WO2009072690A1 - Dispositif pour chauffer un cadre modèle - Google Patents

Dispositif pour chauffer un cadre modèle Download PDF

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Publication number
WO2009072690A1
WO2009072690A1 PCT/KR2007/006377 KR2007006377W WO2009072690A1 WO 2009072690 A1 WO2009072690 A1 WO 2009072690A1 KR 2007006377 W KR2007006377 W KR 2007006377W WO 2009072690 A1 WO2009072690 A1 WO 2009072690A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
liquid
cooling
housing
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2007/006377
Other languages
English (en)
Inventor
Sang Hyun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Priority to PCT/KR2007/006377 priority Critical patent/WO2009072690A1/fr
Priority to CN2007801018405A priority patent/CN101889241B/zh
Publication of WO2009072690A1 publication Critical patent/WO2009072690A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials

Definitions

  • the present invention relates to a heating apparatus, and more particularly, to an apparatus for heating a pattern frame which is used to form a pattern on a glass plate in manufacturing processes of an LCD (Liquid Crystal Display), and the like.
  • LCD Liquid Crystal Display
  • an LCD device is a display device which uses a state change of a liquid crystal having a characteristic between a liquid and a solid, and a polarizing characteristic of a polarizer so as to adjust the amount of light penetrating a liquid crystal, thereby displaying information.
  • an LCD includes a lower substrate having driving devices such as a TFT (Thin Film Transistor) on a plate-shaped glass, an upper substrate having a color filter layer, a liquid crystal filled between the upper and lower substrates, and a backlight unit serving as a light source.
  • driving devices such as a TFT (Thin Film Transistor) on a plate-shaped glass
  • an upper substrate having a color filter layer
  • a liquid crystal filled between the upper and lower substrates and a backlight unit serving as a light source.
  • a specific pattern can be formed on the film formed on the substrate, in a "patterning" process.
  • a patterning process after a photoresist is deposited on the substrate where the film was formed, a series of steps including exposure, developing, etching, resist removal, and the like is performed. Since it is complicated to perform such series of steps, a new method for simplicity, which presses a pattern frame having a pattern to mold onto a film of the substrate and then imprints it, is in the limelight.
  • the heated pattern frame contacts or presses the substrate on which the film is formed. After pressing, a film portion having been contacted by the heated pattern frame becomes hardened, thereby securely forming the pattern on the film and then the pattern frame is separated from the substrate.
  • a heating apparatus used to heat the pattern frame in such a patterning (imprinting) step is described with reference to Fig. 1.
  • Figure 1 is a schematic view illustrating a related art heating apparatus 10 which is used for a patterning process.
  • the heating apparatus 10 is configured with a heat conduction unit 13 received inside a housing 11.
  • a heating means 15 for supplying heat, e.g., a heating wire is arrayed in the heat conduction unit 13.
  • one side of the housing 11 is contacted by a pattern frame P, which has a shape corresponding to the pattern to be molded onto the glass substrate where a film is formed (not shown).
  • Heat generated by the heating means 15 is transferred to the pattern frame P through the heat conduction unit 13 under the control of an operator.
  • the pattern frame P having been transferred heat, becomes heated, and as the pattern frame P contacts the glass substrate, a desired pattern can be formed on the portion where the film was formed.
  • the heat conduction unit 13 is shaped as a solid formed by sintering a heat conducting material. Since the heat conduction unit 13 is in a solid form, a hole must be made in the heat conduction unit 13 by a drilling and then the heating means 15 needs to be inserted into the hole.
  • the heat transfer from the heating means 15 to the pattern frame P can be performed only by the heat conduction method in the heat conduction unit 13. That is, it is difficult to expect heat convection and/or heat radiation by the heat conduction unit 13. With the heat conduction only, it is difficult to transfer heat to the heat conduction unit 13 in a rapid and uniform manner, thereby limiting to heat the pattern frame P quickly and uniformly.
  • the heat conduction unit 13 having a large size should be integrally sintered, thereby causing a difficulty in the sintering process.
  • the heating means 15 is formed as a heating wire, thereby generating almost only conduction heat. Further, the heating wire has just 20 - 30% energy conversion efficiency and is limited for a rapid heating. Further, the heating apparatus 10 is not provided with a specific cooling means, and cools the pattern frame P by just natural convection after patterning. Accordingly, rapid and uniform cooling becomes difficult.
