WO2009054102A1 - Procede et appareil de classification de defauts - Google Patents

Procede et appareil de classification de defauts Download PDF

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Publication number
WO2009054102A1
WO2009054102A1 PCT/JP2008/002871 JP2008002871W WO2009054102A1 WO 2009054102 A1 WO2009054102 A1 WO 2009054102A1 JP 2008002871 W JP2008002871 W JP 2008002871W WO 2009054102 A1 WO2009054102 A1 WO 2009054102A1
Authority
WO
WIPO (PCT)
Prior art keywords
classification
defect
defect classification
correct answer
condition setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002871
Other languages
English (en)
Japanese (ja)
Inventor
Hisae Shibuya
Shunji Maeda
Akira Hamamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of WO2009054102A1 publication Critical patent/WO2009054102A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Analysis (AREA)

Abstract

Selon l'invention, dans la classification de défauts résultant d'une inspection d'aspect, la pureté ou la précision, ou les deux, d'un défaut critique doit/doivent être définie(s) comme égale(s) ou supérieure(s) à une valeur cible. Cependant, comme une condition de classification de défauts de type instruction est déterminée de sorte à permettre un taux moyen élevé de réponses correctes, la classification de défauts ne peut pas répondre à ces exigences. L'appareil de classification de défauts selon l'invention comprend une unité d'extraction de quantité caractéristique, une unité de classification de défauts et une unité de définition de conditions de classification. Cette dernière unité est dotée d'une fonction destinée à donner une instruction concernant une quantité caractéristique de défauts correspondant à une catégorie de réponses correctes, et d'une fonction destinée à désigner un ordre de priorité de classification. Ladite unité définit également les conditions de sorte qu'une classification haute priorité résulte en un taux élevé de réponses correctes.
PCT/JP2008/002871 2007-10-22 2008-10-10 Procede et appareil de classification de defauts Ceased WO2009054102A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-273894 2007-10-22
JP2007273894A JP5022174B2 (ja) 2007-10-22 2007-10-22 欠陥分類方法及びその装置

Publications (1)

Publication Number Publication Date
WO2009054102A1 true WO2009054102A1 (fr) 2009-04-30

Family

ID=40579212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002871 Ceased WO2009054102A1 (fr) 2007-10-22 2008-10-10 Procede et appareil de classification de defauts

Country Status (2)

