WO2009037995A1 - 高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法 - Google Patents

高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法 Download PDF

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Publication number
WO2009037995A1
WO2009037995A1 PCT/JP2008/066262 JP2008066262W WO2009037995A1 WO 2009037995 A1 WO2009037995 A1 WO 2009037995A1 JP 2008066262 W JP2008066262 W JP 2008066262W WO 2009037995 A1 WO2009037995 A1 WO 2009037995A1
Authority
WO
WIPO (PCT)
Prior art keywords
power amplifier
output power
high output
mounting method
receiving device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066262
Other languages
English (en)
French (fr)
Inventor
Tooru Ishino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to US12/672,624 priority Critical patent/US20110294440A1/en
Priority to CN200880108187A priority patent/CN101803184A/zh
Priority to JP2009533112A priority patent/JPWO2009037995A1/ja
Priority to EP08832206A priority patent/EP2180595A4/en
Publication of WO2009037995A1 publication Critical patent/WO2009037995A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Amplifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　放熱効果が高く、低コストの高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法を提供する。放熱用部材上に設けられたモールドの両側面から外部に延出したリード線を有するトランジスタと、開口部に前記放熱用部材が挿入されると共に、一方の面の配線パターンが前記リード線と電気的に接続される両面配線基板と、前記両面配線基板を収容するケースとを有する高出力増幅器であって、一方の主面が前記ケースの内壁に接触し、他方の主面が前記放熱用部材及び前記両面配線基板の他方の主面の配線パターンに接続されるプレートを備える。
PCT/JP2008/066262 2007-09-21 2008-09-09 高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法 Ceased WO2009037995A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/672,624 US20110294440A1 (en) 2007-09-21 2008-09-09 High power amplifier, wireless transmitter, wireless transceiver, and method for mounting high power amplifier
CN200880108187A CN101803184A (zh) 2007-09-21 2008-09-09 大功率放大器，无线发射器，无线收发器以及用于安装大功率放大器的方法
JP2009533112A JPWO2009037995A1 (ja) 2007-09-21 2008-09-09 高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法
EP08832206A EP2180595A4 (en) 2007-09-21 2008-09-09 HIGH-EFFECT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTER AND RECEIVER AND MOUNTING METHOD FOR HIGH-POWER POWER AMPLIFIER

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245593 2007-09-21
JP2007245593 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037995A1 true WO2009037995A1 (ja) 2009-03-26

Family

ID=40467814

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066262 Ceased WO2009037995A1 (ja) 2007-09-21 2008-09-09 高出力増幅器、無線送信機、無線送受信機、及び高出力増幅器の実装方法

Country Status (5)

Country Link
US (1) US20110294440A1 (ja)
EP (1) EP2180595A4 (ja)
JP (1) JPWO2009037995A1 (ja)
CN (1) CN101803184A (ja)
WO (1) WO2009037995A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102638958A (zh) * 2012-04-01 2012-08-15 北京市万格数码通讯科技有限公司 兼顾散热和接地的射频功率放大器安装装置及安装方法
KR101507668B1 (ko) 2011-11-09 2015-03-31 동광 킹선 옵토일렉트로닉 컴퍼니 리미티드 고전력 led 방열판 구조의 제조 방법
WO2015098499A1 (ja) * 2013-12-26 2015-07-02 株式会社 豊田自動織機 電子機器
KR20180021383A (ko) * 2015-06-30 2018-03-02 트럼프 헛팅거 게엠베하 + 코 카게 비선형 고주파수 증폭기 장치
KR20180021884A (ko) * 2015-06-30 2018-03-05 트럼프 헛팅거 게엠베하 + 코 카게 고주파 증폭기 장치
JP2018519758A (ja) * 2015-06-30 2018-07-19 トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＴＲＵＭＰＦ Ｈｕｅｔｔｉｎｇｅｒ ＧｍｂＨ ＋ Ｃｏ． ＫＧ 高周波増幅器装置
US10679920B2 (en) 2018-01-22 2020-06-09 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device having semiconductor package in a wiring board opening

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5740107B2 (ja) * 2010-07-08 2015-06-24 株式会社東芝 信号伝送回路及び多層基板
KR101971998B1 (ko) * 2011-06-02 2019-04-24 삼성전자주식회사 무선 전력 전송 장치 및 방법
CN102625625B (zh) * 2012-04-01 2015-03-11 北京市万格数码通讯科技有限公司 一种新型大功率射频功率放大器固定装置及安装方法
US9763317B2 (en) * 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
JP7693801B2 (ja) * 2020-10-21 2025-06-17 ケーエムダブリュ・インコーポレーテッド 電力増幅装置の製造方法

