WO2009010703A1 - Unité électrique - Google Patents
Unité électrique Download PDFInfo
- Publication number
- WO2009010703A1 WO2009010703A1 PCT/GB2007/002723 GB2007002723W WO2009010703A1 WO 2009010703 A1 WO2009010703 A1 WO 2009010703A1 GB 2007002723 W GB2007002723 W GB 2007002723W WO 2009010703 A1 WO2009010703 A1 WO 2009010703A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- main body
- housing main
- contact
- pairs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/105—Mechanically attached to another device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Definitions
- one of the electrical components that must be housed within the unit is a large, relatively heavy capacitor. While most of the electronic components are surface-mounted on the PCB, it is preferred not to attach a bulky capacitor to the PCB directly, since the weight of the capacitor is likely to break or distort the substrate of the PCB. It has therefore been proposed to attach large components such as capacitors to an interior surface of the housing of the unit, so that the weight of the component places no mechanical stress on the PCB itself, and to connect the component electrically to the PCB by a wire cable or lead.
- pairs of substantially parallel walls are generally perpendicular to one another.
- a cover is provided to close the opening of the unit, the cover being in electrical contact with the circuit board and allowing conductive communication between the circuit board and the exterior of the unit.
- the step of mounting the electrical component is carried out before the step of introducing the circuit board into the housing main body.
- a pair of parallel, spaced apart ribs 7 run around the interior of the main body 1 , protruding from the two side walls 2,3 and the back wall 6.
- the ribs are provided parallel with and slightly above the bottom surface 5, and define a narrow space therebetween.
- a mounting arrangement 8 is provided to receive and retain an electronic component, as will be described in more detail below.
- the mounting arrangement 8 comprises a hollow, generally cylindrical holder 9, which is attached to the inner surface of the top wall 4, and has a break 10 in the circumference thereof on the side opposite from the top wall 4.
- the holder 9 is oriented so that its longitudinal axis is parallel with the planes of the top, bottom and side walls 4,5, 2,3, and the holder 9 extends over substantially the entire depth of the main body 1.
- On the back wall 6 of the main body 1 two elongate, generally rectangular support protrusions 11 are provided, which are spaced apart from one another, and extend from the side of the holder 9 furthest from the top wall 4 to the bottom wall 5, being parallel with the side walls 2,3.
- the invention comprises a substantially cylindrical body 14, and has two contact pins 15 protruding from one of the end faces thereof.
- the contact pins 15 preferably have a substantially constant diameter over their lengths, or at least over contact portions thereof which are to be connected to a circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
L'invention concerne une unité électrique comprenant un corps principal de logement (1) ayant une ouverture fournissant un accès à son intérieur, le corps principal de logement ayant une paire de parois sensiblement opposées (2, 3), ayant chacune des paires de saillies (7) formées sur une surface interne de celles-ci, un espace étant défini entre les paires de saillies ; une carte de circuit (16) qui est supportée par rapport au corps principal de logement entre les paires de saillies ; un agencement de montage (8) apte à recevoir et à retenir un composant électrique (13), l'agencement de montage étant installé sur une surface interne du corps principal de logement ; et un composant électrique ayant au moins une broche de contact conductrice (15) qui a un diamètre sensiblement constant sur au moins une partie de contact de celle-ci, le composant électrique étant monté par rapport au corps principal de logement par l'agencement de montage et étant connecté électriquement à la carte de circuit par la partie de contact de l'au moins une broche de contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/GB2007/002723 WO2009010703A1 (fr) | 2007-07-18 | 2007-07-18 | Unité électrique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/GB2007/002723 WO2009010703A1 (fr) | 2007-07-18 | 2007-07-18 | Unité électrique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009010703A1 true WO2009010703A1 (fr) | 2009-01-22 |
Family
ID=39156250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/GB2007/002723 Ceased WO2009010703A1 (fr) | 2007-07-18 | 2007-07-18 | Unité électrique |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2009010703A1 (fr) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936303A (ja) * | 1995-07-25 | 1997-02-07 | Matsushita Electric Works Ltd | 電子部品実装構造 |
| EP0909120A2 (fr) * | 1997-10-11 | 1999-04-14 | TEMIC TELEFUNKEN microelectronic GmbH | Boítier abritant des composants électroniques |
| US6552912B1 (en) * | 1999-08-02 | 2003-04-22 | Toshiba Carrier Corporation | Inverter apparatus for driving a compressor motor and a method for manufacturing the apparatus |
| US6717797B1 (en) * | 2002-11-22 | 2004-04-06 | Tyco Electronics Corporation | Apparatus, methods and articles of manufacture for a module box with integrated components |
-
2007
- 2007-07-18 WO PCT/GB2007/002723 patent/WO2009010703A1/fr not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936303A (ja) * | 1995-07-25 | 1997-02-07 | Matsushita Electric Works Ltd | 電子部品実装構造 |
| EP0909120A2 (fr) * | 1997-10-11 | 1999-04-14 | TEMIC TELEFUNKEN microelectronic GmbH | Boítier abritant des composants électroniques |
| US6552912B1 (en) * | 1999-08-02 | 2003-04-22 | Toshiba Carrier Corporation | Inverter apparatus for driving a compressor motor and a method for manufacturing the apparatus |
| US6717797B1 (en) * | 2002-11-22 | 2004-04-06 | Tyco Electronics Corporation | Apparatus, methods and articles of manufacture for a module box with integrated components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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