  • an apparatus for heating a pattern frame including: a housing having an internal(interior) space and to which a pattern frame is mounted; a heat generating unit for supplying heat to the internal space of the housing; and a heat transfer unit filled in the internal space of the housing in a powdered form for transferring heat supplied by the heat generating unit to the pattern frame.
  • An apparatus for heating a pattern frame includes a housing having an internal space and at which a pattern frame is mounted; and a liquid control unit communicated with the internal space of the housing, for injecting or collecting a heated liquid into or from the internal space so as to perform heat exchange with the pattern frame.
  • the apparatus for heating a pattern frame can facilitate the manufacture of a heat transfer unit for transferring heat to the pattern frame and a liquid control unit, without limiting the size to be manufactured. Accordingly, the heat transfer unit and the like do not affect the manufacture of the entire apparatus for heating a pattern frame of a large size.
  • the heat transfer unit can perform all of the three heat transfer methods.
  • the liquid control unit and the cooling unit can simultaneously supply a heated liquid and cooling water, thereby enabling uniform and rapid heating and cooling for the pattern frame.
  • Such uniform and rapid heating and cooling can facilitate a patterning process in a precise scale, such as a nano-scale, using the apparatus for heating the pattern frame.
  • a halogen lamp as a heat emitting lamp has a quick temperature increase rate and energy conversion efficiency. Besides, the halogen lamp emits light and heat at the same time, thus to highly contribute to a rapid heating of the pattern frame.
  • the apparatus for heating the pattern frame according to the present invention is provided with a cooing unit, thereby actively performing a cooling of the pattern frame beyond a cooling by the natural convection.
  • Such cooling can be more rapidly performed by having a heat transfer unit, or by quickly supplying cooling water in the cooling unit.
  • Figure 1 is a schematic view illustrating a related art heating apparatus used for a patterning process
  • Figure 2 is a perspective view schematically illustrating an apparatus for heating a pattern frame according to a first embodiment of the present invention
  • Figure 3 is a cross-sectional view taken along line 1 Et-III' in Fig. 2;
  • Figure 4 is a schematic view illustrating an operational method for the apparatus for heating a pattern frame shown in Figs. 2 and 3;
  • Figure 5 is a perspective view schematically illustrating the apparatus for heating a pattern frame according to a second embodiment of the present invention
  • Figure 6 is a cross-sectional view taken along line 'VI-VI' in Fig. 5; and Figure 7 is a schematic view illustrating an operational method for the apparatus for heating a pattern frame shown in Figs. 5 and 6.
  • Figure 2 is a perspective view illustrating an apparatus for heating a pattern frame 100 according to a first embodiment of the present invention.
  • the apparatus for heating a pattern frame 100 includes a cover 160 having a pattern frame P mounted at one surface thereof and enclosing internal components, a heat generating unit 120 electrically connected to the internal components inside the cover 160, and a cooling unit 140 communicated with the internal components inside the cover 160.
  • the pattern frame P is heated by the internal components of the cover 160 and the heat generating unit 120, and then contacts a glass plate G (Fig. 4) on which a film was formed.
  • the cover 160 may be mounted at a moving means (not shown) configured to make the cover 160 (and the internal components therein) contact the glass plate G or make the cover 160 be separated from the glass plate G.
  • a power supply unit 123 and a power controller 125 are schematically illustrated in the drawing.
  • the power supply unit 123 is electrically connected to the power controller 125, and simultaneously, is electrically connected to the internal components inside the cover 160, i.e., a heat emitting lamp 121 (Fig. 3).
  • the power supply means 123 and the heat emitting lamp 121 are connected through wires 123a.
  • the cooling unit 140 serves to cool the pattern frame P after the pattern frame P contacts the glass plate G.
  • the cooling unit 140 includes a refrigerant supply unit 143 and a refrigerant controller 145 for controlling the refrigerant supply unit 143.
  • the refrigerant supply unit 143 is communicated with a cooling pipe 141 (referring to Fig. 3) through refrigerant supply lines 143a.
  • Fig. 3 is a cross-sectional view taken along line (HI-III) in Fig. 2.
  • a housing 110 is disposed inside the cover 160.
  • a vacuum portion 170 is maintained in a vacuum state between the housing 110 and the cover 160 for insulation.