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JPH043498A (ja) 1990-04-20 1992-01-08 Oki Electric Ind Co Ltd 直実装電力増幅器
JPH0728153B2 (ja) 1991-03-29 1995-03-29 松下電器産業株式会社 電力モジュール用金属ケース
JPH08125464A (ja) * 1994-10-26 1996-05-17 Mitsubishi Electric Corp マイクロ波集積回路
JPH09358A (ja) * 1995-06-19 1997-01-07 Sony Corp シャーシへの側板取付け装置並びに取付け用クリップ
JPH10335778A (ja) * 1997-06-04 1998-12-18 Matsushita Electric Ind Co Ltd 高電力用電子部品
JP2970530B2 (ja) 1996-05-13 1999-11-02 日本電気株式会社 高出力電力増幅器
JP2001250881A (ja) 2000-03-07 2001-09-14 Oki Business Co Ltd 電力増幅器の実装基板

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Publication number Priority date Publication date Assignee Title
JPH043498A (ja) 1990-04-20 1992-01-08 Oki Electric Ind Co Ltd 直実装電力増幅器
JPH0728153B2 (ja) 1991-03-29 1995-03-29 松下電器産業株式会社 電力モジュール用金属ケース
JPH08125464A (ja) * 1994-10-26 1996-05-17 Mitsubishi Electric Corp マイクロ波集積回路
JPH09358A (ja) * 1995-06-19 1997-01-07 Sony Corp シャーシへの側板取付け装置並びに取付け用クリップ
JP2970530B2 (ja) 1996-05-13 1999-11-02 日本電気株式会社 高出力電力増幅器
JPH10335778A (ja) * 1997-06-04 1998-12-18 Matsushita Electric Ind Co Ltd 高電力用電子部品
JP2001250881A (ja) 2000-03-07 2001-09-14 Oki Business Co Ltd 電力増幅器の実装基板

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* Cited by examiner, † Cited by third party
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See also references of EP2180595A4 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101507668B1 (ko) 2011-11-09 2015-03-31 동광 킹선 옵토일렉트로닉 컴퍼니 리미티드 고전력 led 방열판 구조의 제조 방법
CN102638958A (zh) * 2012-04-01 2012-08-15 北京市万格数码通讯科技有限公司 兼顾散热和接地的射频功率放大器安装装置及安装方法
WO2015098499A1 (ja) * 2013-12-26 2015-07-02 株式会社 豊田自動織機 電子機器
JP2015126105A (ja) * 2013-12-26 2015-07-06 株式会社豊田自動織機 電子機器
JP2018519758A (ja) * 2015-06-30 2018-07-19 トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＴＲＵＭＰＦ Ｈｕｅｔｔｉｎｇｅｒ ＧｍｂＨ ＋ Ｃｏ． ＫＧ 高周波増幅器装置
KR20180021884A (ko) * 2015-06-30 2018-03-05 트럼프 헛팅거 게엠베하 + 코 카게 고주파 증폭기 장치
KR20180021383A (ko) * 2015-06-30 2018-03-02 트럼프 헛팅거 게엠베하 + 코 카게 비선형 고주파수 증폭기 장치
JP2018519754A (ja) * 2015-06-30 2018-07-19 トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＴＲＵＭＰＦ Ｈｕｅｔｔｉｎｇｅｒ ＧｍｂＨ ＋ Ｃｏ． ＫＧ 非線形高周波増幅器装置
JP2018519756A (ja) * 2015-06-30 2018-07-19 トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＴＲＵＭＰＦ Ｈｕｅｔｔｉｎｇｅｒ ＧｍｂＨ ＋ Ｃｏ． ＫＧ 高周波増幅器装置
US10714313B2 (en) 2015-06-30 2020-07-14 Trumpf Huettinger Gmbh + Co. Kg High frequency amplifier apparatuses
KR102449513B1 (ko) * 2015-06-30 2022-09-29 트럼프 헛팅거 게엠베하 + 코 카게 비선형 고주파수 증폭기 장치
KR102478332B1 (ko) * 2015-06-30 2022-12-15 트럼프 헛팅거 게엠베하 + 코 카게 고주파 증폭기 장치
US10679920B2 (en) 2018-01-22 2020-06-09 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device having semiconductor package in a wiring board opening

Also Published As

Publication number Publication date
US20110294440A1 (en) 2011-12-01
EP2180595A1 (en) 2010-04-28
CN101803184A (zh) 2010-08-11
JPWO2009037995A1 (ja) 2011-01-06
EP2180595A4 (en) 2010-09-08

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