WO2009043649A3 - Dreidimensionaler elektronischer schaltungsträgeraufbau, sowie schaltungsgrundträger aufweisend den schaltungsträgeraufbau als funktionsbauteil und dreidimensionale schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen schaltungsträgeraufbauten - Google Patents

Dreidimensionaler elektronischer schaltungsträgeraufbau, sowie schaltungsgrundträger aufweisend den schaltungsträgeraufbau als funktionsbauteil und dreidimensionale schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen schaltungsträgeraufbauten Download PDF

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Publication number
WO2009043649A3
WO2009043649A3 PCT/EP2008/061346 EP2008061346W WO2009043649A3 WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3 EP 2008061346 W EP2008061346 W EP 2008061346W WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3
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WO
WIPO (PCT)
Prior art keywords
circuit board
dimensional
board structure
structures
functional component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/061346
Other languages
English (en)
French (fr)
Other versions
WO2009043649A2 (de
Inventor
Andreas Bernhardt
Ulrich Deml
Carsten GÖTTE
Angelika Schingale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Germany GmbH
Original Assignee
Continental Automotive Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Technologies GmbH filed Critical Continental Automotive Technologies GmbH
Publication of WO2009043649A2 publication Critical patent/WO2009043649A2/de
Publication of WO2009043649A3 publication Critical patent/WO2009043649A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/047—Box-like arrangements of PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Die Erfindung betrifft einen dreidimensionalen elektrischen Schaltungsträgeraufbau mit mindestens zwei miteinander in Verbindung stehenden planaren, zweidimensionalen Substratplatten, die Kontaktierungselemente aufweisen und vorzugsweise beidseitig mit elektronischen Bauteilen bestückt sind, wobei die Substratplatten Substratplatten-Wandungen bilden, die in einem Winkel <180° zueinander angeordnet sind, woraus ein dreidimensionaler Raumformkörper mit Freiräumen zwischen den Substratplatten-Wandungen resultiert und wobei zweckmäßigerweise elektrische Leitermittel vorgesehen sind, die elektrischen Strom von einer Substratplatten-Wandung zu einer benachbarten Substratplatten-Wandung leiten, sowie einen Schaltungsgrundträger, der einen derartigen elektrischen Schaltungsträgeraufbau aufweist und eine dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten.
PCT/EP2008/061346 2007-09-28 2008-08-28 Dreidimensionaler elektronischer schaltungsträgeraufbau, sowie schaltungsgrundträger aufweisend den schaltungsträgeraufbau als funktionsbauteil und dreidimensionale schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen schaltungsträgeraufbauten Ceased WO2009043649A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007046493.4 2007-09-28
DE102007046493A DE102007046493A1 (de) 2007-09-28 2007-09-28 Dreidimensionaler elektronischer Schaltungsträgeraufbau, sowie Schaltungsgrundträger aufweisend den Schaltungsträgeraufbau als Funktionsbauteil und dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten

Publications (2)

Publication Number Publication Date
WO2009043649A2 WO2009043649A2 (de) 2009-04-09
WO2009043649A3 true WO2009043649A3 (de) 2009-10-29

Family

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PCT/EP2008/061346 Ceased WO2009043649A2 (de) 2007-09-28 2008-08-28 Dreidimensionaler elektronischer schaltungsträgeraufbau, sowie schaltungsgrundträger aufweisend den schaltungsträgeraufbau als funktionsbauteil und dreidimensionale schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen schaltungsträgeraufbauten

Country Status (2)

Country Link
DE (1) DE102007046493A1 (de)
WO (1) WO2009043649A2 (de)

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DE102010062759A1 (de) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Leiterplattenanordnung
DE102010062757A1 (de) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Leiterplattenanordnung und Verfahren zur Herstellung einer Leiterplatte
DE102010062758A1 (de) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Leiterplattenanordnung
DE102011111488A1 (de) * 2011-08-30 2013-02-28 Schoeller-Electronics Gmbh Leiterplattensystem
US8971048B2 (en) 2013-03-06 2015-03-03 Alliant Techsystems Inc. Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package
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DE102014117536B4 (de) * 2014-11-28 2019-04-18 Sick Ag Verfahren zur seitlichen Verbindung zweier Leiterplatten und optoelektronischer Sensor mit zwei im Winkel verbundenen Leiterplatten
DE102015216419B4 (de) 2015-08-27 2022-06-15 Vitesco Technologies GmbH Elektronisches Gerät mit einem Gehäuse mit einer darin angeordneten Leiterplatte
US10820416B2 (en) 2015-11-27 2020-10-27 Sony Corporation Substrate apparatus and method of manufacturing the same
DE102016003325B4 (de) 2016-03-21 2018-08-02 Gebr. Krallmann Gmbh Verfahren zur Herstellung eines Kunststoff-Bauteils mit mehreren Trägerteilen mit zumindest einer elektrischen Leiterbahn und so hergestelltes Kunststoff-Bauteil
JP2019057606A (ja) * 2017-09-20 2019-04-11 株式会社村田製作所 電子モジュール
KR102337901B1 (ko) 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
EP3709777A1 (de) 2019-03-11 2020-09-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Lötfreie bauteilträgerverbindung mit einem elastischen element und verfahren
DE102021102220A1 (de) 2020-02-10 2021-08-12 Ged Gesellschaft Für Elektronik Und Design Mbh Leiterplatte und Leiterplattenverbund
CN111627897A (zh) * 2020-05-28 2020-09-04 上海先方半导体有限公司 一种立体封装结构及其制备方法
CN111692738B (zh) * 2020-06-16 2025-01-07 珠海格力电器股份有限公司 用于电气元件的固定结构、电器盒、风机盘管和空调器
US20220322532A1 (en) * 2021-04-05 2022-10-06 Indiana Integrated Circuits, LLC Three-Dimensional Printed Circuit Substrate Assembly
JP7770785B2 (ja) * 2021-05-19 2025-11-17 ＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｊａｐａｎ合同会社 回路基板組立体の製造方法
JP7057957B1 (ja) * 2021-07-12 2022-04-21 太陽インキ製造株式会社 接続型立体成型回路部品及び回路接続構造
DE202022100279U1 (de) 2022-01-19 2023-04-21 WAGO Verwaltungsgesellschaft mit beschränkter Haftung Leiterplattenmontage
CN115413115A (zh) * 2022-09-27 2022-11-29 荣成歌尔微电子有限公司 封装结构、封装结构的制备方法及电子产品
DE102022127941A1 (de) * 2022-10-21 2024-05-02 Vega Grieshaber Kg Feldgerät und Verfahren zur kompakten Anordnung von elektronischen Baugruppen einer Elektronikschaltung
EP4391737B1 (de) * 2022-12-23 2026-01-28 K & N Schalterentwicklungsgesellschaft m.b.H. Modul für ein schaltgerät
DE102024204756A1 (de) * 2024-05-23 2025-11-27 Robert Bosch Gesellschaft mit beschränkter Haftung Leiterplattensystem

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DATABASE WPI Week 199942, Derwent World Patents Index; AN 1999-504649 *
DATABASE WPI Week 200249, Derwent World Patents Index; AN 2002-459615 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2688581C1 (ru) * 2018-06-18 2019-05-21 Юрий Борисович Соколов Способ изготовления трехмерного электронного модуля с высокой плотностью размещения компонентов и устройство

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WO2009043649A2 (de) 2009-04-09
DE102007046493A1 (de) 2009-04-09

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