WO2008120518A1 - Appareil de manipulation de point d'outil - Google Patents

Appareil de manipulation de point d'outil Download PDF

Info

Publication number
WO2008120518A1
WO2008120518A1 PCT/JP2008/053516 JP2008053516W WO2008120518A1 WO 2008120518 A1 WO2008120518 A1 WO 2008120518A1 JP 2008053516 W JP2008053516 W JP 2008053516W WO 2008120518 A1 WO2008120518 A1 WO 2008120518A1
Authority
WO
WIPO (PCT)
Prior art keywords
tcps
probe cards
tcp handler
handling apparatus
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053516
Other languages
English (en)
Japanese (ja)
Inventor
Hisashi Murano
Yukihiro Kawamura
Takeshi Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2009507436A priority Critical patent/JPWO2008120518A1/ja
Publication of WO2008120518A1 publication Critical patent/WO2008120518A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Dans un manipulateur de point d'outil (2), une bande support (5) sur laquelle plusieurs points d'outil sont formés est transférée, la bande support (5) est pressée contre des cartes sondes (8a, 8b) ayant plusieurs sondes (81) électriquement connectées à une tête d'essai (10), et des plots d'essai des points d'outil sont connectés aux sondes (81) des cartes sondes (8a, 8b). Ainsi, le manipulateur de point d'outil teste successivement les points d'outil. Les deux cartes sondes (8a, 8b) sont disposées en correspondance avec les deux points d'outil devant être testés en même temps. Des appareils de déplacement (7a, 7b), qui déplacent les cartes sondes (8a, 8b) pour chaque carte sonde (8a, 8b), sont prévus. Des erreurs de contact lors de l'essai des points d'outil en même temps peuvent être réduites par l'utilisation du manipulateur de point d'outil (2).
PCT/JP2008/053516 2007-03-29 2008-02-28 Appareil de manipulation de point d'outil Ceased WO2008120518A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507436A JPWO2008120518A1 (ja) 2007-03-29 2008-02-28 Ｔｃｐハンドリング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007086230 2007-03-29
JP2007-086230 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120518A1 true WO2008120518A1 (fr) 2008-10-09

Family

ID=39808102

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053516 Ceased WO2008120518A1 (fr) 2007-03-29 2008-02-28 Appareil de manipulation de point d'outil

Country Status (4)

Country Link
JP (1) JPWO2008120518A1 (fr)
KR (1) KR20090122306A (fr)
TW (1) TW200903683A (fr)
WO (1) WO2008120518A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012068032A (ja) * 2010-09-21 2012-04-05 Tesetsuku:Kk Ｔｃｐ試験装置
KR101443315B1 (ko) * 2014-03-19 2014-09-26 피앤티솔루션 주식회사 연성 인쇄회로기판의 프로브 컨택 검사 장치
KR102014496B1 (ko) * 2019-04-08 2019-10-21 박형수 필름형 칩용 핸들러
KR102016395B1 (ko) * 2019-04-08 2019-10-21 류호민 필름형 칩용 핸들러
TWI709519B (zh) * 2020-01-22 2020-11-11 鴻勁精密股份有限公司 具換帶單元之測試設備及換帶方法
TWI715499B (zh) * 2020-05-19 2021-01-01 鴻勁精密股份有限公司 檢知裝置及其應用之測試調校方法、測試設備

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644044A (en) * 1987-06-25 1989-01-09 Nec Corp Handling device of tab-type ic
JPH10253688A (ja) * 1997-03-10 1998-09-25 Sony Corp フレキシブル回路基板の導通検査装置及び導通検査方法
WO2004068154A1 (fr) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Dispositif de manipulation de tcp et procede de correction de deviation approprie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644044A (en) * 1987-06-25 1989-01-09 Nec Corp Handling device of tab-type ic
JPH10253688A (ja) * 1997-03-10 1998-09-25 Sony Corp フレキシブル回路基板の導通検査装置及び導通検査方法
WO2004068154A1 (fr) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Dispositif de manipulation de tcp et procede de correction de deviation approprie

Also Published As

Publication number Publication date
KR20090122306A (ko) 2009-11-26
JPWO2008120518A1 (ja) 2010-07-15
TW200903683A (en) 2009-01-16

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