WO2009078137A1 - 表面波装置及びその製造方法 - Google Patents

表面波装置及びその製造方法 Download PDF

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Publication number
WO2009078137A1
WO2009078137A1 PCT/JP2008/003640 JP2008003640W WO2009078137A1 WO 2009078137 A1 WO2009078137 A1 WO 2009078137A1 JP 2008003640 W JP2008003640 W JP 2008003640W WO 2009078137 A1 WO2009078137 A1 WO 2009078137A1
Authority
WO
WIPO (PCT)
Prior art keywords
wave device
surface wave
outer circumference
support layer
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003640
Other languages
English (en)
French (fr)
Inventor
Norihiko Takada
Hayami Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2009546133A priority Critical patent/JP5110090B2/ja
Priority to KR1020107012773A priority patent/KR101166637B1/ko
Priority to EP08861476.3A priority patent/EP2230764B1/en
Priority to CN200880116839.4A priority patent/CN101868917B/zh
Publication of WO2009078137A1 publication Critical patent/WO2009078137A1/ja
Priority to US12/813,550 priority patent/US7944125B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

　ダイシングブレードの磨耗が生じ難く、ダイシング速度が低下し難く、個々の表面波装置をマザーの積層体から高精度にかつ高い生産性で得ることができる表面波装置を提供する。 　圧電ウェハー１０をダイシングにより切断することにより得られる表面波装置であって、圧電ウェハー１０をダイシングすることにより得られる圧電基板１０Ａと、圧電基板１０Ａの上面に形成されたＩＤＴ電極１～３及びパッド電極４～７とを有し、ＩＤＴ電極１～３が臨む開口を有するように支持層１１が形成されており、支持層１１の外周縁１１ｂが圧電基板１０Ａの上面の外周縁よりも内側に配置されており、さらに、上記支持層１１の開口部を閉成するように支持層１１上に絶縁性材料からなるカバー１４が形成されており、平面視した場合に、外周縁がカバー１４の圧電基板１０Ａの外周縁と重なっている、表面波装置。
PCT/JP2008/003640 2007-12-14 2008-12-08 表面波装置及びその製造方法 Ceased WO2009078137A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009546133A JP5110090B2 (ja) 2007-12-14 2008-12-08 表面波装置及びその製造方法
KR1020107012773A KR101166637B1 (ko) 2007-12-14 2008-12-08 표면파 장치 및 그 제조방법
EP08861476.3A EP2230764B1 (en) 2007-12-14 2008-12-08 Surface wave device and method of manufacturing the same
CN200880116839.4A CN101868917B (zh) 2007-12-14 2008-12-08 表面波装置及其制造方法
US12/813,550 US7944125B2 (en) 2007-12-14 2010-06-11 Surface acoustic wave device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-323641 2007-12-14
JP2007323641 2007-12-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/813,550 Continuation US7944125B2 (en) 2007-12-14 2010-06-11 Surface acoustic wave device

Publications (1)

Publication Number Publication Date
WO2009078137A1 true WO2009078137A1 (ja) 2009-06-25

Family

ID=40795260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003640 Ceased WO2009078137A1 (ja) 2007-12-14 2008-12-08 表面波装置及びその製造方法

Country Status (6)

