WO2008129963A1 - 半導体発光素子およびその製造方法 - Google Patents

半導体発光素子およびその製造方法 Download PDF

Info

Publication number
WO2008129963A1
WO2008129963A1 PCT/JP2008/057176 JP2008057176W WO2008129963A1 WO 2008129963 A1 WO2008129963 A1 WO 2008129963A1 JP 2008057176 W JP2008057176 W JP 2008057176W WO 2008129963 A1 WO2008129963 A1 WO 2008129963A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
metal
emitting device
semiconductor light
gaas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057176
Other languages
English (en)
French (fr)
Inventor
Masakazu Takao
Mitsuhiko Sakai
Kazuhiko Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP08740273.1A priority Critical patent/EP2139052B1/en
Priority to US12/596,004 priority patent/US8106412B2/en
Priority to KR1020097023683A priority patent/KR101446370B1/ko
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of WO2008129963A1 publication Critical patent/WO2008129963A1/ja
Anticipated expiration legal-status Critical
Priority to US13/327,860 priority patent/US8536598B2/en
Priority to US14/286,696 priority patent/US9196808B2/en
Priority to US14/928,349 priority patent/US9450145B2/en
Priority to US15/248,332 priority patent/US9786819B2/en
Priority to US15/716,452 priority patent/US10032961B2/en
Priority to US16/015,282 priority patent/US10483435B2/en
Priority to US16/657,403 priority patent/US11616172B2/en
Priority to US18/169,555 priority patent/US20230197906A1/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162Current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/833Transparent materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means

Landscapes

  • Led Devices (AREA)

Abstract

 不透明な半導体基板を用いて、金属反射層を形成して高輝度の半導体発光素子およびその製造方法を提供する。  GaAs層3と、GaAs層の表面に配置された第1金属バッファ層2と、第1金属バッファ層上に配置された第1金属層1と、GaAs層の裏面に配置された第2金属バッファ層4と第2金属層5とを備えるGaAs基板構造と、GaAs基板構造上に配置され、第3金属層12と、第3金属層上に配置される金属コンタクト層11と、金属コンタクト層上に配置されるp型クラッド層10と、p型クラッド層に配置される多重量子井戸層9と、多重量子井戸層上に配置されるn型クラッド層8と、n型クラッド層上に配置されるウィンドウ層7を備える発光ダイオード構造とから構成され、第1金属層1および第3金属層12を用いて、GaAs基板構造と、発光ダイオード構造を貼り付けることを特徴とする。
PCT/JP2008/057176 2007-04-16 2008-04-11 半導体発光素子およびその製造方法 Ceased WO2008129963A1 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
EP08740273.1A EP2139052B1 (en) 2007-04-16 2008-04-11 Semiconductor light-emitting device and method for manufacturing the same
US12/596,004 US8106412B2 (en) 2007-04-16 2008-04-11 Semiconductor light emitting device and fabrication method for the same
KR1020097023683A KR101446370B1 (ko) 2007-04-16 2008-04-11 반도체 발광 소자 및 그 제조 방법
US13/327,860 US8536598B2 (en) 2007-04-16 2011-12-16 Semiconductor light emitting device and fabrication method for the same
US14/286,696 US9196808B2 (en) 2007-04-16 2014-05-23 Semiconductor light emitting device
US14/928,349 US9450145B2 (en) 2007-04-16 2015-10-30 Semiconductor light emitting device
US15/248,332 US9786819B2 (en) 2007-04-16 2016-08-26 Semiconductor light emitting device
US15/716,452 US10032961B2 (en) 2007-04-16 2017-09-26 Semiconductor light emitting device
US16/015,282 US10483435B2 (en) 2007-04-16 2018-06-22 Semiconductor light emitting device
US16/657,403 US11616172B2 (en) 2007-04-16 2019-10-18 Semiconductor light emitting device with frosted semiconductor layer
US18/169,555 US20230197906A1 (en) 2007-04-16 2023-02-15 Semiconductor light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-107130 2007-04-16
JP2007107130A JP5346443B2 (ja) 2007-04-16 2007-04-16 半導体発光素子およびその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/596,004 A-371-Of-International US8106412B2 (en) 2007-04-16 2008-04-11 Semiconductor light emitting device and fabrication method for the same
US13/327,860 Division US8536598B2 (en) 2007-04-16 2011-12-16 Semiconductor light emitting device and fabrication method for the same

Publications (1)

Publication Number Publication Date
WO2008129963A1 true WO2008129963A1 (ja) 2008-10-30

Family

ID=39875491

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057176 Ceased WO2008129963A1 (ja) 2007-04-16 2008-04-11 半導体発光素子およびその製造方法

Country Status (7)

