WO2009019186A1 - Thermisch leitfähige und elektrisch isolierende thermoplastische compounds - Google Patents
Thermisch leitfähige und elektrisch isolierende thermoplastische compounds Download PDFInfo
- Publication number
- WO2009019186A1 WO2009019186A1 PCT/EP2008/060018 EP2008060018W WO2009019186A1 WO 2009019186 A1 WO2009019186 A1 WO 2009019186A1 EP 2008060018 W EP2008060018 W EP 2008060018W WO 2009019186 A1 WO2009019186 A1 WO 2009019186A1
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- WIPO (PCT)
- Prior art keywords
- molding compositions
- graphite
- component
- polyamide
- thermoplastic molding
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
Definitions
- the present invention relates to thermoplastic molding compositions based on thermoplastics with an electrically insulating, thermally conductive filler and a further electrically and thermally conductive filler, their preparation and their uses.
- Thermoplastic polymers are used for numerous applications in the electrical industry because of their good electrical insulating properties. They also act due to their low thermal conductivity but also thermally insulating, which then represents a problem when used for electrical components when relatively much heat is generated, which must be dissipated.
- the electrical and thermal conductivity of thermoplastics can be modified by additives over a wide range. Thus, by adding e.g. Graphite increases both the electrical and the thermal conductivity.
- Graphite increases both the electrical and the thermal conductivity.
- thermoplastic compounds by the addition of aluminum oxide (0.-Al 2 O 3 ) is known and described in a number of applications.
- DE10260098 A1 states that polyesters are electrically insulating and thermally conductive by the addition of aluminum oxide.
- Other additives include low molecular weight and polymeric organic compounds.
- WO 2003051971 A2 describes a compound of polyamide 6 and also polyamide 66 and 72.3% aluminum oxide with a thermal conductivity of ⁇ 0.5 W / mK for use in electrical appliances, floors and heat exchangers.
- JP2004059638 A2 also describes molding compositions for injection molding based on polyamide 6 and polyamide 66 with aluminum oxide and the resulting molded parts with increased thermal conductivity.
- JP 03 079663 A2 expands the group of aluminum oxide-containing compounds by polyamide 46 and presents the combination of the filler with up to 30% glass fibers to improve the mechanical properties.
- JP 2005 ⁇ 12908 A2 teaches the use of aluminum oxide-gefilted polyamide as an electrical insulator with good thermal conductivity. The resulting products are described in particular for the use of cable sheathing which remains functional for more than 50 hours under 2000 volts.
- JP-A 06 108400 describes the production of electrically insulating and thermally conductive poryamide aluminum hydroxide compounds which are suitable for pressing plates.
- the manufactured parts are characterized by a special corona resistance.
- JP-A 03 091556 describes polyamide compositions containing 1.0-20% graphite and having a resistance of 5.0-7.0 ⁇ / cm.
- JP-A 62 227 952 discloses a graphite and glass fiber-containing material whose surface resistance is only 2.2 ⁇ 10 4 ⁇ .
- JP-A 60 108428 teaches the in situ production of a polyamide with the addition of graphite to the monomer, the resulting product after the polymerization shows an electrical resistance of 0.027 ⁇ / cm.
- JP-A 2003165904 deals with a graphite-containing, electrically conductive polyamide compound with particularly good impact strength, which is achieved by the addition of rubber.
- Fiberglass-reinforced, graphite-containing, electrically conductive molding compositions are presented in SU 1643568.
- Nanoscale graphite also achieves electrical conductivity as an additive in polyamide compounds, as described by CN 1900162 A.
- the resulting materials should be particularly suitable for the production of shielding against electrostatic fields.
- JP-A 57 193512 describes the production of electrically conductive polyamide fibers from a graphite-containing composition.
- JP 2007 016093 A2 describes a composition of thermoplastic polymers and 1-50% graphite with improved thermal conductivity of 1.6 W / mK.
