WO2009069210A1 - Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage - Google Patents

Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage Download PDF

Info

Publication number
WO2009069210A1
WO2009069210A1 PCT/JP2007/073048 JP2007073048W WO2009069210A1 WO 2009069210 A1 WO2009069210 A1 WO 2009069210A1 JP 2007073048 W JP2007073048 W JP 2007073048W WO 2009069210 A1 WO2009069210 A1 WO 2009069210A1
Authority
WO
WIPO (PCT)
Prior art keywords
solvent
atomizer
wiring formation
atomization
carrier gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/073048
Other languages
English (en)
Japanese (ja)
Inventor
Katsumi Tanaka
Kenichi Shinozaki
Kentaro Nakamura
Takao Narumi
Tetsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to PCT/JP2007/073048 priority Critical patent/WO2009069210A1/fr
Priority to JP2009543614A priority patent/JP5190465B2/ja
Publication of WO2009069210A1 publication Critical patent/WO2009069210A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Special Spraying Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

La présente invention se rapporte à un vaporisateur dans lequel les intervalles de réapprovisionnement en solvant pour dissolution de matière peuvent être prolongés. Le vaporisateur comprend une partie de vaporisation dans laquelle une matière est dissoute dans un solvant et la matière et le solvant sont vaporisés pour former une buée. La buée est déchargée à l'extérieur avec un gaz porteur introduit. Le vaporisateur se caractérise en ce qu'il comporte une partie réapprovisionnement en solvant qui alimente la partie de vaporisation en mélange gazeux constitué du gaz porteur et d'un solvant dans un état vaporisé. La partie réapprovisionnement en solvant présente un espace dans lequel est vaporisé un solvant liquide, et un gaz porteur introduit de l'extérieur est mélangé au solvant vaporisé.
PCT/JP2007/073048 2007-11-29 2007-11-29 Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage Ceased WO2009069210A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/073048 WO2009069210A1 (fr) 2007-11-29 2007-11-29 Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage
JP2009543614A JP5190465B2 (ja) 2007-11-29 2007-11-29 霧化装置、霧化方法、配線形成装置及び配線形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073048 WO2009069210A1 (fr) 2007-11-29 2007-11-29 Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage

Publications (1)

Publication Number Publication Date
WO2009069210A1 true WO2009069210A1 (fr) 2009-06-04

Family

ID=40678126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073048 Ceased WO2009069210A1 (fr) 2007-11-29 2007-11-29 Vaporisateur, procédé de vaporisation, appareil et procédé de formation de câblage

Country Status (2)

Country Link
JP (1) JP5190465B2 (fr)
WO (1) WO2009069210A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129413A (ja) * 2010-12-16 2012-07-05 Micronics Japan Co Ltd 配線形成装置
KR101492735B1 (ko) 2012-12-27 2015-02-11 가부시키가이샤 니혼 마이크로닉스 배선형성장치, 메인터넌스 방법 및 배선형성방법
JP2020049440A (ja) * 2018-09-27 2020-04-02 凸版印刷株式会社 薄膜形成方法、薄膜形成装置、および機能性薄膜
CN116408235A (zh) * 2021-11-29 2023-07-11 普罗科技有限公司 混合喷射泵

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219478A (ja) * 1988-07-05 1990-01-23 Mitsubishi Heavy Ind Ltd 高速成膜方法
JPH0685605U (ja) * 1993-05-26 1994-12-13 昇 加藤 理美容院用加湿装置
JP2003051499A (ja) * 2001-08-07 2003-02-21 Matsushita Electric Ind Co Ltd 薄膜形成方法及び装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH076263U (ja) * 1993-06-26 1995-01-27 太陽誘電株式会社 薄膜形成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219478A (ja) * 1988-07-05 1990-01-23 Mitsubishi Heavy Ind Ltd 高速成膜方法
JPH0685605U (ja) * 1993-05-26 1994-12-13 昇 加藤 理美容院用加湿装置
JP2003051499A (ja) * 2001-08-07 2003-02-21 Matsushita Electric Ind Co Ltd 薄膜形成方法及び装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129413A (ja) * 2010-12-16 2012-07-05 Micronics Japan Co Ltd 配線形成装置
CN102573311A (zh) * 2010-12-16 2012-07-11 日本麦可罗尼克斯股份有限公司 布线形成装置
US8468685B2 (en) 2010-12-16 2013-06-25 Kabushiki Kaisha Nihon Micronics Wire forming device
KR101284538B1 (ko) * 2010-12-16 2013-07-11 가부시키가이샤 니혼 마이크로닉스 배선 형성 장치
TWI457059B (zh) * 2010-12-16 2014-10-11 Nihon Micronics Kk 配線形成裝置
KR101492735B1 (ko) 2012-12-27 2015-02-11 가부시키가이샤 니혼 마이크로닉스 배선형성장치, 메인터넌스 방법 및 배선형성방법
JP2020049440A (ja) * 2018-09-27 2020-04-02 凸版印刷株式会社 薄膜形成方法、薄膜形成装置、および機能性薄膜
JP7434705B2 (ja) 2018-09-27 2024-02-21 Ｔｏｐｐａｎホールディングス株式会社 薄膜形成方法、薄膜形成装置、および機能性薄膜
CN116408235A (zh) * 2021-11-29 2023-07-11 普罗科技有限公司 混合喷射泵
CN116408235B (zh) * 2021-11-29 2025-09-09 普罗科技有限公司 混合喷射泵

Also Published As

Publication number Publication date
JP5190465B2 (ja) 2013-04-24
JPWO2009069210A1 (ja) 2011-04-07

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