Country Link
US (10) US8106412B2 (ja)
EP (1) EP2139052B1 (ja)
JP (1) JP5346443B2 (ja)
KR (1) KR101446370B1 (ja)
CN (2) CN104409588B (ja)
TW (1) TWI481065B (ja)
WO (1) WO2008129963A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346443B2 (ja) 2007-04-16 2013-11-20 ローム株式会社 半導体発光素子およびその製造方法
WO2009129353A1 (en) * 2008-04-15 2009-10-22 Purdue Research Foundation Metallized silicon substrate for indium gallium nitride light-emitting diode
KR101363022B1 (ko) * 2008-12-23 2014-02-14 삼성디스플레이 주식회사 유기 발광 표시 장치
KR100999726B1 (ko) 2009-05-04 2010-12-08 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP2011129724A (ja) * 2009-12-18 2011-06-30 Dowa Electronics Materials Co Ltd 半導体発光素子およびその製造方法
TW201145577A (en) * 2010-06-11 2011-12-16 Hon Hai Prec Ind Co Ltd Light-emitting diode unit and method for making it
CN102280552B (zh) * 2010-06-14 2015-06-03 鸿富锦精密工业(深圳)有限公司 发光二极管晶粒及其制作方法
US9269870B2 (en) 2011-03-17 2016-02-23 Epistar Corporation Light-emitting device with intermediate layer
US9601657B2 (en) * 2011-03-17 2017-03-21 Epistar Corporation Light-emitting device
US8686398B2 (en) 2012-03-02 2014-04-01 Kabushiki Kaisha Toshiba Semiconductor light emitting device
US9450152B2 (en) * 2012-05-29 2016-09-20 Micron Technology, Inc. Solid state transducer dies having reflective features over contacts and associated systems and methods
JP2014022401A (ja) 2012-07-12 2014-02-03 Toshiba Corp 窒化物半導体発光素子
JP5954185B2 (ja) * 2012-12-04 2016-07-20 日亜化学工業株式会社 半導体素子の製造方法
TWI613838B (zh) * 2014-03-06 2018-02-01 晶元光電股份有限公司 發光元件
CN104502878B (zh) * 2014-12-26 2018-07-31 中国电子科技集团公司第十三研究所 微波GaAs衬底在片S参数微带线TRL校准件
CN105785304B (zh) * 2016-05-11 2018-09-18 中国电子科技集团公司第十三研究所 用于校准在片高值电阻测量系统的标准件
JP6669144B2 (ja) * 2016-12-16 2020-03-18 日亜化学工業株式会社 発光素子の製造方法
DE102017115252A1 (de) * 2017-07-07 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtstapels und Schichtstapel
JP7308831B2 (ja) * 2017-12-14 2023-07-14 ルミレッズ リミテッド ライアビリティ カンパニー Ledダイの汚染を防止する方法
US10522708B2 (en) 2017-12-14 2019-12-31 Lumileds Llc Method of preventing contamination of LED die
JP2021012936A (ja) * 2019-07-05 2021-02-04 株式会社ディスコ 光デバイスの移設方法
TWI763377B (zh) * 2021-03-16 2022-05-01 兆勁科技股份有限公司 發光元件