Country Link
JP (1) JP5022174B2 (fr)
WO (1) WO2009054102A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011036846A1 (fr) * 2009-09-28 2011-03-31 株式会社日立ハイテクノロジーズ Dispositif et procédé d'inspection de défectuosités
US8892494B2 (en) 2009-07-23 2014-11-18 Hitachi High-Technologies Corporation Device for classifying defects and method for adjusting classification
CN112129869A (zh) * 2020-09-23 2020-12-25 清华大学深圳国际研究生院 基于数据驱动的现场质谱仪稳定输出控制系统及方法
CN113168687A (zh) * 2019-01-22 2021-07-23 株式会社日立高新技术 图像评价装置和方法
US11282229B2 (en) 2018-04-20 2022-03-22 Fanuc Corporation Inspection apparatus
CN116310554A (zh) * 2023-03-14 2023-06-23 凌云光技术股份有限公司 产品分类方法和装置、计算机可读存储介质及检测设备
CN116848551A (zh) * 2021-03-12 2023-10-03 欧姆龙株式会社 辅助装置以及方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452392B2 (ja) 2009-12-16 2014-03-26 株式会社日立ハイテクノロジーズ 欠陥観察方法及び欠陥観察装置
WO2011155123A1 (fr) * 2010-06-07 2011-12-15 株式会社 日立ハイテクノロジーズ Méthode d'optimisation des références pour la classification d'images d'observation et dispositif de classification d'images
US8315453B2 (en) * 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
JP5912125B2 (ja) * 2010-11-12 2016-04-27 スリーエム イノベイティブ プロパティズ カンパニー ウェブベース材料における不均一性の高速処理と検出
US9715723B2 (en) 2012-04-19 2017-07-25 Applied Materials Israel Ltd Optimization of unknown defect rejection for automatic defect classification
US10043264B2 (en) 2012-04-19 2018-08-07 Applied Materials Israel Ltd. Integration of automatic and manual defect classification
US10114368B2 (en) 2013-07-22 2018-10-30 Applied Materials Israel Ltd. Closed-loop automatic defect inspection and classification
US9489599B2 (en) * 2013-11-03 2016-11-08 Kla-Tencor Corp. Decision tree construction for automatic classification of defects on semiconductor wafers
JP6531036B2 (ja) * 2015-12-08 2019-06-12 株式会社Ｓｃｒｅｅｎホールディングス 教師データ作成支援方法、画像分類方法、教師データ作成支援装置および画像分類装置
JP7186539B2 (ja) * 2018-08-03 2022-12-09 Ａｕｔｏｍａｇｉ株式会社 錆検出プログラム、錆検出システム及び錆検出方法
CN114556418A (zh) * 2019-10-28 2022-05-27 3M创新有限公司 自动化车辆修复系统
JP7349066B2 (ja) * 2019-12-17 2023-09-22 日本電気硝子株式会社 欠陥分類方法、欠陥分類装置及びガラス物品の製造方法
US11293970B2 (en) 2020-01-12 2022-04-05 Kla Corporation Advanced in-line part average testing
KR20240093896A (ko) * 2021-11-25 2024-06-24 가부시키가이샤 재팬 디스프레이 표시 장치의 검사 방법 및 정보 처리 장치
JP2023107693A (ja) * 2022-01-24 2023-08-03 オムロン株式会社 分類条件設定支援装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005274285A (ja) * 2004-03-24 2005-10-06 Olympus Corp 欠陥分類辞書教示装置
JP2007067130A (ja) * 2005-08-31 2007-03-15 Hitachi High-Technologies Corp 回路パターン検査方法及びその装置
JP2008082821A (ja) * 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005274285A (ja) * 2004-03-24 2005-10-06 Olympus Corp 欠陥分類辞書教示装置
JP2007067130A (ja) * 2005-08-31 2007-03-15 Hitachi High-Technologies Corp 回路パターン検査方法及びその装置
JP2008082821A (ja) * 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8892494B2 (en) 2009-07-23 2014-11-18 Hitachi High-Technologies Corporation Device for classifying defects and method for adjusting classification
WO2011036846A1 (fr) * 2009-09-28 2011-03-31 株式会社日立ハイテクノロジーズ Dispositif et procédé d'inspection de défectuosités
JP2011089976A (ja) * 2009-09-28 2011-05-06 Hitachi High-Technologies Corp 欠陥検査装置および欠陥検査方法
US9075026B2 (en) 2009-09-28 2015-07-07 Hitachi High-Technologies Corporation Defect inspection device and defect inspection method
US11282229B2 (en) 2018-04-20 2022-03-22 Fanuc Corporation Inspection apparatus
CN113168687A (zh) * 2019-01-22 2021-07-23 株式会社日立高新技术 图像评价装置和方法
CN112129869A (zh) * 2020-09-23 2020-12-25 清华大学深圳国际研究生院 基于数据驱动的现场质谱仪稳定输出控制系统及方法
CN112129869B (zh) * 2020-09-23 2022-11-18 清华大学深圳国际研究生院 基于数据驱动的现场质谱仪稳定输出控制系统及方法
CN116848551A (zh) * 2021-03-12 2023-10-03 欧姆龙株式会社 辅助装置以及方法
CN116310554A (zh) * 2023-03-14 2023-06-23 凌云光技术股份有限公司 产品分类方法和装置、计算机可读存储介质及检测设备

Also Published As

Publication number Publication date
JP2009103508A (ja) 2009-05-14
JP5022174B2 (ja) 2012-09-12

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