  • a heat conduction plate 150 of a high conductivity is mounted between the housing 110 and the pattern frame P. Since the heat conduction plate 150 is mounted on one surface of the housing 110, the heat conduction plate 150 may be considered as a part of the housing 110. That is, that the pattern frame P is mounted at the housing 110 may also include a case that the pattern frame P is mounted at the heat conduction plate 150 coupled to the housing 110.
  • a heating element serving as a component of the heat generating unit 120 is disposed in an internal space 110a in the housing 110.
  • a heat emitting lamp 121 can be adopted as the heating element.
  • a halogen lamp is implemented as the heat emitting lamp 121.
  • the halogen lamp simultaneously generates light and heat, and is considered as a heating element of high efficiency which is capable of having a 70% energy conversion efficiency.
  • the halogen lamp can achieve a rate of temperature increase up to 70 ° C per second, thereby enabling a rapid temperature increase.
  • the cooling pipe 141 which is a component of the cooling unit 140, is disposed in the internal space 110a in the housing 110.
  • the cooling pipe 141 is, as mentioned above, communicated with the refrigerant supply unit 143 through the refrigerant supply lines 143a.
  • the cooling pipe 141 is disposed to surround the heat emitting lamp 121. With this arrangement, when cooling is needed, cooling can be effectively started from a periphery of the heat emitting lamp 121 , which is at a relatively high temperature.
  • a heat transfer unit 130 is disposed in the internal space 110a in the housing 110 so as to transfer heat and cooling air respectively generated by the heat emitting lamp 121 and the cooling pipe 141.
  • the heat transfer unit 130 is filled with materials in a powdered form having heat conductivity.
  • the materials filled in a powdered form can be Au, Ag, SiC, CNT (Carbon nanotube), and the like. Such materials are of good heat conductivity, and can form the heat transfer unit 130 by a single type having only one material or by a mixed type having various materials.
  • the heat transfer unit 130 simply requires the heat conductive material in a powdered form to be filled in the internal space 110a in the housing 110, thereby facilitating to manufacture the housing 110 (and further, the apparatus for heating the pattern frame 100) in a large size. That is because it does not encounter any difficulty in manufacture as caused by sintering the heat transfer unit 13 (Fig. 1 ) in a large size. Also, no sintering process is required, thereby quickening and simplifying the manufacture of the heat transfer unit 130.
  • Fig. 4 is a schematic view showing the operational method thereof.
  • the power controller 125 issues an operational command to the power supply unit 123.
  • the power supply unit 123 operated by the operational command supplies power to the heat emitting lamp 121 through the wires 123a.
  • the heat emitting lamp 121 to which power is applied, radiates light and heat.
  • the heat transfer unit 130 in a powdered form is configured to transfer heat generated by the heat emitting lamp 121 to the heat conduction plate 150.
  • the heat conduction plate 150 to which heat is transferred, transfers heat to the pattern frame P, and the heated pattern frame P contacts the glass plate G.
  • the portion where the film was formed on the glass plate G can be patterned with a certain pattern.
  • the heat emitting lamp 121 simultaneously generates heat and light, thereby having excellent heat-emitting efficiency. If the heat emitting lamp 121 is a halogen lamp, as described above, the pattern frame P can be rapidly heated and the temperature thereof can be up to 1000 0 C .
  • the heat transfer unit 130 Since the heat transfer unit 130 is in a powdered form, heat generated by the heat emitting lamp 121 is conducted by powder particles contacting each other. The heat is radiated through gaps between the particles. Although it is insignificant when compared to conduction or radiation, convection also occurs between the gaps. Three aspects of conduction, convection and radiation in the heat transfer are simultaneously performed by the heat transfer unit 130.
  • the heat generated by the heat emitting lamp 121 is uniformly and quickly transferred to the entire area of the heat conduction plate 150, thereby heating the entire area of the pattern frame P uniformly and quickly.
  • the heating of the pattern frame P in a uniform and rapid manner is a very important factor to achieve precision and quickness of the patterning process. The importance of such two factors can be more emphasized in a precise nano-scale patterning process.
  • the pattern frame P needs to be returned to its original position from the state that the pattern frame P is heated and is contacted onto the glass plate G, the pattern frame P should be cooled for stable separation of the pattern frame P from the glass plate G.
  • the refrigerant controller 145 issues an operational command to the refrigerant supply unit 143 for cooling.
