WO2009014115A1 - Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur - Google Patents

Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur Download PDF

Info

Publication number
WO2009014115A1
WO2009014115A1 PCT/JP2008/063124 JP2008063124W WO2009014115A1 WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1 JP 2008063124 W JP2008063124 W JP 2008063124W WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive
support member
semiconductor device
stacking method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063124
Other languages
English (en)
Japanese (ja)
Inventor
Hideaki Ishizawa
Akinobu Hayakawa
Kohei Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to KR1020097026044A priority Critical patent/KR101155361B1/ko
Priority to CN2008800252999A priority patent/CN101755329B/zh
Priority to JP2008534802A priority patent/JP4339927B2/ja
Publication of WO2009014115A1 publication Critical patent/WO2009014115A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention porte sur un adhésif pour composant électronique qui permet de connecter, parallèlement les uns aux autres, un composant électronique à un autre composant électronique ou à un élément de support tout en fournissant une distance d'espace précise. L'invention porte également sur un procédé d'empilement de puces semi-conductrices utilisant l'adhésif pour composant électronique et sur un dispositif semi-conducteur. L'adhésif pour composant électronique est utilisé pour empiler, parallèlement les uns aux autres, un composant électronique et un autre composant électronique ou un élément de support tout en fournissant une distance d'espace égale ou inférieure à 30 µm. L'adhésif pour composant électronique contient un composé durcissable, un agent de cuisson et des particules d'espaceur. Sa viscosité est égale ou inférieure à 50 Pa s telle que mesurée avec un viscomètre de type E à 10 tpm et à une température à laquelle le composant électronique est lié à l'autre composant électronique ou à l'élément de support. La valeur CV des particules d'espaceur est égale ou inférieure à 10 %. Le diamètre de particule moyen est 40 à 70 % de la distance d'espace entre le composant électronique et l'autre composant électronique ou l'élément de support.
PCT/JP2008/063124 2007-07-25 2008-07-22 Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur Ceased WO2009014115A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097026044A KR101155361B1 (ko) 2007-07-25 2008-07-22 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치
CN2008800252999A CN101755329B (zh) 2007-07-25 2008-07-22 电子部件用胶粘剂、半导体芯片的层叠方法及半导体装置
JP2008534802A JP4339927B2 (ja) 2007-07-25 2008-07-22 半導体チップの積層方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-193758 2007-07-25
JP2007193758 2007-07-25
JP2008053249 2008-03-04
JP2008-053249 2008-03-04

Publications (1)

Publication Number Publication Date
WO2009014115A1 true WO2009014115A1 (fr) 2009-01-29

Family

ID=40281366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063124 Ceased WO2009014115A1 (fr) 2007-07-25 2008-07-22 Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur

Country Status (5)

Country Link
JP (1) JP4339927B2 (fr)
KR (1) KR101155361B1 (fr)
CN (1) CN101755329B (fr)
TW (1) TWI411049B (fr)
WO (1) WO2009014115A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2011233599A (ja) * 2010-04-23 2011-11-17 Toshiba Corp 半導体装置の製造方法
JP2012142438A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
WO2017170492A1 (fr) * 2016-03-30 2017-10-05 積水化学工業株式会社 Adhésif d'inducteur et inducteur

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676954B2 (ja) * 2010-07-27 2015-02-25 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
US9011629B2 (en) 2011-03-09 2015-04-21 Sekisui Chemical Co., Ltd. Adhesive for electronic components, and manufacturing method for semiconductor chip mount
US8937380B1 (en) * 2013-08-30 2015-01-20 Infineon Technologies Austria Ag Die edge protection for pressure sensor packages
KR101651649B1 (ko) * 2016-01-22 2016-08-29 주식회사 일렉켐스 전기 또는 전자 부품 접속용 도전성 접착 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2005244188A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用ペースト状接着剤及び半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2005244188A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用ペースト状接着剤及び半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2011233599A (ja) * 2010-04-23 2011-11-17 Toshiba Corp 半導体装置の製造方法
JP2012142438A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
WO2017170492A1 (fr) * 2016-03-30 2017-10-05 積水化学工業株式会社 Adhésif d'inducteur et inducteur
JP6232167B1 (ja) * 2016-03-30 2017-11-15 積水化学工業株式会社 インダクタ用接着剤及びインダクタ

Also Published As

Publication number Publication date
TWI411049B (zh) 2013-10-01
CN101755329B (zh) 2011-09-21
CN101755329A (zh) 2010-06-23
TW200908166A (en) 2009-02-16
JPWO2009014115A1 (ja) 2010-10-07
KR101155361B1 (ko) 2012-06-19
JP4339927B2 (ja) 2009-10-07
KR20100018562A (ko) 2010-02-17

Similar Documents

Publication Publication Date Title
WO2009014115A1 (fr) Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur
WO2008084843A1 (fr) Adhésif pour composants électroniques
WO2009011383A1 (fr) Adhésif pour composant électronique
MY184315A (en) Liquid sealing material, and electronic component using same
WO2009117345A3 (fr) Compositions adhésives pouvant être utilisées dans des applications de report de puces
WO2008129590A1 (fr) Film adhésif pour semi-conducteur et dispositif semi-conducteur fait avec celui-ci
AR068732A1 (es) Resina epoxica modificada con isocianato y composiciones de recubrimiento de polvo epoxico de la misma
PH12014501678A1 (en) Resin composition and semiconductor mounting substrate obtained by molding same
WO2017113269A8 (fr) Composition de revêtement antibuée comprenant des nanoparticules de silice fonctionnalisées et des monomères (méth)acrylates multifonctionnels
EP2770032A3 (fr) Film adhésif, ruban de découpage avec film adhésif, procédé de fabrication de dispositif semi-conducteur et dispositif semi-conducteur
WO2009051067A1 (fr) Composition adhésive, matériau de connexion de circuit utilisant la composition adhésive, procédé pour connecter un élément de circuit et corps de connexion de circuit
PH12014502374A1 (en) Composition for film adhesives, method for producing same, film adhesive, semiconductor package using film adhesive and method for manufacturing semiconductor package using film adhesive
WO2008146723A1 (fr) Composition de résine, film de résine espaceur, et dispositif à semi-conducteurs
PH12017501624B1 (en) Semiconductor device and image sensor module
WO2017137796A8 (fr) Composition de résine adhésive, procédé de liaison de partie à coller, et film de résine adhésive
WO2009022574A1 (fr) Adhésif et corps lié
WO2008143085A1 (fr) Composition de résine époxy pour une encapsulation de semi-conducteur et dispositif semi-conducteur obtenu par l'utilisation de celle-ci
WO2014009552A3 (fr) Améliorations dans des adhésifs conducteurs
MX2012015308A (es) Composiciones de recubrimiento en polvo.
EP4470775A3 (fr) Procédé d'adhérence utilisant une composition de résine durcissable contenant des microparticules de polymère ayant une excellente aptitude au façonnage, et stratifié obtenu à l'aide dudit procédé d'adhérence
WO2008117611A1 (fr) Composition de matière de collage, son procédé de fabrication, et matériau collé et son procédé de fabrication
DE602006017555D1 (de) Ständige haftklebstoffzusammensetzung damit
DE602006019988D1 (de) Acrylschmelzkleber
WO2016117579A9 (fr) Composition thermodurcissable, film durci, substrat avec film durci et composant électronique
WO2008140080A1 (fr) Source d'électrons

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880025299.9

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008534802

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08791405

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097026044

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08791405

Country of ref document: EP

Kind code of ref document: A1