WO2009063883A1 - 導電性細線の形成方法 - Google Patents

導電性細線の形成方法 Download PDF

Info

Publication number
WO2009063883A1
WO2009063883A1 PCT/JP2008/070530 JP2008070530W WO2009063883A1 WO 2009063883 A1 WO2009063883 A1 WO 2009063883A1 JP 2008070530 W JP2008070530 W JP 2008070530W WO 2009063883 A1 WO2009063883 A1 WO 2009063883A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin line
forming
electroconductive
elecroconductive thin
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070530
Other languages
English (en)
French (fr)
Inventor
Masanori Tsubota
Hidekazu Shiomi
Hiroshi Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiren Co Ltd
Original Assignee
Seiren Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiren Co Ltd filed Critical Seiren Co Ltd
Priority to KR1020107012301A priority Critical patent/KR101516167B1/ko
Priority to US12/734,608 priority patent/US20100310761A1/en
Priority to EP08848612.1A priority patent/EP2224797A4/en
Priority to CN2008801158462A priority patent/CN101855950B/zh
Publication of WO2009063883A1 publication Critical patent/WO2009063883A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemically Coating (AREA)

Abstract

【課題】にじみのない高精細な導電性細線を安価に形成する方法を提供することを課題とする。 【解決手段】樹脂基材表面にＪＩＳ－Ｋ－６２５３タイプＡ測定法による硬度が２０～７０である樹脂被膜を形成したのち、前記樹脂被膜上に凹版印刷もしくは孔版印刷の手法を用いて導電性ペーストによる細線パターンを形成するか、あるいは凹版印刷もしくは孔版印刷の手法を用いて無電解めっき触媒インクによる細線パターンを形成し、次いでめっき処理により該細線パターン上に金属被膜を形成する細線パターンを形成することにより、導電性細線を形成する。
PCT/JP2008/070530 2007-11-13 2008-11-11 導電性細線の形成方法 Ceased WO2009063883A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107012301A KR101516167B1 (ko) 2007-11-13 2008-11-11 도전성 세선의 형성 방법
US12/734,608 US20100310761A1 (en) 2007-11-13 2008-11-11 Process for producing transparent electroconductive member
EP08848612.1A EP2224797A4 (en) 2007-11-13 2008-11-11 Method for forming elecroconductive thin line
CN2008801158462A CN101855950B (zh) 2007-11-13 2008-11-11 导电性细线的形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007293873A JP5060250B2 (ja) 2007-11-13 2007-11-13 導電性細線の形成方法
JP2007-293873 2007-11-13

Publications (1)

Publication Number Publication Date
WO2009063883A1 true WO2009063883A1 (ja) 2009-05-22

Family

ID=40638732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070530 Ceased WO2009063883A1 (ja) 2007-11-13 2008-11-11 導電性細線の形成方法

Country Status (6)

Country Link
US (1) US20100310761A1 (ja)
EP (1) EP2224797A4 (ja)
JP (1) JP5060250B2 (ja)
KR (1) KR101516167B1 (ja)
CN (1) CN101855950B (ja)
WO (1) WO2009063883A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5295931B2 (ja) * 2009-10-30 2013-09-18 パナソニック株式会社 回路基板の製造方法、及び前記製造方法により得られた回路基板
CN103571269B (zh) * 2012-07-30 2016-08-03 比亚迪股份有限公司 油墨组合物、线路板及其制备方法
CN102883543B (zh) * 2012-10-08 2016-04-13 复旦大学 一种采用加成工艺制备导电线路的方法
US9629253B2 (en) 2013-03-12 2017-04-18 Dic Corporation Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component
WO2014142007A1 (ja) 2013-03-12 2014-09-18 Dic株式会社 導電性高精細パターンの形成方法、導電性高精細パターン及び電気回路
JP7179438B2 (ja) * 2016-08-25 2022-11-29 キヤノン株式会社 金型の製造方法及び樹脂成形品の製造方法
JP2018148040A (ja) * 2017-03-06 2018-09-20 富士フイルム株式会社 導電性パターン形成方法
JP2021079644A (ja) * 2019-11-20 2021-05-27 凸版印刷株式会社 印刷物とその製造方法、及び圧力感知シート
CZ2023515A3 (cs) 2023-12-24 2025-07-02 Leancat Electrolyzers S.R.O. Způsob přesného nanášení katalytických inkoustů a zařízení k jeho provedení