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302857A (ja) 1993-03-19 1994-10-28 Hewlett Packard Co <Hp> 発光ダイオードの製造方法
JPH09186365A (ja) * 1995-12-21 1997-07-15 Hewlett Packard Co <Hp> 発光半導体デバイス用高反射性接点及びその製造方法
JP2000277804A (ja) * 1995-06-15 2000-10-06 Nichia Chem Ind Ltd 窒化物半導体素子の製造方法及び窒化物半導体素子、並びに発光素子
JP2004146593A (ja) * 2002-10-24 2004-05-20 Rohm Co Ltd 半導体発光素子
WO2004051758A1 (ja) * 2002-11-29 2004-06-17 Sanken Electric Co., Ltd. 半導体発光素子及びその製造方法
JP2005123530A (ja) * 2003-10-20 2005-05-12 Shin Etsu Handotai Co Ltd 発光素子の製造方法
JP2005259820A (ja) * 2004-03-09 2005-09-22 Sharp Corp Iii−v族化合物半導体発光素子とその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19537544A1 (de) * 1995-10-09 1997-04-10 Telefunken Microelectron Lumineszenzdiode mit verbesserter Lichtausbeute
US6608330B1 (en) * 1998-09-21 2003-08-19 Nichia Corporation Light emitting device
US6803596B2 (en) * 1999-12-27 2004-10-12 Sanyo Electric Co., Ltd. Light emitting device
US6586762B2 (en) * 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
US6803604B2 (en) * 2001-03-13 2004-10-12 Ricoh Company, Ltd. Semiconductor optical modulator, an optical amplifier and an integrated semiconductor light-emitting device
TW541710B (en) * 2001-06-27 2003-07-11 Epistar Corp LED having transparent substrate and the manufacturing method thereof
JP4833456B2 (ja) 2001-08-28 2011-12-07 古河電気工業株式会社 半導体デバイスの製造方法
US6784462B2 (en) 2001-12-13 2004-08-31 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
JP3782357B2 (ja) 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
DE10239045A1 (de) * 2002-08-26 2004-03-11 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektromagnetische Strahlung emittierenden Halbleiterchips und elektromagnetische Strahlung emittierender Halbleiterchip
US20050205886A1 (en) * 2002-11-29 2005-09-22 Sanken Electric Co., Ltd. Gallium-containing light-emitting semiconductor device and method of fabrication
JP2003282946A (ja) 2003-02-06 2003-10-03 Matsushita Electric Ind Co Ltd 発光ダイオード装置及びその製造方法
TWI230473B (en) 2003-03-10 2005-04-01 Sanken Electric Co Ltd Semiconductor light emitting device and manufacturing method thereof
US20040227151A1 (en) * 2003-03-31 2004-11-18 Hitachi Cable, Ltd. Light emitting diode
US7704763B2 (en) * 2003-12-09 2010-04-27 The Regents Of The University Of California Highly efficient group-III nitride based light emitting diodes via fabrication of structures on an N-face surface
TWM255518U (en) * 2004-04-23 2005-01-11 Super Nova Optoelectronics Cor Vertical electrode structure of Gallium Nitride based LED
JP4154731B2 (ja) * 2004-04-27 2008-09-24 信越半導体株式会社 発光素子の製造方法及び発光素子
US8049243B2 (en) * 2004-05-26 2011-11-01 Showa Denko K.K. Gallium nitride-based compound semiconductor light emitting device
US7508001B2 (en) * 2004-06-21 2009-03-24 Panasonic Corporation Semiconductor laser device and manufacturing method thereof
JP2006013381A (ja) 2004-06-29 2006-01-12 Shin Etsu Handotai Co Ltd 発光素子
JP4644193B2 (ja) 2004-07-12 2011-03-02 ローム株式会社 半導体発光素子
JP4592388B2 (ja) * 2004-11-04 2010-12-01 シャープ株式会社 Iii−v族化合物半導体発光素子およびその製造方法
US8097897B2 (en) * 2005-06-21 2012-01-17 Epistar Corporation High-efficiency light-emitting device and manufacturing method thereof
US7510768B2 (en) 2005-06-17 2009-03-31 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein
JP4899348B2 (ja) * 2005-05-31 2012-03-21 信越半導体株式会社 発光素子の製造方法
JP4970265B2 (ja) 2005-08-03 2012-07-04 スタンレー電気株式会社 半導体発光素子及びその製造方法
JP4362125B2 (ja) * 2006-03-15 2009-11-11 ローム株式会社 側面発光半導体素子及び側面発光半導体素子の製造方法
JP2008047672A (ja) * 2006-08-14 2008-02-28 Sumitomo Electric Ind Ltd 半導体光素子
JP4462251B2 (ja) * 2006-08-17 2010-05-12 日立電線株式会社 Iii−v族窒化物系半導体基板及びiii−v族窒化物系発光素子
JP4835377B2 (ja) 2006-10-20 2011-12-14 日立電線株式会社 半導体発光素子
JP5346443B2 (ja) * 2007-04-16 2013-11-20 ローム株式会社 半導体発光素子およびその製造方法
US8546818B2 (en) * 2007-06-12 2013-10-01 SemiLEDs Optoelectronics Co., Ltd. Vertical LED with current-guiding structure
JP5123573B2 (ja) * 2007-06-13 2013-01-23 ローム株式会社 半導体発光素子およびその製造方法
US8124991B2 (en) * 2007-07-26 2012-02-28 The Regents Of The University Of California Light emitting diodes with a P-type surface bonded to a transparent submount to increase light extraction efficiency
US9634191B2 (en) * 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
KR100975659B1 (ko) * 2007-12-18 2010-08-17 포항공과대학교 산학협력단 발광 소자 및 그 제조 방법
JP2009200178A (ja) * 2008-02-20 2009-09-03 Hitachi Cable Ltd 半導体発光素子
US8179937B2 (en) * 2009-01-08 2012-05-15 Quantum Electro Opto Systems Sdn. Bhd. High speed light emitting semiconductor methods and devices
JP4375497B1 (ja) * 2009-03-11 2009-12-02 住友電気工業株式会社 Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法
US7906795B2 (en) * 2009-05-08 2011-03-15 Epistar Corporation Light-emitting device
JP2014120695A (ja) * 2012-12-19 2014-06-30 Rohm Co Ltd 半導体発光素子

