WO2009013255A3 - Verfahren zum uebertragen einer epitaxie-schicht von einer spender- auf eine systemscheibe der mikrosystemtechnik - Google Patents

Verfahren zum uebertragen einer epitaxie-schicht von einer spender- auf eine systemscheibe der mikrosystemtechnik Download PDF

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Publication number
WO2009013255A3
WO2009013255A3 PCT/EP2008/059492 EP2008059492W WO2009013255A3 WO 2009013255 A3 WO2009013255 A3 WO 2009013255A3 EP 2008059492 W EP2008059492 W EP 2008059492W WO 2009013255 A3 WO2009013255 A3 WO 2009013255A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
epitaxial layer
appertaining
transferring
donor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/059492
Other languages
English (en)
French (fr)
Other versions
WO2009013255A2 (de
Inventor
Roy Knechtel
Uwe Schwarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Fab Semiconductor Foundries GmbH
Original Assignee
X Fab Semiconductor Foundries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Fab Semiconductor Foundries GmbH filed Critical X Fab Semiconductor Foundries GmbH
Priority to US12/669,933 priority Critical patent/US20100330506A1/en
Publication of WO2009013255A2 publication Critical patent/WO2009013255A2/de
Publication of WO2009013255A3 publication Critical patent/WO2009013255A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

Zum Bonden einer Spenderscheibe (1) und einer Systemscheibe (9) wird ein Randwulst (3) einer Epitaxie-Schicht (2) auf der Spenderscheibe durch eine Ätzung abgeflacht oder vollständig entfernt, so dass ein zuverlässiger Kontakt nach dem Bonden bis hin zum Randbereich (5,6) möglich ist. Die Erzeugung der Ätzmaske erfolgt mit Hilfe einer Lackschicht (4) sowie durch Randentlackung, Freibelichten und Entwickeln ohne eine spezielle Fotomaske.
PCT/EP2008/059492 2007-07-21 2008-07-18 Verfahren zum uebertragen einer epitaxie-schicht von einer spender- auf eine systemscheibe der mikrosystemtechnik Ceased WO2009013255A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/669,933 US20100330506A1 (en) 2007-07-21 2008-07-18 Method for transferring an epitaxial layer from a donor wafer to a system wafer appertaining to microsystems technology

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007025649A DE102007025649B4 (de) 2007-07-21 2007-07-21 Verfahren zum Übertragen einer Epitaxie-Schicht von einer Spender- auf eine Systemscheibe der Mikrosystemtechnik
DE102007025649.5 2007-07-21

Publications (2)

Publication Number Publication Date
WO2009013255A2 WO2009013255A2 (de) 2009-01-29
WO2009013255A3 true WO2009013255A3 (de) 2009-05-07

Family

ID=40148769

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/059492 Ceased WO2009013255A2 (de) 2007-07-21 2008-07-18 Verfahren zum uebertragen einer epitaxie-schicht von einer spender- auf eine systemscheibe der mikrosystemtechnik

Country Status (3)

Country Link
US (1) US20100330506A1 (de)
DE (1) DE102007025649B4 (de)
WO (1) WO2009013255A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101277477B (zh) 2008-04-29 2012-04-04 华为技术有限公司 一种均衡流量的方法、装置及系统
US8729673B1 (en) 2011-09-21 2014-05-20 Sandia Corporation Structured wafer for device processing
US8871550B2 (en) * 2012-05-24 2014-10-28 Infineon Technologies Ag Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness
US8946052B2 (en) * 2012-09-26 2015-02-03 Sandia Corporation Processes for multi-layer devices utilizing layer transfer
WO2015013864A1 (zh) 2013-07-29 2015-02-05 晶元光电股份有限公司 选择性转移半导体元件的方法
CN106558503B (zh) * 2015-09-24 2019-03-29 中芯国际集成电路制造(上海)有限公司 晶圆键合方法
US10504716B2 (en) 2018-03-15 2019-12-10 Taiwan Semiconductor Manufacturing Company Ltd. Method for manufacturing semiconductor device and manufacturing method of the same
WO2025098595A1 (en) 2023-11-07 2025-05-15 Ams-Osram International Gmbh Growth substrate and method for processing an optoelectronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004050546A2 (de) * 2002-12-05 2004-06-17 X-Fab Semiconductor Foundries Ag Herstellen von mikroelektromechanischen systemen (mems) über ein silizium-hochtemperatur-fusionsbonden von scheiben
WO2005038903A1 (en) * 2003-10-14 2005-04-28 Tracit Technologies Method for preparing and assembling substrates
WO2005053018A1 (de) * 2003-11-28 2005-06-09 X-Fab Semiconductor Foundries Ag Herstellung von halbleitersubstraten mit vergrabenen schichten durch verbinden von halbleiterscheiben (bonden)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937312A (en) * 1995-03-23 1999-08-10 Sibond L.L.C. Single-etch stop process for the manufacture of silicon-on-insulator wafers
US6664169B1 (en) * 1999-06-08 2003-12-16 Canon Kabushiki Kaisha Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus
US6162702A (en) * 1999-06-17 2000-12-19 Intersil Corporation Self-supported ultra thin silicon wafer process
JP2001284622A (ja) * 2000-03-31 2001-10-12 Canon Inc 半導体部材の製造方法及び太陽電池の製造方法
DE10307527B4 (de) * 2003-02-21 2007-07-05 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Verbessern der Effizienz einer mechanischen Justieranlage
FR2852445B1 (fr) * 2003-03-14 2005-05-20 Soitec Silicon On Insulator Procede de realisation de substrats ou composants sur substrats avec transfert de couche utile, pour la microelectronique, l'optoelectronique ou l'optique
EP1467253A1 (de) * 2003-04-07 2004-10-13 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US6841848B2 (en) * 2003-06-06 2005-01-11 Analog Devices, Inc. Composite semiconductor wafer and a method for forming the composite semiconductor wafer
DE10333189A1 (de) * 2003-07-22 2005-02-10 Robert Bosch Gmbh Verfahren zur Herstellung eines Mikrosystems
US7129172B2 (en) * 2004-03-29 2006-10-31 Intel Corporation Bonded wafer processing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004050546A2 (de) * 2002-12-05 2004-06-17 X-Fab Semiconductor Foundries Ag Herstellen von mikroelektromechanischen systemen (mems) über ein silizium-hochtemperatur-fusionsbonden von scheiben
WO2005038903A1 (en) * 2003-10-14 2005-04-28 Tracit Technologies Method for preparing and assembling substrates
WO2005053018A1 (de) * 2003-11-28 2005-06-09 X-Fab Semiconductor Foundries Ag Herstellung von halbleitersubstraten mit vergrabenen schichten durch verbinden von halbleiterscheiben (bonden)

Also Published As

Publication number Publication date
US20100330506A1 (en) 2010-12-30
WO2009013255A2 (de) 2009-01-29
DE102007025649B4 (de) 2011-03-03
DE102007025649A1 (de) 2009-01-22

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