- Aluminum oxide as a thermally highly conductive and inexpensive mineral is as described above for the production of thermally conductive thermoplastic compounds.
- Graphite is used as an additive for the production of electrically conductive molding compositions.
- Graphite is also used to increase the thermal conductivity of molding compounds, but so far not used because of the electrical conductivity for thermally conductive compounds with electrically insulating properties.
- thermoplastic molding compositions based on polyamide and / or polyester which have a high thermal conductivity, but at the same time are distinguished by electrically insulating properties.
- the invention therefore relates to thermoplastic molding compositions based on
- thermoplastic polymer preferably polyamide or polyester
- the molding composition according to the invention is, despite the addition of a further filler which is thermally and electrically conductive, preferably of graphite, an electrical insulator.
- a further filler which is thermally and electrically conductive, preferably of graphite, an electrical insulator.
- electrically conductive fillers are usually used as an additive to thermoplastic molding compositions to improve the electrical conductivity of the resulting molding compound.
- thermally conductive filler preferably alumina in the described concentration range
- this known effect of the thermally and electrically conductive filler preferably in the Use of graphite, but surprisingly not one. Instead, an electrically insulating molding compound is obtained.
- thermoplastic molding compositions comprising
- thermoplastic polymer preferably polyamide or polyester, more preferably polyamide
- thermoplastic molding compositions according to the invention comprise at least one thermoplastic polymer.
- the polymers according to the invention can be prepared by various processes, synthesized from different building blocks and, in particular applications, alone or in combination with processing aids, stabilizers, polymeric alloying partners (eg elastomers) or reinforcing materials (such as mineral fillers or glass fibers) to materials with specifically set property combinations are equipped. Also suitable are blends with proportions of other polymers, preferably of polyethylene, polypropylene, ABS, wherein optionally one or more compatibilizers can be used. The properties of the polyamides can be improved as needed by adding elastomers, for example with regard to the impact strength of the polymer compounds.
- polyamides For the preparation of polyamides, a variety of procedures have become known, depending on the desired end product different monomer units or different chain regulators for setting a desired molecular weight or monomers with reactive groups are used for later intended aftertreatments.
- the technically relevant processes for the preparation of polyamides are usually via the polycondensation in the melt.
- the hydrolytic polymerization of lactams is understood as a polycondensation.
- Preferred polyamides according to the invention are partially crystalline polyamides which can be prepared starting from diamines and dicarboxylic acids and / or lactams with at least 5 ring members or corresponding amino acids.
- Suitable starting materials are aliphatic and / or aromatic dicarboxylic acids, particularly preferably adipic acid, 2,2,4-trimethyladipic acid, 2,4,4-trimethyladipic acid, azelaic acid, sebacic acid, isophthalic acid, terephthalic acid, aliphatic and / or aromatic diamines, particularly preferably tetramethylenediamine, Hexamethylenediamine, 1,9-nonanediamine, 2,2,4- and 2,4,4-trimethyl-hexamethylenediamine, the isomers diamino-dicyclohexylmethane, Diaminodicyclohexylpropane, bis-aminotnethyl-cyclohexane, phenylenediamines,
- caprolactams most preferably ⁇ -caprolactam is used.
- most particularly particularly preferred compounds are PA6, PA66 and other compounds based on aliphatic or / and aromatic polyamides or copolyamides, in which 3 to 11 methylene groups are present on a polyamide group in the polymer chain.
- thermoplastic polymers to be used according to the invention in a further preferred embodiment as component A) are selected from the group of polyesters, preferably polyalkylene terephthalates, particularly preferably polybutylene terephthalates and polyethylene terephthalates, very particularly preferably polybutylene terephthalate.
- Preferred polyalkylene terephthalates can be prepared from terephthalic acid (or its reactive derivatives) and aliphatic or cycloaliphatic diols having 2 to 10 carbon atoms by known methods (Kunststoff-Handbuch, Vol. VIII, p. 695 ff, Karl Hanser Verlag, Kunststoff 1973).
