WO2009022441A1 - ツインチップ搭載型ダイオード - Google Patents

ツインチップ搭載型ダイオード Download PDF

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Publication number
WO2009022441A1
WO2009022441A1 PCT/JP2008/000094 JP2008000094W WO2009022441A1 WO 2009022441 A1 WO2009022441 A1 WO 2009022441A1 JP 2008000094 W JP2008000094 W JP 2008000094W WO 2009022441 A1 WO2009022441 A1 WO 2009022441A1
Authority
WO
WIPO (PCT)
Prior art keywords
diode
chip
electrically connected
mounted diode
twin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000094
Other languages
English (en)
French (fr)
Inventor
Jun Ishida
Kenji Hamano
Masayuki Kusumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onamba Co Ltd
Original Assignee
Onamba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onamba Co Ltd filed Critical Onamba Co Ltd
Priority to US12/513,490 priority Critical patent/US8237065B2/en
Priority to CN2008800009460A priority patent/CN101548380B/zh
Priority to EP08710298.4A priority patent/EP2077579A4/en
Publication of WO2009022441A1 publication Critical patent/WO2009022441A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

　戸外に設置される太陽電池パネル用端子箱内のような温度変化の激しい環境下で使用しても機能を損なわないダイオードを提供する。共通の端子板に接合されるためのリード足をチップごとに有するツインチップ搭載型ダイオードにおいて、各チップから出て各リード足の接合される部分までの間で互いに電気的に接続される構成を有することを特徴とするダイオード。電気的に接続される構成は各リード足との一体成型によって形成されることが好ましい。
PCT/JP2008/000094 2007-08-13 2008-01-25 ツインチップ搭載型ダイオード Ceased WO2009022441A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/513,490 US8237065B2 (en) 2007-08-13 2008-01-25 Twin-chip-mounting type diode
CN2008800009460A CN101548380B (zh) 2007-08-13 2008-01-25 双芯片搭载型二极管
EP08710298.4A EP2077579A4 (en) 2007-08-13 2008-01-25 CHIP MOUNTED DOUBLE DIODE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007210589A JP4167715B1 (ja) 2007-08-13 2007-08-13 ツインチップ搭載型ダイオード
JP2007-210589 2007-08-13

Publications (1)

Publication Number Publication Date
WO2009022441A1 true WO2009022441A1 (ja) 2009-02-19

Family

ID=39985850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000094 Ceased WO2009022441A1 (ja) 2007-08-13 2008-01-25 ツインチップ搭載型ダイオード

Country Status (5)

Country Link
US (1) US8237065B2 (ja)
EP (1) EP2077579A4 (ja)
JP (1) JP4167715B1 (ja)
CN (1) CN101548380B (ja)
WO (1) WO2009022441A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013143519A (ja) 2012-01-12 2013-07-22 Fuji Electric Co Ltd 接続子および樹脂封止型半導体装置
WO2017056144A1 (ja) * 2015-09-28 2017-04-06 三菱電機株式会社 半導体装置
CN205336219U (zh) * 2015-12-08 2016-06-22 泰科电子(上海)有限公司 光伏接线盒和二极管
CN105871328A (zh) * 2016-06-03 2016-08-17 浙江人和光伏科技有限公司 一种太阳能电池用接线盒
CN105790704A (zh) * 2016-06-03 2016-07-20 浙江人和光伏科技有限公司 太阳能电池用接线盒
US11107761B2 (en) * 2018-02-06 2021-08-31 Denso Corporation Semiconductor device
JP2019186403A (ja) 2018-04-11 2019-10-24 トヨタ自動車株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251962A (ja) 2004-03-04 2005-09-15 Oonanba Kk 太陽電池パネル用端子ボックス
WO2005112133A1 (ja) * 2004-05-19 2005-11-24 Angel Co., Ltd. 太陽電池用リード端子付ダイオード
JP2006165227A (ja) * 2004-11-15 2006-06-22 Oonanba Kk 太陽電池パネル用端子ボックス

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH021862Y2 (ja) * 1985-12-06 1990-01-17
JPH0176059U (ja) * 1987-11-10 1989-05-23
JP3120575B2 (ja) * 1992-06-29 2000-12-25 富士電機株式会社 半導体装置
KR20000026245A (ko) * 1998-10-19 2000-05-15 윤종용 도선테
JP2001135847A (ja) * 1999-11-05 2001-05-18 Kanegafuchi Chem Ind Co Ltd 半導体装置及びこれを備えた端子ボックス
JP3871587B2 (ja) * 2002-03-18 2007-01-24 日本インター株式会社 樹脂封止型半導体装置
JP3744458B2 (ja) * 2002-04-10 2006-02-08 住友電装株式会社 太陽電池モジュール用端子ボックス装置
JP2004207618A (ja) * 2002-12-26 2004-07-22 Shindengen Electric Mfg Co Ltd 半導体装置
JP4515817B2 (ja) * 2004-05-18 2010-08-04 株式会社三社電機製作所 太陽電池モジュール接続具
JP3965418B2 (ja) * 2004-05-25 2007-08-29 木谷電器株式会社 太陽電池モジュール用端子ボックス
WO2006057342A1 (ja) * 2004-11-25 2006-06-01 Sansha Electric Manufacturing Company, Limited 太陽電池モジュール用接続具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251962A (ja) 2004-03-04 2005-09-15 Oonanba Kk 太陽電池パネル用端子ボックス
WO2005112133A1 (ja) * 2004-05-19 2005-11-24 Angel Co., Ltd. 太陽電池用リード端子付ダイオード
JP2006165227A (ja) * 2004-11-15 2006-06-22 Oonanba Kk 太陽電池パネル用端子ボックス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2077579A4

Also Published As

Publication number Publication date
US20100084183A1 (en) 2010-04-08
JP4167715B1 (ja) 2008-10-22
JP2009044107A (ja) 2009-02-26
EP2077579A4 (en) 2014-10-08
CN101548380B (zh) 2012-12-12
CN101548380A (zh) 2009-09-30
EP2077579A1 (en) 2009-07-08
US8237065B2 (en) 2012-08-07

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