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302857A (ja) 1993-03-19 1994-10-28 Hewlett Packard Co <Hp> 発光ダイオードの製造方法
US5376580A (en) 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
JP2004080042A (ja) * 1993-03-19 2004-03-11 Lumileds Lighting Us Llc 第2の発光ダイオード層に対する接合のための発光ダイオード層表面のパターン形成
JP2000277804A (ja) * 1995-06-15 2000-10-06 Nichia Chem Ind Ltd 窒化物半導体素子の製造方法及び窒化物半導体素子、並びに発光素子
JPH09186365A (ja) * 1995-12-21 1997-07-15 Hewlett Packard Co <Hp> 発光半導体デバイス用高反射性接点及びその製造方法
JP2004146593A (ja) * 2002-10-24 2004-05-20 Rohm Co Ltd 半導体発光素子
WO2004051758A1 (ja) * 2002-11-29 2004-06-17 Sanken Electric Co., Ltd. 半導体発光素子及びその製造方法
JP2005123530A (ja) * 2003-10-20 2005-05-12 Shin Etsu Handotai Co Ltd 発光素子の製造方法
JP2005259820A (ja) * 2004-03-09 2005-09-22 Sharp Corp Iii−v族化合物半導体発光素子とその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2139052A4

Also Published As

Publication number Publication date
KR20090130127A (ko) 2009-12-17
US20100133507A1 (en) 2010-06-03
EP2139052B1 (en) 2018-11-21
US9786819B2 (en) 2017-10-10
US20140008610A1 (en) 2014-01-09
US8536598B2 (en) 2013-09-17
US20140264267A1 (en) 2014-09-18
EP2139052A1 (en) 2009-12-30
JP5346443B2 (ja) 2013-11-20
JP2008270261A (ja) 2008-11-06
CN104409588A (zh) 2015-03-11
US11616172B2 (en) 2023-03-28
US20160365489A1 (en) 2016-12-15
US9196808B2 (en) 2015-11-24
US8106412B2 (en) 2012-01-31
US20180301599A1 (en) 2018-10-18
US20230197906A1 (en) 2023-06-22
TW200847492A (en) 2008-12-01
US20160056332A1 (en) 2016-02-25
US9018650B2 (en) 2015-04-28
US10483435B2 (en) 2019-11-19
EP2139052A4 (en) 2014-01-01
US20200052163A1 (en) 2020-02-13
KR101446370B1 (ko) 2014-10-01
CN104409588B (zh) 2017-05-31
US20120132889A1 (en) 2012-05-31
US10032961B2 (en) 2018-07-24
US20180019381A1 (en) 2018-01-18
TWI481065B (zh) 2015-04-11
US9450145B2 (en) 2016-09-20
CN101657912A (zh) 2010-02-24

Similar Documents

Publication Publication Date Title
WO2008129963A1 (ja) 半導体発光素子およびその製造方法
WO2008152988A1 (ja) 半導体発光素子およびその製造方法
TWI266439B (en) Semiconductor light emitting device and its manufacturing method
JP5722844B2 (ja) 発光デバイス及びその作製方法
WO2006023060A3 (en) Group iii nitride based quantum well light emitting device structures with an indium containing capping structure
WO2008054994A3 (en) Deep ultraviolet light emitting device and method for fabricating same
TWI266438B (en) Semiconductor light emitting device with protective element, and its manufacturing method
WO2009005894A3 (en) Non-polar ultraviolet light emitting device and method for fabricating same
WO2009120990A3 (en) Ultraviolet light emitting diode/laser diode with nested superlattice
TW200614614A (en) Nitride-based compound semiconductor light emitting device, structural unit thereof, and fabricating method thereof
WO2004075309A3 (en) Reflective ohmic contact for silicon carbide, light emitting diode in including the same, and manufacturing method
WO2007036858A3 (en) Iii-v light emitting device
TW200601586A (en) Flip-chip light emitting diode and fabricating method thereof
WO2010146390A3 (en) Light emitting diodes
WO2006104935A3 (en) Light emitting diodes and methods of fabrication
TW200618342A (en) Nitride-based compound semiconductor light emitting device and fabricating method thereof
TW200509422A (en) Light-emitting device and manufacturing method thereof
TW200739949A (en) Gallium nitride type compound semiconductor light-emitting device and process for producing the same
TW200717843A (en) Light-emitting element with high-light-extracting-efficiency
TW200608607A (en) Semiconductor light-emitting device and manufacturing method thereof
EP1235317A3 (en) Semiconductor laser module and semiconductor laser device having light feedback function
WO2008084834A1 (ja) GaN系半導体発光素子
TW200746460A (en) Semiconductor light emitting device and method of manufacturing the same
TW200703706A (en) Light emitting diode and manufacturing method thereof
EP1734590A3 (en) Light-Emitting device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880012118.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740273

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12596004

Country of ref document: US

Ref document number: 2008740273

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097023683

Country of ref document: KR

Kind code of ref document: A