- Preferred polyalkylene terephthalates contain at least 80 mol%, preferably 90 mol%, based on the dicarboxylic acid, terephthalic acid residues and at least 80 mol%, preferably at least 90 mol%, based on the diol component, ethylene glycol and / or 1,3-propanediol - and / or butanediol 1, 4-radicals.
- the preferred polyalkylene terephthalates may contain up to 20 mol% of radicals of other aromatic dicarboxylic acids having 8 to 14 carbon atoms or radicals of aliphatic dicarboxylic acids having 4 to 12 carbon atoms, such as radicals of phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid , 4,4'-diphenyldicarboxylic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, cyclohexanediacetic acid, cyclohexanedicarboxylic acid.
- radicals of other aromatic dicarboxylic acids having 8 to 14 carbon atoms or radicals of aliphatic dicarboxylic acids having 4 to 12 carbon atoms such as radicals of phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid , 4,4'-diphenyldicarboxylic acid, succinic
- the preferred polyalkylene terephthalates may contain up to 20 mol% of other aliphatic diols having 3 to 12 carbon atoms or cycloaliphatic diols having 6 to 21 carbon atoms.
- Contain atoms for example residues of 1,3-propanediol, 2-ethylpropanediol-1,3, neopentyl glycol, pentanediol-1,5, hexanediol-1,6, cyclohexane-dimethanoi-1,4, 3-methylpentanediol-2,4, 2-methyl pentanediol-2,4, 2,2 3 4-trimethyl!
- polyalkylene terephthalates which are prepared from terephthalic acid alone and their reactive derivatives (for example their dialkyl esters) and ethylene glycol and / or 1,3-propanediol and / or 1,4-butanediol, more preferably polyethylene tolphthalate and polybutylene terephthalate and mixtures thereof polyalkylene.
- Preferred polyalkylene terephthalates are also copolyesters which are prepared from at least two of the abovementioned acid components and / or from at least two of the abovementioned alcohol components; particularly preferred copolyesters are poly (ethylene glycol / butanediol, 1,4) terephthalates.
- the polyalkylene terephthalates generally have an intrinsic viscosity of about 0.3 cmVg to 1.5 cm 3 / g, preferably 0.4 cmVg to 1.3 cm 3 / g, particularly preferably 0.5 cmVg to 1.0 cm7g each measured in phenol / o-dichlorobenzene (1: 3 parts by weight) at 25 ° C.
- thermoplastic polyesters to be used according to the invention can also be used in admixture with other polyesters and / or further polymers.
- Component B) is used in a preferred embodiment of the present invention in the form of fine needles, platelets, spheres or irregularly shaped particles.
- Preferred Teuchenyingn of component B) are 0.1 to 100 microns, preferably 1-8 microns.
- the thermal conductivity of this component B) is 10 to 400 W / mK, preferably 30 to 250 W / mK.
- As component B) is particularly preferably used alumina.
- Component C) is preferably used in the form of powders, flakes, granules, pastes, compactates, extrudates or agglomerates.
- the particle size of component C) is preferably from 5 to 100 .mu.m, particularly preferably from 10 to 30 .mu.m.
- graphite is particularly preferably used.
- the molding compositions according to the invention in addition to the components A), B) and C)
- component D) is preferably stabilizers, particularly preferably UV stabilizers, heat stabilizers, gamma ray stabilizers, hydrolysis stabilizers, and also antistatic agents, emulsifiers, nucleating agents, plasticizers,
- Processing aids impact modifiers, dyes or pigments.
- suitable additives are described, for example, in the Plastics Additives Handbook, 5th Edition, Hanser Verlag, Kunststoff, 2001, pages 80-84, 546-547, 688, 872-874, 938, 966.
- the additives can be used alone or be used in mixture or in the form of masterbatches.
- Stabilizers which are preferred according to the invention are sterically hindered phenols and / or phosphites, hydroquinones, aromatic secondary amines such as diphenylamines, substituted resorcinols, salicylates, benzotriazoles and benzophenones, as well as variously substituted representatives of these groups and / or mixtures thereof.
