WO2009052815A3 - Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben - Google Patents

Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben Download PDF

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Publication number
WO2009052815A3
WO2009052815A3 PCT/DE2008/001771 DE2008001771W WO2009052815A3 WO 2009052815 A3 WO2009052815 A3 WO 2009052815A3 DE 2008001771 W DE2008001771 W DE 2008001771W WO 2009052815 A3 WO2009052815 A3 WO 2009052815A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
microchannel heat
semiconductor elements
cooling semiconductor
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2008/001771
Other languages
English (en)
French (fr)
Other versions
WO2009052815A2 (de
Inventor
Dirk Lorenzen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2009052815A2 publication Critical patent/WO2009052815A2/de
Publication of WO2009052815A3 publication Critical patent/WO2009052815A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Bei einer Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen besteht die Aufgabe, bei Nutzung der Vorteile, die mit einer Oberflächenverbesserung durch eine Anschlussmetallisierung verbunden sind, korrosionsbedingte Undichtheiten zu verhindern, ohne dass die thermische Effizienz der Mikrokanalwärmesenke gemindert wird. Das wird dadurch erreicht, dass auf Dichtflächen für Dichtelemente, die Kühlmitteleinlass- und Kühlmittelauslassöffnungen umschließen und auf Innenoberflächen eines Kühlmitteleinlasses und eines Kühlmittelauslasses wenigstens eine elektrisch isolierende anorganische Schutzschicht oder wenigstens eine abschließende Schutzschicht aus wenigstens einem Refraktärmetall aufgebracht ist.
PCT/DE2008/001771 2007-10-26 2008-10-26 Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben Ceased WO2009052815A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007051798.1 2007-10-26
DE102007051798A DE102007051798B3 (de) 2007-10-26 2007-10-26 Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen und Verfahren zur Oberflächenbehandlung derselben

Publications (2)

Publication Number Publication Date
WO2009052815A2 WO2009052815A2 (de) 2009-04-30
WO2009052815A3 true WO2009052815A3 (de) 2009-08-27

Family

ID=40121764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001771 Ceased WO2009052815A2 (de) 2007-10-26 2008-10-26 Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben

Country Status (2)

Country Link
DE (1) DE102007051798B3 (de)
WO (1) WO2009052815A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009016953B4 (de) 2009-04-08 2017-03-09 Dirk Lorenzen Konversionseinheit mit mehreren Konversionsmodulen, Inbetriebnahmeverfahren der Konversionseinheit und eine solche Konversionseinheit aufweisende optische Anordnung
CN104682189B (zh) * 2015-02-12 2017-10-24 中国科学院半导体研究所 一种高功率密度半导体激光器热沉
CN109121282A (zh) * 2018-08-06 2019-01-01 华进半导体封装先导技术研发中心有限公司 一种板体散热结构及其制作方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687053A (en) * 1982-11-26 1987-08-18 Fr. Kammerer Gmbh Heat exchanger panel and manufacturing method thereof
DE3835767A1 (de) * 1987-10-21 1989-05-03 Hitachi Ltd Kuehlvorrichtung fuer halbleitermodul
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP2003273441A (ja) * 2002-03-15 2003-09-26 Hamamatsu Photonics Kk ヒートシンク並びにこれを用いた半導体レーザ装置及び半導体レーザスタック装置
US20050063161A1 (en) * 2003-09-18 2005-03-24 Fuji Electric Systems Co., Ltd. Heat sink and method for its production
DE112004000204T5 (de) * 2003-01-31 2006-06-01 Cooligy, Inc., Mountain View Verfahren und Vorrichtung zur Herstellung von preisgünstigen elektrokinetischen Pumpen
EP1696526A1 (de) * 2003-12-16 2006-08-30 Hamamatsu Photonics K. K. Halbleiterlaserbauelement und herstellungsverfahren dafür
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
DE112005001479T5 (de) * 2004-07-08 2007-06-06 Hamamatsu Photonics K.K., Hamamatsu Halbleiter-Laser-Vorrichtung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105429A (en) * 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687053A (en) * 1982-11-26 1987-08-18 Fr. Kammerer Gmbh Heat exchanger panel and manufacturing method thereof
DE3835767A1 (de) * 1987-10-21 1989-05-03 Hitachi Ltd Kuehlvorrichtung fuer halbleitermodul
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP2003273441A (ja) * 2002-03-15 2003-09-26 Hamamatsu Photonics Kk ヒートシンク並びにこれを用いた半導体レーザ装置及び半導体レーザスタック装置
DE112004000204T5 (de) * 2003-01-31 2006-06-01 Cooligy, Inc., Mountain View Verfahren und Vorrichtung zur Herstellung von preisgünstigen elektrokinetischen Pumpen
US20050063161A1 (en) * 2003-09-18 2005-03-24 Fuji Electric Systems Co., Ltd. Heat sink and method for its production
EP1696526A1 (de) * 2003-12-16 2006-08-30 Hamamatsu Photonics K. K. Halbleiterlaserbauelement und herstellungsverfahren dafür
DE112005001479T5 (de) * 2004-07-08 2007-06-06 Hamamatsu Photonics K.K., Hamamatsu Halbleiter-Laser-Vorrichtung
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component

Also Published As

Publication number Publication date
DE102007051798B3 (de) 2009-01-15
WO2009052815A2 (de) 2009-04-30

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