WO2009000611A3 - Baugruppe mit einem asic und einem gehäuse für den asic - Google Patents

Baugruppe mit einem asic und einem gehäuse für den asic Download PDF

Info

Publication number
WO2009000611A3
WO2009000611A3 PCT/EP2008/056803 EP2008056803W WO2009000611A3 WO 2009000611 A3 WO2009000611 A3 WO 2009000611A3 EP 2008056803 W EP2008056803 W EP 2008056803W WO 2009000611 A3 WO2009000611 A3 WO 2009000611A3
Authority
WO
WIPO (PCT)
Prior art keywords
asic
housing
subassembly
terminals
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/056803
Other languages
English (en)
French (fr)
Other versions
WO2009000611A2 (de
Inventor
Wolfgang Hauer
Richard Muehlheim
Hubert Benzel
Roland Guenschel
Dirk Dittmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009000611A2 publication Critical patent/WO2009000611A2/de
Publication of WO2009000611A3 publication Critical patent/WO2009000611A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Fluid Pressure (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

Mit der vorliegenden Erfindung wird ein einfacher, platzsparender und kostengünstiger Aufbau einer Baugruppe (10) mit mindestens einem ASIC (1) und einem Gehäuse für den ASIC (1) vorgeschlagen, wobei das Gehäuse mit Anschlüssen (6) zum externen Anschluss des ASIC (1) über elektrische Leitungen ausgestattet ist und wobei mindestens ein elektronisches Bauelement (7) zum Schutz des ASIC (1) gegen elektrostatische Entladungen (ESD-Schutz) und zur Unterdrückung von über die Leitungen oder Anschlüsse (6) induzierten Störspannungen (EMV) vorgesehen ist. Erfindungsgemäß ist das mindestens eine Bauelement (7) innerhalb des Gehäuses angeordnet und mit mindestens einem Anschluss (6) verbunden.
PCT/EP2008/056803 2007-06-27 2008-06-03 Baugruppe mit einem asic und einem gehäuse für den asic Ceased WO2009000611A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007029720A DE102007029720A1 (de) 2007-06-27 2007-06-27 Baugruppe mit einem ASIC und einem Gehäuse für den ASIC
DE102007029720.5 2007-06-27

Publications (2)

Publication Number Publication Date
WO2009000611A2 WO2009000611A2 (de) 2008-12-31
WO2009000611A3 true WO2009000611A3 (de) 2009-02-19

Family

ID=40070864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/056803 Ceased WO2009000611A2 (de) 2007-06-27 2008-06-03 Baugruppe mit einem asic und einem gehäuse für den asic

Country Status (2)

Country Link
DE (1) DE102007029720A1 (de)
WO (1) WO2009000611A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3206027B1 (de) * 2016-02-11 2019-09-11 Sensirion AG Sensor-chip mit einem schutzelement gegen elektrostatische entladung
EP4739005A1 (de) * 2024-10-30 2026-05-06 Honeywell International Inc. Messvorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (de) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Sensormodul mit einem kondensator emv- und esd-schutz
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324220A1 (de) 2003-05-28 2004-12-16 Robert Bosch Gmbh Sockeldesign zur Selbstzentrierung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (de) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Sensormodul mit einem kondensator emv- und esd-schutz
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Also Published As

Publication number Publication date
DE102007029720A1 (de) 2009-01-08
WO2009000611A2 (de) 2008-12-31

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