WO2009013903A1 - 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法 - Google Patents

移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法 Download PDF

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Publication number
WO2009013903A1
WO2009013903A1 PCT/JP2008/001974 JP2008001974W WO2009013903A1 WO 2009013903 A1 WO2009013903 A1 WO 2009013903A1 JP 2008001974 W JP2008001974 W JP 2008001974W WO 2009013903 A1 WO2009013903 A1 WO 2009013903A1
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WO
WIPO (PCT)
Prior art keywords
mobile object
object driving
stage
encoders
position measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001974
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English (en)
French (fr)
Inventor
Yuichi Shibazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2009524397A priority Critical patent/JP5177449B2/ja
Priority to KR1020097016413A priority patent/KR101409149B1/ko
Priority to EP08790263.1A priority patent/EP2184768B1/en
Priority to KR1020147001842A priority patent/KR101427071B1/ko
Publication of WO2009013903A1 publication Critical patent/WO2009013903A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　ＸエンコーダとＹエンコーダとを少なくとも各１つ含む３つのエンコーダを用いて、ステージ（ＷＳＴ）の移動面内の位置情報を計測する。ステージ（ＷＳＴ）の位置計測値に基づいて、位置計測に用いるエンコーダを、エンコーダ（Ｅｎｃ１，Ｅｎｃ２及びＥｎｃ３）から、エンコーダ（Ｅｎｃ４，Ｅｎｃ２及びＥｎｃ３）に切り換える。切り換えの際、座標つなぎ法又は位相つなぎ法を適用して、新たに使用するエンコーダ（Ｅｎｃ４）の初期値を設定する。それにより、ステージ（ＷＳＴ）の位置計測に用いるエンコーダが逐次切り換えられるにもかかわらず、切り換えの前後でステージの位置計測値が保存され、ステージを正確に２次元駆動することができる。
PCT/JP2008/001974 2007-07-24 2008-07-24 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法 Ceased WO2009013903A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009524397A JP5177449B2 (ja) 2007-07-24 2008-07-24 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法
KR1020097016413A KR101409149B1 (ko) 2007-07-24 2008-07-24 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
EP08790263.1A EP2184768B1 (en) 2007-07-24 2008-07-24 Mobile object driving method, mobile object driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method
KR1020147001842A KR101427071B1 (ko) 2007-07-24 2008-07-24 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007192657 2007-07-24
JP2007-192657 2007-07-24
JP2007341385 2007-12-28
JP2007-341385 2007-12-28

Publications (1)

Publication Number Publication Date
WO2009013903A1 true WO2009013903A1 (ja) 2009-01-29

Family

ID=40281163

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001974 Ceased WO2009013903A1 (ja) 2007-07-24 2008-07-24 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法

Country Status (6)

Country Link
US (2) US8264669B2 (ja)
EP (1) EP2184768B1 (ja)
JP (2) JP5177449B2 (ja)
KR (2) KR101409149B1 (ja)
TW (2) TWI526794B (ja)
WO (1) WO2009013903A1 (ja)

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JP2014131077A (ja) * 2009-08-25 2014-07-10 Nikon Corp 露光方法
JP2014150264A (ja) * 2009-08-25 2014-08-21 Nikon Corp 露光装置及び露光方法、並びにデバイス製造方法
WO2017057546A1 (ja) * 2015-09-30 2017-04-06 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法
WO2017057569A1 (ja) * 2015-09-30 2017-04-06 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法
WO2018062497A1 (ja) * 2016-09-30 2018-04-05 株式会社ニコン 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法
JP2019516133A (ja) * 2016-05-09 2019-06-13 エーエスエムエル ネザーランズ ビー．ブイ． 位置測定システム、較正方法、リソグラフィ装置及びデバイス製造方法

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JP5380477B2 (ja) * 2010-11-11 2014-01-08 京セラドキュメントソリューションズ株式会社 用紙サイズ検知機構及びそれを備えた画像形成装置
JPWO2012081234A1 (ja) 2010-12-14 2014-05-22 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
JP6118030B2 (ja) * 2011-04-05 2017-04-19 キヤノン株式会社 測定装置、露光装置及びデバイスの製造方法
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KR102080875B1 (ko) 2013-01-23 2020-04-16 삼성디스플레이 주식회사 스테이지 이송 장치 및 이를 이용한 스테이지 위치 측정 방법
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JP6727556B2 (ja) * 2015-09-30 2020-07-22 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法
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US20090040488A1 (en) 2009-02-12
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