- UV stabilizers various substituted resorcinols, salicylates, benzotriazoles or benzophenones are preferably used.
- Elastomermodif ⁇ katoren are generally copolymers which are preferably composed of at least two of the following monomers: ethylene, propylene, butadiene, isobutene, isoprene, chloroprene, vinyl acetate, styrene, acrylonitrile and acrylic or methacrylic acid esters with 1 to 18 C atoms in the alcohol component.
- the copolymers may contain compatibilizing groups, e.g. Maleic anhydride or epoxide.
- Preferred dyes or pigments may be inorganic pigments, more preferably titanium dioxide, ultramarine blue, iron oxide, zinc sulfide or carbon black, as well as organic pigments, more preferably phthalocyanines, quinacridones, perylenes and dyes such as nigrosine and anthraquinones as colorants and other colorants.
- the nucleating agent used is preferably sodium or calcium phenylphosphinate, aluminum oxide or silicon dioxide or talc, particularly preferably talc.
- the molding compositions according to the invention can be used in addition to components A), B), C) and D) or instead of component D)
- Lubricant and / or mold release agent are long-chain fatty acids (eg stearic acid), their salts (eg Ca or Zn stearate) and their ester derivatives or amide derivatives (eg ethylene-bis-stearylamide), montan waxes (eg esters of montan acids with ethylene glycol) and low molecular weight Polyethylene or polypropylene waxes. According to the invention particularly preferred sliding and / or
- Mold release agents are contained in the group of esters or amides of saturated or unsaturated aliphatic carboxylic acids having 8 to 40 carbon atoms with aliphatic saturated alcohols or amines having 2 to 40 carbon atoms.
- the molding compositions according to the invention may in addition to the components A), B), C), D) and E) or instead of D) or instead of E) or instead of D) and E)
- F 1-60% by weight, preferably 5-40% by weight, particularly preferably 10-30% by weight of fillers or reinforcing materials, preferably glass fibers.
- the invention further relates to a process for the preparation of electrically insulating graphite-containing molding compositions with simultaneously high thermal conductivity, characterized in that these
- thermoplastic polymer preferably polyamide or polyester
- the invention further relates to the use of graphite in combination with a compound of the elements of the 3rd main group with elements of the 5th or 6th main group of the Periodic Table for the preparation of thermally conductive and at the same time electrically insulating thermoplastic molding compositions, preferably based on polyamide or polyester, especially preferably polyamide.
- electrically insulating thermoplastic molding compositions preferably based on polyamide or polyester, especially preferably polyamide.
- the present invention also relates to the use of graphite for increasing the thermal thermal conductivity while maintaining the electrically insulating properties of thermoplastic molding compositions containing compounds of the elements of the 3rd main groups with elements of the 5th or 6th main group of the periodic table, preferably with a reduced proportion this component in the thermoplastic molding compositions.
- the molding compositions according to the invention are prepared by known processes by mixing the components in the polymer melt. The mixing of the components takes place in the corresponding proportions by weight. Preferably, the mixing (compounding) of the components at temperatures of 220 to 360 0 C by mixing together, mixing, kneading, extruding or rolling of the components, more preferably by compounding on a counter-rotating twin-screw extruder or Buss kneader. It may be advantageous to premix individual components. It may also be advantageous, moldings or semi-finished products made of a room temperature (preferably 0 to 40 0 C) physical mixture (dry blend) to prepare pre-mixed components and / or individual components directly. The molding compositions thus prepared can be processed by extrusion or injection molding.
- moldings to be produced according to the invention from the molding compositions can be used, for example, in the automotive, electrical, electronic, telecommunications, information technology, computer industry, household, sports, medical or entertainment industries become.
- molding compositions of the invention can be used for applications for which a high thermal conductivity is required. Examples of such applications are the use for components in electronics or display technology ⁇ light-emitting diodes).
