WO2009050938A1 - 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法 - Google Patents

脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法 Download PDF

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Publication number
WO2009050938A1
WO2009050938A1 PCT/JP2008/064855 JP2008064855W WO2009050938A1 WO 2009050938 A1 WO2009050938 A1 WO 2009050938A1 JP 2008064855 W JP2008064855 W JP 2008064855W WO 2009050938 A1 WO2009050938 A1 WO 2009050938A1
Authority
WO
WIPO (PCT)
Prior art keywords
shaped groove
substrate
groove
chamfering
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064855
Other languages
English (en)
French (fr)
Inventor
Hideki Morita
Seiji Shimizu
Kenji Fukuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to US12/526,330 priority Critical patent/US20100320179A1/en
Priority to KR1020097015155A priority patent/KR101235617B1/ko
Priority to JP2009537983A priority patent/JP5580049B2/ja
Priority to EP08792576A priority patent/EP2199007A4/en
Priority to CN2008800051538A priority patent/CN101610870B/zh
Publication of WO2009050938A1 publication Critical patent/WO2009050938A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)

Abstract

　基板表面に容易に直線状もしくは曲線状の連続あるいは非連続のＵ字状溝を形成する方法およびこれを用いた面取り方法の提供。 　脆性材料基板の表面の一部を、加工対象の基板材料、形成予定のＵ字状溝の溝幅、深さ及び溝面の形状に対応して、予め求めたレーザパワー、レーザ照射面積、走査速度の組合せからなるＵ字状溝形成用のレーザ照射条件で急加熱することにより、基板の一部を表面から剥離させ、Ｕ字状溝を形成する。形成されたＵ字状溝の底部に設定した分断予定ラインの始端から終端に向けて、レーザ亀裂成長でスクライブする方法、カッターホイールでスクライブする方法等により、分断予定ラインから分断された端面と基板表面との間に形成されたＵ字状溝の一部によって構成される溝面からなる面取り加工面を形成する。
PCT/JP2008/064855 2007-10-16 2008-08-20 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法 Ceased WO2009050938A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/526,330 US20100320179A1 (en) 2007-10-16 2008-08-20 Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same
KR1020097015155A KR101235617B1 (ko) 2007-10-16 2008-08-20 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
JP2009537983A JP5580049B2 (ja) 2007-10-16 2008-08-20 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
EP08792576A EP2199007A4 (en) 2007-10-16 2008-08-20 METHOD OF MACHINING A U-SHAPED GROOVE OF A FRAGILE MATERIAL SUBSTRATE, REMOVAL METHOD, DRILLING METHOD, AND CHAMFREINING METHOD USING THE SAME
CN2008800051538A CN101610870B (zh) 2007-10-16 2008-08-20 脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007268589 2007-10-16
JP2007-268589 2007-10-16

Publications (1)

Publication Number Publication Date
WO2009050938A1 true WO2009050938A1 (ja) 2009-04-23

Family

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Application Number Title Priority Date Filing Date
PCT/JP2008/064855 Ceased WO2009050938A1 (ja) 2007-10-16 2008-08-20 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法

Country Status (6)

Country Link
US (1) US20100320179A1 (ja)
EP (1) EP2199007A4 (ja)
JP (1) JP5580049B2 (ja)
KR (1) KR101235617B1 (ja)
CN (1) CN101610870B (ja)
WO (1) WO2009050938A1 (ja)

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JP2014042921A (ja) * 2012-08-24 2014-03-13 Hamamatsu Photonics Kk レーザ加工方法
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US20100320179A1 (en) 2010-12-23
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