  • the temperature at the periphery of the cooling pipe 141 is changed to be relatively low, heat at the area having a relatively high temperature, such as at the periphery of the heat emitting lamp 121 , the heat conduction plate 150, etc. is transferred to the periphery of the cooling pipe 141 by the heat transfer unit 130. Through the heat transfer, the inside of the housing 110 and also the pattern frame P are cooled, thereby completing the patterning process.
  • the heat transfer unit 130 enables the rapid and uniform cooling, similarly to the heating, thereby contributing to the precision and quickness of the patterning process. Since the heat transfer unit 130 is formed as a powder, unlike the related art sintered solid 13 (Fig. 1 ), cracking does not occur in the heat transfer unit 130 in spite of repetitive heating and cooling. That can be a factor to enhance the overall durability of the heat transfer unit 130 and the apparatus for heating the pattern frame 100.
  • Figure 5 is a perspective view schematically illustrating the apparatus for heating a pattern frame 200 according to the second embodiment of the present invention.
  • the apparatus for heating the pattern frame 200 includes a cover 260 having a pattern frame P mounted at one side thereof and covering internal components thereof, and a liquid control unit 220 and a cooling unit 230 communicated with the internal components in the cover 260.
  • the liquid control unit 220 includes a connection line 221 , a liquid supply/collection portion 223, and a liquid controller 225.
  • the connection line 221 is configured to communicate the liquid supply/collection portion 223 and the housing 210 (referring to Fig. 6) with each other.
  • the connection line 221 is formed to have a hollow pipe shape, and is extended to the inside of the cover 260.
  • the connection line 221 may be divided into a supply line 221-1 for supplying a heated liquid L (referring to Fig. 6) from the liquid supply/collection portion 223 to the housing 210, and a collection line 221-2 for collecting the liquid L in the housing 210 to the liquid supply/collection portion 223.
  • the liquid supply/recollection portion 223 is provided with a liquid tank
  • a pump 223b is further provided to pump the liquid L in the liquid tank 223a and the housing 210.
  • the pump 223b may be divided into a supply pump 223b-1 installed at the supply line 221-1 , and a collection pump 223b-2 installed at the collection line 221-2.
  • a heater 223c is disposed at the supply line 221-1 so as to heat the liquid L supplied to the housing 210.
  • the heater 223c may be integrally installed inside the liquid tank 223a.
  • a supply valve 223d-1 and the collection valve 223d-2 are respectively installed at the supply line 221-1 and the collection line 221-2, and open/close the lines 221-1 and 221-2.
  • the liquid controller 225 is electrically connected to each of the components 223a, 223b, 223c, 223d-1 and 223d-2 of the liquid supply/collection portion 223 so as to control the operations thereof. That the liquid controller 225 controls the liquid tank 223a may indicate that the operation of the heater 223c is controlled in the case that the heater 223c is mounted within the liquid tank 223a, or the like.
  • the cooling unit 230 includes a connection line 231 , a cooling water supply/collection portion 233 and a cooling water controller 235.
  • connection line 231 is configured to connect a cooling tank 233a of the cooling water supply/collection portion 233 and the housing 210 so as to be communicated with each other.
  • the connection line 231 is formed to have a hollow pipe shape, and is provided with two lines of a supply line 231-1 and a collection line 231-2.
  • the cooling water supply/collection portion 233 includes the cooling tank 233a and a pump 233b installed at the connection line 231.
  • the cooling tank 233a serves to store cooling water.
  • a cooling device (not shown) is installed at the cooling tank 233a, thereby enabling the cooling water to be maintained at a temperature required for cooling.
  • the pump 233b is categorized into a supply pump 233b-1 disposed to be communicated with the supply line 231-1 , and a collection pump 233b-2 disposed to be communicated with the collection line 231- 2.
  • the supply valve 233c-1 and the collection valve 233c-2 are respectively installed so as to be communicated with the supply line 231-1 and the collection line 231-2, and open/close the lines 231-1 and 231-2.
  • the cooling water controller 235 is electrically connected to each of the components 233a, 233b, 233c-1 and 233c-2 of the cooling water supply collection portion 233 so as to control the operations thereof.
  • that the cooling water controller 235 controls the cooling tank 233a indicates the control of the above- mentioned cooling device.
  • a heated liquid L or cooling water is rapidly supplied to the internal space of the housing 210 by the liquid control unit 220 or the cooling unit 230.
  • the supply line 221 and the connection line 231 may be formed in more than one pair, that is, as a plurality of pairs each connected to a portion of the housing 210.
  • Fig. 6 is a cross-sectional view taken along line (VI-VI) in Fig. 5.
  • a housing 210 is disposed inside the hollow cover 260.
