WO2009010355A3 - Mikromechanisches bauelement und verfahren zum betrieb eines mikromechanischen bauelements - Google Patents

Mikromechanisches bauelement und verfahren zum betrieb eines mikromechanischen bauelements Download PDF

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Publication number
WO2009010355A3
WO2009010355A3 PCT/EP2008/057553 EP2008057553W WO2009010355A3 WO 2009010355 A3 WO2009010355 A3 WO 2009010355A3 EP 2008057553 W EP2008057553 W EP 2008057553W WO 2009010355 A3 WO2009010355 A3 WO 2009010355A3
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical component
electrodes
seismic mass
stationary structure
operating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/057553
Other languages
English (en)
French (fr)
Other versions
WO2009010355A2 (de
Inventor
Johannes Classen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009010355A2 publication Critical patent/WO2009010355A2/de
Publication of WO2009010355A3 publication Critical patent/WO2009010355A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

Es wird ein mikromechanisches Bauelement und ein Verfahren zum Betrieb eines mikromechanischen Bauelements vorgeschlagen, wobei das mikromechanische Bauelement eine Feststruktur und eine seismische Masse aufweist, wobei die Feststruktur erste Elektroden und die seismische Masse zweite Elektroden aufweist und wobei die seismische Masse gegenüber der Feststruktur in einer zur direkten Verbindungslinie der seismischen Masse mit der Feststruktur parallelen Hauptbewegungsrichtung in einer Haupterstreckungsebene der Feststruktur beweglich ist und wobei ferner in einer Ruhelage der seismischen Masse die ersten Elektroden und die zweiten Elektroden derart voneinander beabstandet sind, dass keine Überlappung der ersten Elektroden relativ zu den zweiten Elektroden in einer zur Hauptbewegungsrichtung senkrechten ersten Richtung in der Haupterstreckungsebene vorgesehen ist und lediglich in einem Auslenkungszustand eine derartige Überlappung entsteht.
PCT/EP2008/057553 2007-07-16 2008-06-16 Mikromechanisches bauelement und verfahren zum betrieb eines mikromechanischen bauelements Ceased WO2009010355A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710033001 DE102007033001A1 (de) 2007-07-16 2007-07-16 Mikromechanisches Bauelement und Verfahren zum Betrieb eines mikromechanischen Bauelements
DE102007033001.6 2007-07-16

Publications (2)

Publication Number Publication Date
WO2009010355A2 WO2009010355A2 (de) 2009-01-22
WO2009010355A3 true WO2009010355A3 (de) 2009-03-26

Family

ID=40148856

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/057553 Ceased WO2009010355A2 (de) 2007-07-16 2008-06-16 Mikromechanisches bauelement und verfahren zum betrieb eines mikromechanischen bauelements

Country Status (2)

Country Link
DE (1) DE102007033001A1 (de)
WO (1) WO2009010355A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009045421B4 (de) * 2009-10-07 2022-11-03 Robert Bosch Gmbh Mikromechanische Struktur, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
DE102009045696B4 (de) * 2009-10-14 2021-06-02 Robert Bosch Gmbh Verfahren zur kapazitiven Erfassung einer mechanischen Auslenkung
EP2743639B1 (de) * 2011-08-09 2018-09-19 Toyota Jidosha Kabushiki Kaisha Aufbau einer wegüberwachungselektrode
WO2013030907A1 (ja) * 2011-08-26 2013-03-07 トヨタ自動車株式会社 変位量モニタ電極の構造

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914553A (en) * 1997-06-16 1999-06-22 Cornell Research Foundation, Inc. Multistable tunable micromechanical resonators
EP1640781A2 (de) * 2004-08-18 2006-03-29 LG Electronics, Inc. Abtastvorrichtung und Methode zu dessen Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025346A (en) 1989-02-17 1991-06-18 Regents Of The University Of California Laterally driven resonant microstructures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914553A (en) * 1997-06-16 1999-06-22 Cornell Research Foundation, Inc. Multistable tunable micromechanical resonators
EP1640781A2 (de) * 2004-08-18 2006-03-29 LG Electronics, Inc. Abtastvorrichtung und Methode zu dessen Herstellung

Also Published As

Publication number Publication date
DE102007033001A1 (de) 2009-01-22
WO2009010355A2 (de) 2009-01-22

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