WO2008149727A1 - 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム - Google Patents

難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム Download PDF

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Publication number
WO2008149727A1
WO2008149727A1 PCT/JP2008/059721 JP2008059721W WO2008149727A1 WO 2008149727 A1 WO2008149727 A1 WO 2008149727A1 JP 2008059721 W JP2008059721 W JP 2008059721W WO 2008149727 A1 WO2008149727 A1 WO 2008149727A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
flame
retardant adhesive
adhesive resin
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059721
Other languages
English (en)
French (fr)
Inventor
Shigeaki Tauchi
Tetsunori Satou
Katsuyuki Aida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohto Kasei Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Tohto Kasei Co Ltd
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohto Kasei Co Ltd, Nippon Steel Chemical Co Ltd filed Critical Tohto Kasei Co Ltd
Priority to JP2009517809A priority Critical patent/JP5278706B2/ja
Publication of WO2008149727A1 publication Critical patent/WO2008149727A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

　硬化前のフィルム状態においてワレ、ハガレなどがなく作業性に優れ、硬化後のピール接着力、ハンダ耐熱性、フロー性等の接着剤特性に優れ、非ハロゲン化を実現した難燃性の接着剤樹脂組成物を提供する。また、これを使用して得られるボンディングシート及びカバーレイフィルムを提供する。 　この難燃性接着剤樹脂組成物は、（A）フェノキシ樹脂、（B）エポキシ樹脂、（C）硬化剤、並びに（D）硬化促進剤を必須成分として含有し、硬化剤の活性水素当量が２０～３０であり、難燃性接着剤樹脂組成物１００重量部中に、有機リン化合物又はリン含有フェノキシ樹脂をリンとして０．５～５重量部を含有し、且つ該樹脂組成物の熱硬化後ガラス転移温度が１００°C以上である。
PCT/JP2008/059721 2007-06-05 2008-05-27 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム Ceased WO2008149727A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009517809A JP5278706B2 (ja) 2007-06-05 2008-05-27 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-149100 2007-06-05
JP2007149100 2007-06-05

Publications (1)

Publication Number Publication Date
WO2008149727A1 true WO2008149727A1 (ja) 2008-12-11

Family

ID=40093548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059721 Ceased WO2008149727A1 (ja) 2007-06-05 2008-05-27 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム

Country Status (3)

Country Link
JP (1) JP5278706B2 (ja)
TW (1) TWI437063B (ja)
WO (1) WO2008149727A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102749573B1 (ko) * 2023-12-22 2025-01-07 율촌화학 주식회사 레진플로우가 적고 밀착력이 우수한 열경화형 접착제 조성물, 및 이를 포함하는 열경화형 접착 필름

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143252A (ja) * 1995-11-21 1997-06-03 Hitachi Chem Co Ltd 回路用接続部材
JP2000219851A (ja) * 1999-02-01 2000-08-08 Hitachi Cable Ltd Ｔａｂテープへのフィルム状接着剤の張り付け方法
JP2001237552A (ja) * 2000-02-25 2001-08-31 Kyocera Corp 接着材およびこれを用いた電子部品
JP2001310939A (ja) * 2000-04-27 2001-11-06 Toto Kasei Co Ltd 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム
JP2003176470A (ja) * 2001-12-12 2003-06-24 Tokai Rubber Ind Ltd フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板
JP2005290229A (ja) * 2004-03-31 2005-10-20 Arisawa Mfg Co Ltd 難燃性樹脂組成物及び当該難燃性樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板
JP2006232985A (ja) * 2005-02-24 2006-09-07 Shin Etsu Chem Co Ltd 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143252A (ja) * 1995-11-21 1997-06-03 Hitachi Chem Co Ltd 回路用接続部材
JP2000219851A (ja) * 1999-02-01 2000-08-08 Hitachi Cable Ltd Ｔａｂテープへのフィルム状接着剤の張り付け方法
JP2001237552A (ja) * 2000-02-25 2001-08-31 Kyocera Corp 接着材およびこれを用いた電子部品
JP2001310939A (ja) * 2000-04-27 2001-11-06 Toto Kasei Co Ltd 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム
JP2003176470A (ja) * 2001-12-12 2003-06-24 Tokai Rubber Ind Ltd フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板
JP2005290229A (ja) * 2004-03-31 2005-10-20 Arisawa Mfg Co Ltd 難燃性樹脂組成物及び当該難燃性樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板
JP2006232985A (ja) * 2005-02-24 2006-09-07 Shin Etsu Chem Co Ltd 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102749573B1 (ko) * 2023-12-22 2025-01-07 율촌화학 주식회사 레진플로우가 적고 밀착력이 우수한 열경화형 접착제 조성물, 및 이를 포함하는 열경화형 접착 필름

Also Published As

Publication number Publication date
JP5278706B2 (ja) 2013-09-04
JPWO2008149727A1 (ja) 2010-08-26
TW200911945A (en) 2009-03-16
TWI437063B (zh) 2014-05-11

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