country Status (7)

Country Link
US (1) US20090306243A1 (ja)
EP (1) EP2116902A4 (ja)
JP (1) JP5219846B2 (ja)
KR (1) KR20100014786A (ja)
CN (1) CN101611353B (ja)
TW (1) TWI414907B (ja)
WO (1) WO2008099732A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014002294A1 (ja) * 2012-06-29 2014-01-03 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017112284A (ja) * 2015-12-17 2017-06-22 日立化成株式会社 絶縁樹脂フィルム、支持体付き絶縁樹脂フィルム及び多層プリント配線板

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JP5505066B2 (ja) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子の層間絶縁膜、保護膜及びスペーサーならびにそれらの形成方法
CN102375340A (zh) * 2010-08-10 2012-03-14 Jsr株式会社 放射线敏感性树脂组合物、固化膜、固化膜的形成方法、滤色器以及滤色器的形成方法
JP5724681B2 (ja) * 2010-08-10 2015-05-27 Jsr株式会社 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、カラーフィルタ及びカラーフィルタの形成方法
WO2013094606A1 (ja) * 2011-12-22 2013-06-27 太陽インキ製造株式会社 ドライフィルム及びそれを用いたプリント配線板、プリント配線板の製造方法、及びフリップチップ実装基板
US9351397B2 (en) * 2012-01-31 2016-05-24 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same
US10394126B2 (en) * 2015-07-17 2019-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Photolithography process and materials
KR102042300B1 (ko) * 2015-09-24 2019-11-07 주식회사 엘지화학 유기태양전지의 제조방법 및 이를 이용하여 제조된 유기태양전지
US11171309B2 (en) * 2016-12-09 2021-11-09 Lg Chem, Ltd. Encapsulating composition
CN112812013A (zh) * 2020-12-30 2021-05-18 安徽熙泰智能科技有限公司 一种用于引线键合保护胶的化合物及其制备方法和快干型引线键合保护胶

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Publication number Priority date Publication date Assignee Title
WO2014002294A1 (ja) * 2012-06-29 2014-01-03 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JPWO2014002294A1 (ja) * 2012-06-29 2016-05-30 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017112284A (ja) * 2015-12-17 2017-06-22 日立化成株式会社 絶縁樹脂フィルム、支持体付き絶縁樹脂フィルム及び多層プリント配線板

Also Published As

Publication number Publication date
JP5219846B2 (ja) 2013-06-26
EP2116902A1 (en) 2009-11-11
CN101611353B (zh) 2012-04-04
TWI414907B (zh) 2013-11-11
US20090306243A1 (en) 2009-12-10
JPWO2008099732A1 (ja) 2010-05-27
TW200848953A (en) 2008-12-16
EP2116902A4 (en) 2011-02-02
CN101611353A (zh) 2009-12-23
KR20100014786A (ko) 2010-02-11

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