WO2009011024A1 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
WO2009011024A1
WO2009011024A1 PCT/JP2007/064024 JP2007064024W WO2009011024A1 WO 2009011024 A1 WO2009011024 A1 WO 2009011024A1 JP 2007064024 W JP2007064024 W JP 2007064024W WO 2009011024 A1 WO2009011024 A1 WO 2009011024A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wiring board
manufacturing
base
inflexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/064024
Other languages
English (en)
French (fr)
Inventor
Michimasa Takahashi
Masakazu Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to EP07790804A priority Critical patent/EP2180771A4/en
Priority to CN2007801005994A priority patent/CN101803480B/zh
Priority to JP2009523464A priority patent/JP5147843B2/ja
Priority to PCT/JP2007/064024 priority patent/WO2009011024A1/ja
Priority to TW097126085A priority patent/TWI373286B/zh
Publication of WO2009011024A1 publication Critical patent/WO2009011024A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　配線基板１９は、第１配線基板１７と第２配線基板１６とを可撓性部材１５で接続して形成する。第１配線基板１７は、第１基板１と、第１基板１より実装面積が小さい、非可撓性の第２基板２と、第１基板１と第２基板２との間に設けられているベース基板３と、を積層して構成され、外周の少なくとも一部の厚みが、中央部よりも薄く形成される。ヴィア４４は、第１基板１と第２基板２の少なくともいずれか一つに設けられている。配線基板１９には、ベース基板３を貫通するスルーホール６３が設けられている。第１基板１と第２基板２との間には層間溝部１１が設けられている。
PCT/JP2007/064024 2007-07-13 2007-07-13 配線基板及びその製造方法 Ceased WO2009011024A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP07790804A EP2180771A4 (en) 2007-07-13 2007-07-13 CONNECTION TABLE AND METHOD OF MANUFACTURE
CN2007801005994A CN101803480B (zh) 2007-07-13 2007-07-13 布线基板及其制造方法
JP2009523464A JP5147843B2 (ja) 2007-07-13 2007-07-13 配線基板
PCT/JP2007/064024 WO2009011024A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法
TW097126085A TWI373286B (en) 2007-07-13 2008-07-10 Wiring board and method of manufacturing wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064024 WO2009011024A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
WO2009011024A1 true WO2009011024A1 (ja) 2009-01-22

Family

ID=40259373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/064024 Ceased WO2009011024A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Country Status (5)

Country Link
EP (1) EP2180771A4 (ja)
JP (1) JP5147843B2 (ja)
CN (1) CN101803480B (ja)
TW (1) TWI373286B (ja)
WO (1) WO2009011024A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011106104B4 (de) * 2011-06-09 2014-04-10 Otto Bock Healthcare Products Gmbh Verfahren zum Herstellen bestückter Leiterplatten
JP7297431B2 (ja) * 2018-12-11 2023-06-26 株式会社小糸製作所 回路基板及び車両用灯具
CN110572927A (zh) * 2019-08-23 2019-12-13 鹤山市中富兴业电路有限公司 一种多层fpc四阶hdi软硬结合板制作方法及hdi板

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
JP2004349277A (ja) * 2003-04-28 2004-12-09 Nippon Carbide Ind Co Inc 多層配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法
JP2006216785A (ja) 2005-02-03 2006-08-17 Fujikura Ltd リジッドフレックスビルドアップ配線板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787225B2 (ja) * 1989-11-08 1995-09-20 富士通株式会社 半導体素子実装用基板
JP2004031682A (ja) * 2002-06-26 2004-01-29 Sony Corp プリント配線基板の製造方法
KR100467825B1 (ko) * 2002-12-12 2005-01-25 삼성전기주식회사 스택형 비아홀을 갖는 빌드업 인쇄회로기판 및 그 제조 방법
JP2005064357A (ja) * 2003-08-19 2005-03-10 Fujikura Ltd 多層配線板およびその製造方法
JP4584144B2 (ja) * 2003-01-22 2010-11-17 日本電気株式会社 回路基板装置及び配線基板間接続方法
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法
JP4777759B2 (ja) * 2005-12-01 2011-09-21 富士フイルム株式会社 配線基板及び配線基板接続装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
JP2004349277A (ja) * 2003-04-28 2004-12-09 Nippon Carbide Ind Co Inc 多層配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法
JP2006216785A (ja) 2005-02-03 2006-08-17 Fujikura Ltd リジッドフレックスビルドアップ配線板及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2180771A4 *

Also Published As

Publication number Publication date
EP2180771A4 (en) 2013-02-13
JP5147843B2 (ja) 2013-02-20
EP2180771A1 (en) 2010-04-28
TW200922398A (en) 2009-05-16
CN101803480B (zh) 2012-05-09
JPWO2009011024A1 (ja) 2010-09-09
CN101803480A (zh) 2010-08-11
TWI373286B (en) 2012-09-21

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