  • a vacuum portion 270 in a vacuum state is formed between the housing 210 and the cover 260.
  • a heat conduction plate 250 is mounted on one surface of the housing 210 as a part of the housing 210. The heat conduction plate 250 serves to conduct heat finally to the pattern frame P.
  • connection line 221 penetrate the cover 260 and extend to be communicated with the internal space 210a in the housing 210.
  • the heated liquid L stored in the liquid tank 223a may be introduced into the internal space 210a in the housing 210 via the connection line 221 , or be collected from the internal space 210a into the liquid tank 223a. Even if the housing 210 becomes larger, the liquid L and the cooling water need only to be supplied according to its size, thereby reducing the limitation in manufacturing the housing 210 and the apparatus for heating the pattern frame 200 in a larger size.
  • materials 280 with good heat conductivity are distributed in the liquid L in a powdered form (Raoult's law).
  • the conductive materials 280 may be formed of the same kinds of materials as the heat transfer unit 130 in the first embodiment.
  • a mixer for mixing the liquid L may be installed in the storage space of the liquid L, such as the housing 210, the liquid tank 223a, and the like.
  • a heat emitting lamp 241 may be additionally disposed in the internal space 210a in the housing 210.
  • the power supply unit 243 and the power controller 245 (hereinafter, referring to Fig. 7) should also be provided to drive the heat emitting lamp 241.
  • Such components are the same as those corresponding to the heat generating unit 120 in the first embodiment, and detailed explanations therefor are omitted.
  • Fig. 7 is a schematic view illustrating the operational method thereof.
  • the liquid controller 225 issues an operational command to the liquid supply/collection portion 223 to heat the pattern frame P.
  • the supply pump 223b-1 pumps the liquid L stored in the liquid tank 223a into the housing 210 through the supply line 221-1.
  • the liquid L being pumped is supplied, heated by the heater 223c.
  • the liquid controller 225 closes the valves 223d-1 and 223d-2 such that the liquid L can remain in the internal space 110a.
  • the powdered materials 280 having conductivity in the liquid L serve to increase the heating temperature of the mixed liquid L, compared to a pure liquid L.
  • the heat generating unit 240 makes the heat emitting lamp 241 radiate and therefore supplies additional heat to the liquid L 1 thereby heating the heated liquid L at a higher temperature.
  • the heat generated by the above process within a preset temperature range is conducted to the pattern frame P through the heat conduction plate 250.
  • the pattern frame P can be heated up to 500 0 C . Accordingly, the pattern frame P contacts a portion where the film was formed on the glass plate G, thereby forming a certain pattern on the portion where the film was formed.
  • the heat generating unit 240 is stopped to cool the pattern frame P. Further, collecting the liquid L in the housing 210 to the liquid tank 223a can help the cooling of the pattern frame P.
  • the collection valve 223d-2 is opened, as the collection pump 223b-2 is operated, the liquid L inside the housing 210 is returned to the liquid tank 223a, thereby collecting the liquid L.
  • the cooling unit 230 may be operated for quicker cooling.
  • the cooling unit 230 is operated as follows: the cooling water controller 235 issues a command to the cooling water supply/collection unit 233 to supply the cooling water in the cooling tank 233a to the inside the housing 210.
  • the cooling water is supplied by operating the supply pump 233b-1 connected to the supply line 233c-1.
  • the cooling water supplied to the housing 210 may be circulated in the cooling tank 233a and the housing 210, or may be received in the housing as the valves 233c- 1 and 233c-2 are closed.
  • the housing 210 As the cooling water is supplied, the housing 210 is cooled more rapidly than when the heated liquid L is simply discharged. The cooling of the housing 210 causes the heat conduction plate 250 and the pattern frame P to be cooled. Accordingly, the pattern frame P is separated from the glass plate G, thus to complete the patterning process for the glass plate G.
  • the collection pump 233b- 2 is operated in a state that the collection valve 233c-2 is opened, thereby collecting the cooling water in the housing 210 into the cooling tank 233a.
  • the collected cooling water is maintained below a certain temperature by the cooling system of the cooling tank 233a.
  • the heat emitting lamp 121 e.g., the halogen lamp, is used as the heating element; however, a thermoelement (thermoelectric element) can also be adopted.
  • a thermoelement thermoelectric element
  • the present invention is an apparatus for heating a pattern when a patterning process is to be performed on a glass plate in a manufacturing process of an LCD module, etc. and can be used in the industry.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Resistance Heating (AREA)

