WO2009016584A2 - Dispositif de sortie de lumière - Google Patents

Dispositif de sortie de lumière Download PDF

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Publication number
WO2009016584A2
WO2009016584A2 PCT/IB2008/053033 IB2008053033W WO2009016584A2 WO 2009016584 A2 WO2009016584 A2 WO 2009016584A2 IB 2008053033 W IB2008053033 W IB 2008053033W WO 2009016584 A2 WO2009016584 A2 WO 2009016584A2
Authority
WO
WIPO (PCT)
Prior art keywords
casing
leds
arrangement
light source
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2008/053033
Other languages
English (en)
Other versions
WO2009016584A3 (fr
Inventor
Maarten M. J. W. Van Herpen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of WO2009016584A2 publication Critical patent/WO2009016584A2/fr
Publication of WO2009016584A3 publication Critical patent/WO2009016584A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers

Definitions

  • This invention relates to light output devices, in particular using discrete light sources associated with a light transmissive substrate structure.
  • LED in glass One known example of this type of lighting device is a so-called "LED in glass” device.
  • An example is shown in Figure 1.
  • a glass plate is used, with a transparent conductive coating, for example ITO, forming electrodes.
  • the conductive coating is patterned in order to make the electrodes, that are connected to a semiconductor LED device.
  • the assembly is completed by laminating the glass, with the LEDs inside a thermoplastic layer (for example polyvinyl butyral, PVB).
  • the glass used may be safety glass.
  • Applications of this type of device are shelves, showcases, facades, office partitions, wall cladding, and decorative lighting.
  • the lighting device can be used for illumination of other objects, for display of an image, or simply for decorative purposes.
  • a first problem with type of device is how to reduce the power loss in the ITO conductor arrangement.
  • a second problem is how to dynamically control the color output of LEDs in glass. Individual red, green and blue LEDs can be provided but these can be seen individually by the viewer, so that the desired colour output is not perceived.
  • a light output device comprising an at least partly light transmissive substrate arrangement with a plurality of light source arrangements integrated into the structure of the substrate arrangement, wherein at least one of the light source arrangements comprises a casing comprising exactly 2, 3 or 4 discrete semiconductor LED chips.
  • the invention thus provides an embedded multi-chip package/casing in the transparent substrate arrangement.
  • the small number of LED chips per casing gives two possible advantages; one is that a colour output is made possible and the other is that it PH008750
  • the chips are preferably in close proximity, for example spaced by less than 0.1 mm so that they can be used to generate a colour output without the individual constituent colours being perceivable.
  • the connections between the individual chips can give improved efficiency by reducing the current flow for a given combined light output.
  • the total light output from the LEDs of the casing is preferably less than 10 lumen, so that the casing and especially the surrounding transparent substrate structure can withstand the total power usage (for example, for long-term performance PVB may not be heated above a certain temperature, for example 80 0 C).
  • the LEDs are connected in series, and this gives the desired reduction in current to achieve a given light output from the particular type of LED device.
  • the LEDs of the casing can be identical, for example white light sources. In another arrangement, the LEDs of the casing can comprise different colour
  • LEDs are then connected in parallel, to be independently controllable. This enables a colour output to be provided without the viewer being able to see the individual LEDs.
  • the substrate arrangement can comprise first and second transparent substrates and an electrode arrangement embedded in the substrate arrangement, with the plurality of light source arrangements connected to the electrode arrangement.
  • the plurality of light source arrangements can be embedded in a thermoplastic layer.
  • the light source arrangements comprise a casing comprising exactly 2, 3 or 4 discrete semiconductor LED chips. In another embodiment all of the light source arrangements comprise a casing comprising exactly 2, 3 or 4 discrete semiconductor LED chips.
  • Figure 1 shows a known LED in glass illumination device; and Figure 2 shows a single LED of the device of Figure 1 in more detail; PH008750
  • Figure 3 shows an equivalent circuit of an LED device connected to a conductor arrangement
  • the structure of an LED in glass illumination device is shown in Figure 2.
  • the lighting device comprises glass plates 1 and 2. Between the glass plates are (semi-) transparent electrodes 7a and 7b (for example formed using ITO), and a LED 4 connected to the transparent electrodes 7a and 7b.
  • a layer of thermoplastic material 5 is provided between glass plates 1 and 2 (for example PVB or UV resin).
  • the glass plates typically may have a thickness of 1. lmm - 2.1 mm.
  • the spacing between the electrodes connecting to the LED is typically 0.01 - 3 mm, for example around 0.15 mm.
  • the thermoplastic layer has a typical thickness of 0.3mm- 2mm, and the electrical resistance of the electrodes is in the range 2 - 80 Ohm, or 10-30 Ohms/square.
  • the LEDs are typically spaced by approximately 3cm or more.