- plastic molding compounds were first prepared by compounding.
- the individual components were mixed in a twin-screw extruder of the type ZSK 32 Compounder from Coperion Werner & Pfleiderer (Stuttgart, Germany) at temperatures between 260 and 290 ° C, discharged as a strand in a water bath, cooled to Granuliernote and granulated.
- After drying (generally two days at 7O 0 C in a vacuum oven) was carried out the processing of the granulate on an injection molding machine type Arburg SG370-173732 at temperatures from 270 to 300 0 C to give test specimens of 60x40x4 mm J and 60x60x2 mm 3 ,
- thermal conductivities and thermal diffusivities were measured on test specimens measuring 60 ⁇ 60 ⁇ 2 mm 3 by the Nanoflash method perpendicular to the flow direction of the melt on the basis of ASTM E 1461 using a Laser Nanofiash LFA 447 instrument from Netzsch Albau GmbH.
- compositions are processed as described above.
- Thermoplastic eg polyamide 6, linear, with a relative solution viscosity of a 1% solution in m-cresol of 2.4 Alumina, for example Martoxid MPS2 Martin GmbH graphite, eg EG31 SGL Carbon GmbH wax, for example Licowax ® E Flakes Clariant GmbH glass fibers, for example CS7928 Lanxess Germany GmbH.
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- Health & Medical Sciences (AREA)
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- Polymers & Plastics (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/671,106 US20100219381A1 (en) | 2007-08-08 | 2008-07-30 | Thermally conductive and electrically insulating thermoplastic compounds |
| EP08775377A EP2176328A1 (de) | 2007-08-08 | 2008-07-30 | Thermisch leitfähige und elektrisch isolierende thermoplastische compounds |
| JP2010519436A JP5357155B2 (ja) | 2007-08-08 | 2008-07-30 | 熱伝導性および電気絶縁性熱可塑性化合物 |
| CN2008801024190A CN101796115B (zh) | 2007-08-08 | 2008-07-30 | 导热并且电绝缘的热塑性混合材料 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007037316.5 | 2007-08-08 | ||
| DE102007037316A DE102007037316A1 (de) | 2007-08-08 | 2007-08-08 | Thermisch leitfähige und elektrisch isolierende thermoplastische Compounds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009019186A1 true WO2009019186A1 (de) | 2009-02-12 |
Family
ID=39816642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2008/060018 Ceased WO2009019186A1 (de) | 2007-08-08 | 2008-07-30 | Thermisch leitfähige und elektrisch isolierende thermoplastische compounds |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100219381A1 (de) |
| EP (1) | EP2176328A1 (de) |
| JP (1) | JP5357155B2 (de) |
| CN (1) | CN101796115B (de) |
| DE (1) | DE102007037316A1 (de) |
| WO (1) | WO2009019186A1 (de) |
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|---|---|---|---|---|
| CN102115592A (zh) * | 2009-12-31 | 2011-07-06 | 第一毛织株式会社 | 具有优异白度、导热性和挤出可成型性的聚酰胺基树脂组合物及制备方法以及制品 |
| WO2012000935A1 (en) * | 2010-06-28 | 2012-01-05 | Dsm Ip Assets B.V. | Thermally conductive polymer composition |
| FR2973387A1 (fr) * | 2011-04-04 | 2012-10-05 | Rhodia Operations | Composition polyamide de forte conductivite thermique |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| EP2862894A1 (de) | 2013-10-15 | 2015-04-22 | LANXESS Deutschland GmbH | Thermoplastische Formmassen |
