WO2009054343A1 - 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 - Google Patents

銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 Download PDF

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Publication number
WO2009054343A1
WO2009054343A1 PCT/JP2008/068960 JP2008068960W WO2009054343A1 WO 2009054343 A1 WO2009054343 A1 WO 2009054343A1 JP 2008068960 W JP2008068960 W JP 2008068960W WO 2009054343 A1 WO2009054343 A1 WO 2009054343A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
wiring pattern
particles
forming
copper oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068960
Other languages
English (en)
French (fr)
Inventor
Hideo Nakako
Kazunori Yamamoto
Youichi Machii
Yasushi Kumashiro
Shunya Yokozawa
Yoshinori Ejiri
Katsuyuki Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009538191A priority Critical patent/JP5067426B2/ja
Priority to EP08842232A priority patent/EP2204824A4/en
Priority to US12/739,228 priority patent/US20100233011A1/en
Priority to KR1020107008688A priority patent/KR101120743B1/ko
Priority to CN200880112547.3A priority patent/CN101836268B/zh
Publication of WO2009054343A1 publication Critical patent/WO2009054343A1/ja
Anticipated expiration legal-status Critical
Priority to US13/935,302 priority patent/US20130295276A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12181—Composite powder [e.g., coated, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

　銅粒子の耐酸化、分散に必須であった表面処理剤をほとんど用いずに、エレクトロマイグレーションが少なく、材料自体の単価が安価な銅粒子を用いて、クラックの発生を抑え、低抵抗の銅配線パターン形成方法と、それに用いる酸化銅粒子分散液を提供する。 　基板上に、酸化銅表面を有する銅系粒子を分散した分散液を用いて任意のパターンを形成する工程と、前記パターン中の銅系粒子表面の酸化銅を原子状水素により還元して銅に戻し、還元されて生成した銅金属粒子同士を焼結する工程と、を含むことを特徴とする銅配線パターン形成方法である。
PCT/JP2008/068960 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液 Ceased WO2009054343A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009538191A JP5067426B2 (ja) 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液
EP08842232A EP2204824A4 (en) 2007-10-22 2008-10-20 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
US12/739,228 US20100233011A1 (en) 2007-10-22 2008-10-20 Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used therein
KR1020107008688A KR101120743B1 (ko) 2007-10-22 2008-10-20 구리배선 패턴 형성방법 및 거기에 이용하는 산화구리 입자 분산액
CN200880112547.3A CN101836268B (zh) 2007-10-22 2008-10-20 铜配线图案形成方法以及用于其中的氧化铜粒子分散液
US13/935,302 US20130295276A1 (en) 2007-10-22 2013-07-03 Method for forming a copper wiring pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-273779 2007-10-22
JP2007273779 2007-10-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/935,302 Division US20130295276A1 (en) 2007-10-22 2013-07-03 Method for forming a copper wiring pattern

Publications (1)

Publication Number Publication Date
WO2009054343A1 true WO2009054343A1 (ja) 2009-04-30

Family

ID=40579448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068960 Ceased WO2009054343A1 (ja) 2007-10-22 2008-10-20 銅配線パターン形成方法及びそれに用いる酸化銅粒子分散液

Country Status (8)

Country Link
US (2) US20100233011A1 (ja)
EP (1) EP2204824A4 (ja)
JP (1) JP5067426B2 (ja)
KR (1) KR101120743B1 (ja)
CN (1) CN101836268B (ja)
MY (1) MY154259A (ja)
TW (1) TWI425893B (ja)
WO (1) WO2009054343A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011034016A1 (ja) 2009-09-16 2011-03-24 日立化成工業株式会社 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
WO2011034019A1 (ja) * 2009-09-16 2011-03-24 日立化成工業株式会社 印刷法用インク及びそれに用いられる金属ナノ粒子、並びに配線、回路基板、半導体パッケージ
JP2012018946A (ja) * 2010-07-06 2012-01-26 Hitachi Chem Co Ltd Ｃｕパターン付基板の製造方法及びそれにより得られるＣｕパターン付基板
WO2012128139A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
WO2012128140A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
JPWO2013077448A1 (ja) * 2011-11-24 2015-04-27 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物
TWI660789B (zh) * 2016-10-25 2019-06-01 財團法人金屬工業研究發展中心 微粒成形裝置及其微粒成形方法