  • the electrodes are preferably substantially transparent, so that they are imperceptible to a viewer in normal use of the device. If the conductor arrangement does not introduce a variation in light transmission (for example because it is not patterned, or because the pattern cannot be seen), a transparency of greater than or equal to 50% may be sufficient for the system to be transparent. More preferably, the transparency is greater than 70%, more preferably 90%, and even more preferably 99%. If the conductor arrangement is patterned (for example because thin wires are used), the transparency is preferably greater than 80%, more preferably 90%, but most preferably greater than 99%.
  • the electrodes can be made of a transparent material such as ITO or they can be made of an opaque material such as copper but be sufficiently thin so that they are not visible in normal use. Examples of suitable materials are disclosed in US 5 218 351.
  • the LED 4 comprises a multi-chip LED package or casing 4 connected by the transparent electrodes 7a and 7b.
  • the multi-chip LED casing contains 2, 3, or 4 LED chips.
  • the total lumen output is preferably less than 10 lumens.
  • LED packages/casings are known in the art.
  • a multi-chip package is also known as multi-dye package. Typically it comprises a ceramic or resin package/board, PH008750
  • the conductor arrangement of such a device has leads or electrodes which are connected to the ITO conductor arrangement arranged on one of the substrates.
  • the plurality of 2, 3 or 4 chips are thus mounted on a common circuit board with electrical connections to leads, which leads are subsequently connected to the transparent (e.g. ITO) conductor arrangement.
  • the complete device comprises a plurality of these common boards, embedded in the glass substrate structure.
  • An example of available multiple LED chip device is manufactured by OSTAR (Trade Mark), under the product name LE W E2A. This product has 4 LED chips connected in series. The LED casing typically operates at a voltage of around 15V.
  • These devices include a metal core board, and this would not be required for this application, where the casing is to be incorporated into a glass laminate structure.
  • the LED chips are connected in series inside the LED casing. This increases the total voltage over the casing.
  • the current flowing through the system is adapted in order to keep the lumen output of the LED casing the same as for the single LED chip.
  • the current (which is essentially proportional to the light output intensity of the LED) can be reduced by a factor n where n is the number of series connected LED chips.
  • a simple electrical model can be used to describe the LED connected to the transparent conductor arrangement, as shown in Figure 3.
  • the model comprises ITO resistances 30 and a LED 4, and the system is driven by a fixed current.
  • Figure 4 shows a calculation of system efficiency using two types of LEDs (39 and 100 lum/Watt) as a function of number of LED chips per casing, in series inside the casing. It can be seen that the efficiency improvement is very high for the first increase in number of LED chips. When using 1 chip with 100 lum/Watt output, the system efficiency is around 60-70% and when using 4 chips the system efficiency is greater than 96%. A further increase in number of LED chips (beyond 4) is no longer advantageous, because it would only barely increase the system efficiency, but at the same time it makes the system more expensive, and less transparent due to the increasing casing size.
  • the invention provides a system in which there are 2,3, or 4 LED chips mounted within a common casing or on a common board.
  • the power per casing is not possible to increase the power per casing to any desired value.
  • the maximum power is around 0.23 Watt, giving a light output of 8.7 lumen.
  • the total lumen output is preferably lower than 10 lumen.
  • An alternative use of a multi-chip casing of the invention is to provide LED chips with a different output color, such as RGB, or RGBA (red green blue alpha). Because the LED chips are arranged in a single casing, a viewer is unable to distinguish the individual LEDs by eye. Also, three or four different colors is sufficient to be able to generate all possible colors in the visible spectrum.
  • RGB red green blue alpha
  • RGB or RGBA LEDs For controlling the RGB or RGBA LEDs it is required to adapt the pattern of the conductor arrangement 7. For example, six ITO electrodes per LED can be used in order to individually control red, green and blue. Alternatively four ITO electrodes per LED may be used, by connecting each color to one dedicated ITO source electrode and one common ITO drain electrode for all colors.
  • multi-color LED chips are connected in series, they will generate white light only, but with an improvement of system efficiency as explained above compared to parallel connected LED chips.
  • the use of a multi-chip casing gives improved system efficiency. As the efficiency of the individual LED chips improves with development over time (i.e. improved light output per unit current), the multi-chip casing can provide further reduction in ITO losses. The number of LEDs in each chip will be selected to provide the required compromise between system efficiency (more LEDs give lower currents and reduced losses) and cost (more LEDs per casing give increased cost).
  • the LED casings are preferably spaced across the device, preferably with spacing more than lcm, and typically with spacing of around 3cm.
  • a small number of possible materials to form the transparent (or at least semi- transparent) electrodes have been outlined above.
  • Other include electrically conductive wires, strands made of a resin such as polyester or nylon wires the outer surface of which is coated with metal by vapour deposition, metal plating or the like.
  • Conductive films of vapour- deposited SiO2-indium alloy can also be used.
  • a conductive ink can also be used.

