WO2009072500A1 - 形状測定装置 - Google Patents

形状測定装置 Download PDF

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Publication number
WO2009072500A1
WO2009072500A1 PCT/JP2008/071902 JP2008071902W WO2009072500A1 WO 2009072500 A1 WO2009072500 A1 WO 2009072500A1 JP 2008071902 W JP2008071902 W JP 2008071902W WO 2009072500 A1 WO2009072500 A1 WO 2009072500A1
Authority
WO
WIPO (PCT)
Prior art keywords
measuring
shape
measuring object
light
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/071902
Other languages
English (en)
French (fr)
Inventor
Masaru Akamatsu
Hidehisa Hashizume
Yasuhide Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobelco Research Institute Inc
Original Assignee
Kobelco Research Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobelco Research Institute Inc filed Critical Kobelco Research Institute Inc
Priority to US12/745,546 priority Critical patent/US8228509B2/en
Publication of WO2009072500A1 publication Critical patent/WO2009072500A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　円盤状の測定対象物の端面の形状をその投影像に基づいて測定する際に、測定対象物に投光される光束に非平行光成分が含まれないように、また、測定対象物の表裏各面が投光方向と平行になるようにして、高精度な形状測定をおこなう形状測定装置を提供する。 点光源（２）から出射した光をコリメートするコリメータレンズ（３）と、コリメータレンズ（３）から測定対象物（１）の測定部へ向かう光束のうち、投光方向（Ｒ１）から見たカメラ撮像範囲の外側の光、又は測定部の投影像の外側に位置する境界線の外側の光を遮断する１又は複数のアパーチャ（８）と、を備える。さらに、中央吸着支持機構（９）により支持された測定対象物（１）の測定部に対して中央側の位置で、測定対象物（１）の一方の面を投光方向（Ｒ１）に対して平行に支持する平行支持部（２１）を備える。
PCT/JP2008/071902 2007-12-03 2008-12-02 形状測定装置 Ceased WO2009072500A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/745,546 US8228509B2 (en) 2007-12-03 2008-12-02 Shape measuring device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007312034A JP4388576B2 (ja) 2007-12-03 2007-12-03 形状測定装置
JP2007-312034 2007-12-03

Publications (1)

Publication Number Publication Date
WO2009072500A1 true WO2009072500A1 (ja) 2009-06-11

Family

ID=40717678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071902 Ceased WO2009072500A1 (ja) 2007-12-03 2008-12-02 形状測定装置

Country Status (4)

Country Link
US (1) US8228509B2 (ja)
JP (1) JP4388576B2 (ja)
TW (1) TWI395921B (ja)
WO (1) WO2009072500A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6591762B2 (ja) * 2015-02-27 2019-10-16 三菱重工業株式会社 摩耗検査装置、摩耗検査方法及びプログラム
CN105222727B (zh) * 2015-09-25 2018-01-05 深圳大学 线阵ccd相机成像平面与工作台平行度的测量方法和系统
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
TWI636234B (zh) * 2016-12-13 2018-09-21 由田新技股份有限公司 外形量測方法、外形量測設備及形變檢測設備
EP3502615A1 (en) 2017-12-21 2019-06-26 EpiGan NV A wafer surface curvature determining system
EP3764165A1 (en) * 2019-07-12 2021-01-13 ASML Netherlands B.V. Substrate shape measuring device
CN112344879B (zh) * 2020-09-29 2022-03-25 联想(北京)有限公司 一种胶路的检测方法、装置及设备
JP7562232B2 (ja) * 2020-10-30 2024-10-07 株式会社ディスコ ノッチ検出方法
CN113916157B (zh) * 2021-09-30 2022-06-14 广州思拓力测绘科技有限公司 一种环形电极倾角测量方法及其测量装置
US12352704B2 (en) * 2022-12-28 2025-07-08 Mitutoyo Corporation Metrology system for measuring edge of circular workpiece
JP2026065827A (ja) * 2024-10-04 2026-04-16 株式会社コベルコ科研 輪郭形状測定装置および該方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218228A (ja) * 1994-01-27 1995-08-18 Tokyo Seimitsu Co Ltd ウェーハ直径・断面形状測定装置 及びそれを組み込んだウェーハ面取り機
JPH09229638A (ja) * 1996-02-26 1997-09-05 Daido Steel Co Ltd 断面矩形材の厚み，傾き角測定方法および測定装置
JP2000084811A (ja) * 1998-09-16 2000-03-28 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
JP2003243465A (ja) * 2002-02-19 2003-08-29 Honda Electron Co Ltd ウエーハ用検査装置
JP2005188955A (ja) * 2003-12-24 2005-07-14 Tsubakimoto Chain Co 形状計測装置
JP2006145487A (ja) * 2004-11-24 2006-06-08 Kobe Steel Ltd 形状計測装置用光学系
WO2006112530A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP2007240264A (ja) * 2006-03-07 2007-09-20 Olympus Corp 観察装置及び端面欠陥検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874795B2 (ja) * 1990-09-19 1999-03-24 株式会社ニデック オリエンテーションフラット検出装置
JP3058615B2 (ja) * 1998-04-10 2000-07-04 株式会社山武 ウエハ検出装置
WO2005106385A1 (ja) * 2004-04-27 2005-11-10 Sumitomo Heavy Industries, Ltd. 検出装置及びステージ装置
JP2006112530A (ja) 2004-10-15 2006-04-27 Ttk:Kk 樹脂バネ、この樹脂バネを用いたスライド機構及びこのスライド機構を用いた戸用ストッパ
TWI287614B (en) * 2006-08-16 2007-10-01 Univ Nat Formosa System and method is used with theory of optical aberration for measuring free camber
JP4128605B1 (ja) 2007-03-29 2008-07-30 あいおい損害保険株式会社 倒産確率予測装置及び倒産確率予測システム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218228A (ja) * 1994-01-27 1995-08-18 Tokyo Seimitsu Co Ltd ウェーハ直径・断面形状測定装置 及びそれを組み込んだウェーハ面取り機
JPH09229638A (ja) * 1996-02-26 1997-09-05 Daido Steel Co Ltd 断面矩形材の厚み，傾き角測定方法および測定装置
JP2000084811A (ja) * 1998-09-16 2000-03-28 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
JP2003243465A (ja) * 2002-02-19 2003-08-29 Honda Electron Co Ltd ウエーハ用検査装置
JP2005188955A (ja) * 2003-12-24 2005-07-14 Tsubakimoto Chain Co 形状計測装置
JP2006145487A (ja) * 2004-11-24 2006-06-08 Kobe Steel Ltd 形状計測装置用光学系
WO2006112530A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP2007240264A (ja) * 2006-03-07 2007-09-20 Olympus Corp 観察装置及び端面欠陥検査装置

Also Published As

Publication number Publication date
TW200928290A (en) 2009-07-01
JP2009133799A (ja) 2009-06-18
US20100302551A1 (en) 2010-12-02
US8228509B2 (en) 2012-07-24
TWI395921B (zh) 2013-05-11
JP4388576B2 (ja) 2009-12-24

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