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207878A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol 化学めつき用触媒ペ−ストを用いた金属めつき方法
JPH04176193A (ja) * 1990-11-07 1992-06-23 Matsushita Electric Ind Co Ltd クリーム半田印刷用基板
JPH05295553A (ja) * 1992-02-13 1993-11-09 Ibiden Co Ltd 接着剤シートとこの接着剤シートを用いたプリント配線板の製造方法およびプリント配線板
JPH07193373A (ja) * 1993-12-27 1995-07-28 Ibiden Co Ltd 多層プリント配線板及び接着用シート
JP2001144446A (ja) * 1999-04-06 2001-05-25 Ibiden Co Ltd 多層プリント配線板の製造方法および多層プリント配線板
JP2003145709A (ja) 2001-11-15 2003-05-21 Sumitomo Osaka Cement Co Ltd スクリーン印刷機およびスクリーン印刷方法
JP2004296504A (ja) * 2003-03-25 2004-10-21 Toshiba Corp 配線部材およびその製造方法
JP2004325552A (ja) 2003-04-22 2004-11-18 Murata Mfg Co Ltd スクリーン印刷用版の製造方法
JP2007210236A (ja) * 2006-02-10 2007-08-23 Toyo Tire & Rubber Co Ltd 積層研磨パッド

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DE69809606T2 (de) * 1997-02-18 2003-04-10 Canon K.K., Tokio/Tokyo Aufzeichnungsmaterial, Verfahren zu dessen Herstellung und Tintenstrahlgedruckten Bildern unter Verwendung dieses Materials
JP3614707B2 (ja) * 1999-04-28 2005-01-26 住友大阪セメント株式会社 透光性導電膜の製造方法及び透光性導電膜
CN1169675C (zh) * 2000-10-05 2004-10-06 王子制纸株式会社 喷墨记录纸
JP2002185095A (ja) * 2000-12-12 2002-06-28 Kuraray Plast Co Ltd フレキシブルプリント回路基板
JP4549545B2 (ja) * 2001-01-24 2010-09-22 大日本印刷株式会社 電磁波シールド材の製造方法、並びにパターン形成方法
JP4687107B2 (ja) 2002-09-25 2011-05-25 コニカミノルタホールディングス株式会社 電気回路、薄膜トランジスタ、電気回路の製造方法及び薄膜トランジスタの製造方法
WO2004039138A1 (ja) * 2002-10-28 2004-05-06 Bridgestone Corporation 電磁波シールド性光透過窓材及びその製造方法
CN100543073C (zh) * 2003-08-08 2009-09-23 优泊公司 热塑性树脂膜
JP2006302997A (ja) * 2005-04-18 2006-11-02 Seiren Co Ltd 透明導電性フィルム及びその製造方法
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Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207878A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol 化学めつき用触媒ペ−ストを用いた金属めつき方法
JPH04176193A (ja) * 1990-11-07 1992-06-23 Matsushita Electric Ind Co Ltd クリーム半田印刷用基板
JPH05295553A (ja) * 1992-02-13 1993-11-09 Ibiden Co Ltd 接着剤シートとこの接着剤シートを用いたプリント配線板の製造方法およびプリント配線板
JPH07193373A (ja) * 1993-12-27 1995-07-28 Ibiden Co Ltd 多層プリント配線板及び接着用シート
JP2001144446A (ja) * 1999-04-06 2001-05-25 Ibiden Co Ltd 多層プリント配線板の製造方法および多層プリント配線板
JP2003145709A (ja) 2001-11-15 2003-05-21 Sumitomo Osaka Cement Co Ltd スクリーン印刷機およびスクリーン印刷方法
JP2004296504A (ja) * 2003-03-25 2004-10-21 Toshiba Corp 配線部材およびその製造方法
JP2004325552A (ja) 2003-04-22 2004-11-18 Murata Mfg Co Ltd スクリーン印刷用版の製造方法
JP2007210236A (ja) * 2006-02-10 2007-08-23 Toyo Tire & Rubber Co Ltd 積層研磨パッド

Non-Patent Citations (1)

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Title
See also references of EP2224797A4

Also Published As

Publication number Publication date
CN101855950A (zh) 2010-10-06
JP5060250B2 (ja) 2012-10-31
EP2224797A1 (en) 2010-09-01
KR101516167B1 (ko) 2015-05-04
CN101855950B (zh) 2012-08-15
EP2224797A4 (en) 2017-05-31
KR20100093555A (ko) 2010-08-25
US20100310761A1 (en) 2010-12-09
JP2009123791A (ja) 2009-06-04

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