Landscapes

  • Led Device Packages (AREA)

Abstract

L'invention porte sur un dispositif de sortie de lumière qui comprend un agencement de substrat au moins partiellement transmissif de la lumière (1, 2) avec une pluralité d'agencements de source de lumière (4) intégrés dans la structure de l'agencement de substrat. Au moins l'un des agencements de source de lumière comprend un boîtier comprenant exactement 2, 3 ou 4 puces de DEL semi-conductrices discrètes. L'invention propose ainsi un boîtier à multiples puces incorporé dans un agencement de substrat transparent. Le petit nombre de DEL par boîtier donne deux avantages possibles : l'un est qu'une sortie de couleur est rendue possible et l'autre est qu'il permet d'obtenir une amélioration du rendement mais sans augmentation excessive du coût.
PCT/IB2008/053033 2007-08-02 2008-07-29 Dispositif de sortie de lumière Ceased WO2009016584A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07113660 2007-08-02
EP07113660.0 2007-08-02

Publications (2)

Publication Number Publication Date
WO2009016584A2 true WO2009016584A2 (fr) 2009-02-05
WO2009016584A3 WO2009016584A3 (fr) 2009-03-19

Family

ID=39971014

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/053033 Ceased WO2009016584A2 (fr) 2007-08-02 2008-07-29 Dispositif de sortie de lumière

Country Status (2)

Country Link
TW (1) TW200920986A (fr)
WO (1) WO2009016584A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017066675A1 (fr) * 2015-10-14 2017-04-20 Pacific Insight Electronics Corp. Panneau transmettant la lumière stratifié pour un véhicule doté de sources de lumière encastrées

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6550949B1 (en) * 1996-06-13 2003-04-22 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
BE1015302A3 (fr) * 2003-01-10 2005-01-11 Glaverbel Vitrage comportant des composants electroniques.
US7989827B2 (en) * 2005-05-19 2011-08-02 Advanced Optoelectronic Technology, Inc. Multichip light emitting diode package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017066675A1 (fr) * 2015-10-14 2017-04-20 Pacific Insight Electronics Corp. Panneau transmettant la lumière stratifié pour un véhicule doté de sources de lumière encastrées

Also Published As

Publication number Publication date
WO2009016584A3 (fr) 2009-03-19
TW200920986A (en) 2009-05-16

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