Abstract

L'invention concerne un dispositif pour chauffer un cadre modèle comprenant : un logement comportant un espace interne et sur lequel un cadre modèle est monté, une unité de génération de chaleur pour délivrer de la chaleur à l'espace interne et une unité de transfert de chaleur introduite dans l'espace interne sous la forme d'une poudre, de manière à transférer la chaleur délivrée par l'unité de génération de chaleur au cadre modèle, pour chauffer ainsi uniformément et rapidement le cadre modèle et pour en faciliter la fabrication.
PCT/KR2007/006377 2007-12-07 2007-12-07 Dispositif pour chauffer un cadre modèle Ceased WO2009072690A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/KR2007/006377 WO2009072690A1 (fr) 2007-12-07 2007-12-07 Dispositif pour chauffer un cadre modèle
CN2007801018405A CN101889241B (zh) 2007-12-07 2007-12-07 用于加热图案框架的设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2007/006377 WO2009072690A1 (fr) 2007-12-07 2007-12-07 Dispositif pour chauffer un cadre modèle

Publications (1)

Publication Number Publication Date
WO2009072690A1 true WO2009072690A1 (fr) 2009-06-11

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PCT/KR2007/006377 Ceased WO2009072690A1 (fr) 2007-12-07 2007-12-07 Dispositif pour chauffer un cadre modèle

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WO (1) WO2009072690A1 (fr)

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WO2003079416A1 (fr) * 2002-03-15 2003-09-25 Princeton University Lithographie a impression directe assistee par laser
KR20050028246A (ko) * 2003-09-18 2005-03-22 주식회사 미뉴타텍 급속 가열 나노 몰딩을 이용한 미세 패턴 형성 방법
WO2005109095A2 (fr) * 2004-05-07 2005-11-17 Obducat Ab Procede d'impression de lithographies a une temperature constante
WO2006090682A1 (fr) * 2005-02-25 2006-08-31 Sumitomo Electric Industries, Ltd. Procede et systeme d’usinage de microstructure
KR100761212B1 (ko) * 2006-06-09 2007-09-21 한국기계연구원 열판 및 상기 열판을 적용한 고온 엠보싱 나노 임프린트리소그래피 장치
KR20080048343A (ko) * 2006-11-28 2008-06-02 주식회사 탑 엔지니어링 패턴 프레임 가열 장치

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Publication number Priority date Publication date Assignee Title
CN2141760Y (zh) * 1992-11-25 1993-09-08 青岛电冰箱总厂 一种自加热模具
US6048189A (en) * 1995-04-05 2000-04-11 Japan Synthetic Rubber Co., Ltd. Blow molding apparatus
KR100528334B1 (ko) * 2003-04-08 2005-11-16 삼성전자주식회사 베이크 시스템

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003079416A1 (fr) * 2002-03-15 2003-09-25 Princeton University Lithographie a impression directe assistee par laser
KR20050028246A (ko) * 2003-09-18 2005-03-22 주식회사 미뉴타텍 급속 가열 나노 몰딩을 이용한 미세 패턴 형성 방법
WO2005109095A2 (fr) * 2004-05-07 2005-11-17 Obducat Ab Procede d'impression de lithographies a une temperature constante
WO2006090682A1 (fr) * 2005-02-25 2006-08-31 Sumitomo Electric Industries, Ltd. Procede et systeme d’usinage de microstructure
KR100761212B1 (ko) * 2006-06-09 2007-09-21 한국기계연구원 열판 및 상기 열판을 적용한 고온 엠보싱 나노 임프린트리소그래피 장치
KR20080048343A (ko) * 2006-11-28 2008-06-02 주식회사 탑 엔지니어링 패턴 프레임 가열 장치

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Publication number Publication date
CN101889241A (zh) 2010-11-17
CN101889241B (zh) 2012-03-21

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