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KR101970373B1 (ko) * 2011-08-03 2019-04-18 히타치가세이가부시끼가이샤 조성물 세트, 도전성 기판 및 그 제조 방법 및 도전성 접착재 조성물
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
CN107614753B (zh) * 2016-03-03 2018-09-28 三井金属矿业株式会社 覆铜层叠板的制造方法
KR20210158882A (ko) * 2016-03-11 2021-12-31 가부시키가이샤 니콘 미스트 발생장치, 성막장치, 미스트 발생 방법, 성막 방법, 및 디바이스 제조 방법

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JP2004119686A (ja) * 2002-09-26 2004-04-15 Harima Chem Inc 微細配線パターンの形成方法
WO2004103043A1 (ja) * 2003-05-16 2004-11-25 Harima Chemicals, Inc. 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法
WO2005122230A1 (ja) * 2004-06-07 2005-12-22 Kyushu Institute Of Technology 銅表面の処理方法及び銅パターン配線形成方法、並びに該方法を用いて作成された半導体装置
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JP2006269119A (ja) * 2005-03-22 2006-10-05 Furukawa Electric Co Ltd:The 焼結助剤を添加した金属酸化物粒子等の高周波電磁波照射による還元・相互融着方法及びそれを用いた各種電子部品と金属酸化物粒子等の焼成用材料

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5903887B2 (ja) * 2009-09-16 2016-04-13 日立化成株式会社 印刷法用インクの製造方法
WO2011034016A1 (ja) 2009-09-16 2011-03-24 日立化成工業株式会社 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
CN102549086A (zh) * 2009-09-16 2012-07-04 日立化成工业株式会社 印刷法用油墨以及用于该油墨的金属纳米粒子、以及布线、电路基板、半导体封装
KR20120094157A (ko) * 2009-09-16 2012-08-23 히다치 가세고교 가부시끼가이샤 인쇄법용 잉크 및 그에 이용되는 금속 나노 입자, 및 배선, 회로 기판, 반도체 패키지
US9457406B2 (en) 2009-09-16 2016-10-04 Hitachi Chemical Company, Ltd. Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
KR101633152B1 (ko) * 2009-09-16 2016-06-23 히타치가세이가부시끼가이샤 인쇄법용 잉크 및 그에 이용되는 금속 나노 입자, 및 배선, 회로 기판, 반도체 패키지
KR20160044062A (ko) 2009-09-16 2016-04-22 히타치가세이가부시끼가이샤 금속 구리막 및 그 제조 방법, 금속 구리 패턴 및 그것을 이용한 도체 배선, 금속 구리 범프, 열전도로, 접합재, 및 액상(液狀) 조성물
WO2011034019A1 (ja) * 2009-09-16 2011-03-24 日立化成工業株式会社 印刷法用インク及びそれに用いられる金属ナノ粒子、並びに配線、回路基板、半導体パッケージ
JP2012018946A (ja) * 2010-07-06 2012-01-26 Hitachi Chem Co Ltd Ｃｕパターン付基板の製造方法及びそれにより得られるＣｕパターン付基板
WO2012128139A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
JP2012204467A (ja) * 2011-03-24 2012-10-22 Fujifilm Corp 銅配線の形成方法、配線基板の製造方法および配線基板
JP2012204466A (ja) * 2011-03-24 2012-10-22 Fujifilm Corp 銅配線の形成方法、配線基板の製造方法および配線基板
WO2012128140A1 (ja) * 2011-03-24 2012-09-27 富士フイルム株式会社 銅配線の形成方法、配線基板の製造方法及び配線基板
CN103460817A (zh) * 2011-03-24 2013-12-18 富士胶片株式会社 铜配线的形成方法、配线基板的制造方法以及配线基板
JP2013008907A (ja) * 2011-06-27 2013-01-10 Hitachi Chem Co Ltd 導電性ペースト用酸化銅粉末、導電性ペースト用酸化銅粉末の製造方法、導電性ペースト及びこれを用いて得られる銅配線層
JPWO2013077448A1 (ja) * 2011-11-24 2015-04-27 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物
TWI660789B (zh) * 2016-10-25 2019-06-01 財團法人金屬工業研究發展中心 微粒成形裝置及其微粒成形方法

Also Published As

Publication number Publication date
JPWO2009054343A1 (ja) 2011-03-03
MY154259A (en) 2015-05-29
TWI425893B (zh) 2014-02-01
US20100233011A1 (en) 2010-09-16
JP5067426B2 (ja) 2012-11-07
KR20100057091A (ko) 2010-05-28
EP2204824A1 (en) 2010-07-07
CN101836268B (zh) 2013-09-18
TW200930186A (en) 2009-07-01
EP2204824A4 (en) 2011-03-30
CN101836268A (zh) 2010-09-15
KR101120743B1 (ko) 2012-03-22
US20130295276A1 (en) 2013-11-07

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