| EP3006772A4 (de) * | 2013-05-30 | 2017-01-18 | Oiles Corporation | Dämpfungsmaterial, schwingungsdämpfendes teil mit dem dämpfungsmaterial und bebenisolator mit integriertem schwingungsdämpfendem element |
| EP3670589A1 (de) | 2018-12-20 | 2020-06-24 | LANXESS Deutschland GmbH | Polyamidzusammensetzungen |
| WO2020126984A1 (de) | 2018-12-20 | 2020-06-25 | Lanxess Deutschland Gmbh | Polyesterzusammensetzungen |
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| EP2001951B1 (de) * | 2006-03-29 | 2010-01-27 | Basf Se | Wärmeleitfähige polyamide |
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| DE102011017328A1 (de) | 2011-04-17 | 2012-10-18 | Heraeus Noblelight Gmbh | Bestrahlungsvorrichtung für Faserverbundmaterial |
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| JP2015018829A (ja) * | 2011-11-11 | 2015-01-29 | パナソニック株式会社 | 高分子構造材 |
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| EP2942367B1 (de) * | 2014-05-05 | 2018-07-11 | LANXESS Deutschland GmbH | Polyester Zusammensetzungen |
| WO2016002682A1 (ja) | 2014-06-30 | 2016-01-07 | 宇部興産株式会社 | ポリアミド樹脂組成物及びそれからなる成形品 |
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| JP2017190407A (ja) * | 2016-04-14 | 2017-10-19 | ユニチカ株式会社 | ポリアミド樹脂組成物およびそれからなる成形体 |
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| CN111328337B (zh) * | 2017-11-15 | 2022-01-25 | 阿莫绿色技术有限公司 | 石墨-高分子复合材料制造用组合物及通过其体现的石墨-高分子复合材料 |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102115592A (zh) * | 2009-12-31 | 2011-07-06 | 第一毛织株式会社 | 具有优异白度、导热性和挤出可成型性的聚酰胺基树脂组合物及制备方法以及制品 |
| WO2012000935A1 (en) * | 2010-06-28 | 2012-01-05 | Dsm Ip Assets B.V. | Thermally conductive polymer composition |
| CN102958986B (zh) * | 2010-06-28 | 2016-05-04 | 帝斯曼知识产权资产管理有限公司 | 导热性聚合物组合物 |
| CN102958986A (zh) * | 2010-06-28 | 2013-03-06 | 帝斯曼知识产权资产管理有限公司 | 导热性聚合物组合物 |
| JP2013532219A (ja) * | 2010-06-28 | 2013-08-15 | ディーエスエム アイピー アセッツ ビー.ブイ. | 熱伝導性ポリマー組成物 |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| WO2012136590A1 (fr) * | 2011-04-04 | 2012-10-11 | Rhodia Operations | Composition polyamide de forte conductivite thermique |
| FR2973387A1 (fr) * | 2011-04-04 | 2012-10-05 | Rhodia Operations | Composition polyamide de forte conductivite thermique |
| US9570665B2 (en) | 2011-04-04 | 2017-02-14 | Rhodia Operations | Polyamide composition having high thermal conductivity |
| EP3006772A4 (de) * | 2013-05-30 | 2017-01-18 | Oiles Corporation | Dämpfungsmaterial, schwingungsdämpfendes teil mit dem dämpfungsmaterial und bebenisolator mit integriertem schwingungsdämpfendem element |
| EP2862894A1 (de) | 2013-10-15 | 2015-04-22 | LANXESS Deutschland GmbH | Thermoplastische Formmassen |
| EP2862895A1 (de) | 2013-10-15 | 2015-04-22 | LANXESS Deutschland GmbH | Thermoplastische Formmassen |
| EP3670589A1 (de) | 2018-12-20 | 2020-06-24 | LANXESS Deutschland GmbH | Polyamidzusammensetzungen |
| WO2020126984A1 (de) | 2018-12-20 | 2020-06-25 | Lanxess Deutschland Gmbh | Polyesterzusammensetzungen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101796115A (zh) | 2010-08-04 |
| JP2010535876A (ja) | 2010-11-25 |
| DE102007037316A1 (de) | 2009-02-12 |
| JP5357155B2 (ja) | 2013-12-04 |
| US20100219381A1 (en) | 2010-09-02 |
| EP2176328A1 (de) | 2010-04-21 |
| CN101796115B (zh) | 2012-09-19 |
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