WO2008105355A1 - Fines particules conductrices et matériau conducteur anisotrope - Google Patents

Fines particules conductrices et matériau conducteur anisotrope Download PDF

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Publication number
WO2008105355A1
WO2008105355A1 PCT/JP2008/053148 JP2008053148W WO2008105355A1 WO 2008105355 A1 WO2008105355 A1 WO 2008105355A1 JP 2008053148 W JP2008053148 W JP 2008053148W WO 2008105355 A1 WO2008105355 A1 WO 2008105355A1
Authority
WO
WIPO (PCT)
Prior art keywords
fine particle
conductive
conductive fine
conductive material
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053148
Other languages
English (en)
Japanese (ja)
Inventor
Hiroya Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2008526705A priority Critical patent/JP4217271B2/ja
Priority to KR1020097016414A priority patent/KR101088667B1/ko
Priority to CN2008800061652A priority patent/CN101622679B/zh
Publication of WO2008105355A1 publication Critical patent/WO2008105355A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

L'invention concerne de fines particules conductrices ayant une résistance faible et une excellente fiabilité de connexion. L'invention concerne également un matériau conducteur anisotrope. L'invention concerne spécifiquement de fines particules conductrices composées de fines particules de base, d'une couche de nickel formée sur la surface des fines particules de base, et d'une couche d'or formée sur la surface de la couche de nickel. Ces fines particules conductrices sont caractérisées par le fait que la teneur en nickel dans une partie de la couche d'or à 5 nm à partir de la surface la plus à l'extérieur, est de pas plus de 4 % en poids.
PCT/JP2008/053148 2007-02-26 2008-02-25 Fines particules conductrices et matériau conducteur anisotrope Ceased WO2008105355A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008526705A JP4217271B2 (ja) 2007-02-26 2008-02-25 導電性微粒子及び異方性導電材料
KR1020097016414A KR101088667B1 (ko) 2007-02-26 2008-02-25 도전성 미립자 및 이방성 도전 재료
CN2008800061652A CN101622679B (zh) 2007-02-26 2008-02-25 导电性微粒及各向异性导电材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-045854 2007-02-26
JP2007045854 2007-02-26

Publications (1)

Publication Number Publication Date
WO2008105355A1 true WO2008105355A1 (fr) 2008-09-04

Family

ID=39721187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053148 Ceased WO2008105355A1 (fr) 2007-02-26 2008-02-25 Fines particules conductrices et matériau conducteur anisotrope

Country Status (4)

Country Link
JP (1) JP4217271B2 (fr)
KR (1) KR101088667B1 (fr)
CN (1) CN101622679B (fr)
WO (1) WO2008105355A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004428A (ja) * 2011-06-20 2013-01-07 Nippon Shokubai Co Ltd 導電性微粒子及び異方性導電材料
JP2015050112A (ja) * 2013-09-03 2015-03-16 株式会社日本触媒 導電性微粒子
JP2015092475A (ja) * 2013-10-02 2015-05-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6146302B2 (ja) * 2011-05-18 2017-06-14 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
CN110669324B (zh) * 2019-10-25 2022-05-27 中国建筑材料科学研究总院有限公司 导电玻璃钢、导电玻璃钢板材及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025345A (ja) * 2000-07-05 2002-01-25 Nisshin Steel Co Ltd 耐マイグレーション性に優れた導電性粒子
JP2006128046A (ja) * 2004-11-01 2006-05-18 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料及び導電接続構造体
JP2006228475A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006302716A (ja) * 2005-04-21 2006-11-02 Sekisui Chem Co Ltd 導電性粒子及び異方性導電材料
JP2006351508A (ja) * 2005-05-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025345A (ja) * 2000-07-05 2002-01-25 Nisshin Steel Co Ltd 耐マイグレーション性に優れた導電性粒子
JP2006128046A (ja) * 2004-11-01 2006-05-18 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料及び導電接続構造体
JP2006228475A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006302716A (ja) * 2005-04-21 2006-11-02 Sekisui Chem Co Ltd 導電性粒子及び異方性導電材料
JP2006351508A (ja) * 2005-05-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004428A (ja) * 2011-06-20 2013-01-07 Nippon Shokubai Co Ltd 導電性微粒子及び異方性導電材料
JP2015050112A (ja) * 2013-09-03 2015-03-16 株式会社日本触媒 導電性微粒子
JP2015092475A (ja) * 2013-10-02 2015-05-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2020174051A (ja) * 2014-05-27 2020-10-22 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7032481B2 (ja) 2014-05-27 2022-03-08 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2022084620A (ja) * 2014-05-27 2022-06-07 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7421580B2 (ja) 2014-05-27 2024-01-24 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JP4217271B2 (ja) 2009-01-28
CN101622679A (zh) 2010-01-06
JPWO2008105355A1 (ja) 2010-06-03
CN101622679B (zh) 2012-01-25
KR101088667B1 (ko) 2011-12-01
KR20090113846A (ko) 2009-11-02

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