Country Link
US (1) US7944125B2 (ja)
EP (1) EP2230764B1 (ja)
JP (1) JP5110090B2 (ja)
KR (1) KR101166637B1 (ja)
CN (1) CN101868917B (ja)
WO (1) WO2009078137A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101867013A (zh) * 2010-05-31 2010-10-20 中南大学 叉指状电极
JP2011077601A (ja) * 2009-09-29 2011-04-14 Kyocera Corp 弾性波装置及び弾性波装置の製造方法
WO2015025618A1 (ja) * 2013-08-20 2015-02-26 株式会社 村田製作所 弾性表面波デバイス及びその製造方法
JP2015046870A (ja) * 2013-07-31 2015-03-12 株式会社村田製作所 弾性波装置の製造方法
JP6044643B2 (ja) * 2012-12-05 2016-12-14 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
JPWO2018116717A1 (ja) * 2016-12-21 2019-07-25 株式会社村田製作所 弾性波装置の製造方法、弾性波装置、高周波フロントエンド回路、及び通信装置
US10637432B2 (en) 2015-06-25 2020-04-28 Murata Manufacturing Co., Ltd. Elastic wave device
US10637431B2 (en) 2014-04-14 2020-04-28 Murata Manufacturing Co., Ltd. Electronic component and manufacturing method therefor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057699A1 (ja) * 2007-10-30 2009-05-07 Kyocera Corporation 弾性波装置
US8508100B2 (en) * 2008-11-04 2013-08-13 Samsung Electronics Co., Ltd. Surface acoustic wave element, surface acoustic wave device and methods for manufacturing the same
JP2012217136A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイスの製造方法、およびこの方法で製造した圧電デバイス
JP6092535B2 (ja) * 2012-07-04 2017-03-08 太陽誘電株式会社 ラム波デバイスおよびその製造方法
US10498006B2 (en) * 2015-09-10 2019-12-03 Cpg Technologies, Llc Guided surface wave transmissions that illuminate defined regions
JP7002782B1 (ja) * 2020-09-21 2022-01-20 三安ジャパンテクノロジー株式会社 弾性表面波デバイス
CN115625958B (zh) * 2022-11-10 2024-06-14 广东生益科技股份有限公司 一种空腔滤波器用复合膜及空腔滤波器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823259A (ja) * 1994-07-08 1996-01-23 Kokusai Electric Co Ltd 弾性表面波装置とその製造方法
JPH09275324A (ja) * 1996-04-05 1997-10-21 Shimadzu Corp 弾性表面波素子の製造方法
JP2001053178A (ja) * 1999-06-02 2001-02-23 Japan Radio Co Ltd 電子回路装置が封止され回路基板に実装される電子部品及びその製造方法
JP2003037471A (ja) 2001-07-23 2003-02-07 Matsushita Electric Ind Co Ltd 弾性表面波装置およびその製造方法、これを用いた複合モジュール
JP2007005948A (ja) * 2005-06-22 2007-01-11 Alps Electric Co Ltd 電子部品及びその製造方法
JP2008135998A (ja) * 2006-11-28 2008-06-12 Fujitsu Media Device Kk 弾性波デバイスおよびその製造方法

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Publication number Priority date Publication date Assignee Title
JP3677409B2 (ja) * 1999-03-05 2005-08-03 京セラ株式会社 弾性表面波装置及びその製造方法
US6710682B2 (en) * 2000-10-04 2004-03-23 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, method for producing the same, and circuit module using the same
JP2003302525A (ja) 2002-04-10 2003-10-24 Ricoh Co Ltd 偏光分離素子およびその製造方法
JP2004186255A (ja) 2002-11-29 2004-07-02 Fujikura Ltd 薄膜構造体形成基板のダイシング方法
JP2004248243A (ja) * 2002-12-19 2004-09-02 Murata Mfg Co Ltd 電子部品およびその製造方法
JP2004336503A (ja) * 2003-05-09 2004-11-25 Fujitsu Media Device Kk 弾性表面波素子及びその製造方法
JP2005073180A (ja) 2003-08-27 2005-03-17 Kyocera Corp 弾性表面波素子の製造方法
JP4210958B2 (ja) * 2004-07-14 2009-01-21 株式会社村田製作所 圧電デバイス
EP1892831B1 (en) * 2005-06-16 2012-08-29 Murata Manufacturing Co., Ltd. Piezoelectric device and manufacturing method thereof
JP2006352617A (ja) * 2005-06-17 2006-12-28 Alps Electric Co Ltd 電子部品の製造方法
JP4670872B2 (ja) * 2006-01-18 2011-04-13 株式会社村田製作所 弾性表面波装置
EP2159916B1 (en) * 2007-02-28 2018-07-11 Murata Manufacturing Co. Ltd. Branching filter and its manufacturing method
JP4460612B2 (ja) * 2008-02-08 2010-05-12 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823259A (ja) * 1994-07-08 1996-01-23 Kokusai Electric Co Ltd 弾性表面波装置とその製造方法
JPH09275324A (ja) * 1996-04-05 1997-10-21 Shimadzu Corp 弾性表面波素子の製造方法
JP2001053178A (ja) * 1999-06-02 2001-02-23 Japan Radio Co Ltd 電子回路装置が封止され回路基板に実装される電子部品及びその製造方法
JP2003037471A (ja) 2001-07-23 2003-02-07 Matsushita Electric Ind Co Ltd 弾性表面波装置およびその製造方法、これを用いた複合モジュール
JP2007005948A (ja) * 2005-06-22 2007-01-11 Alps Electric Co Ltd 電子部品及びその製造方法
JP2008135998A (ja) * 2006-11-28 2008-06-12 Fujitsu Media Device Kk 弾性波デバイスおよびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2230764A4

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077601A (ja) * 2009-09-29 2011-04-14 Kyocera Corp 弾性波装置及び弾性波装置の製造方法
CN101867013A (zh) * 2010-05-31 2010-10-20 中南大学 叉指状电极
JP6044643B2 (ja) * 2012-12-05 2016-12-14 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
US10320355B2 (en) 2012-12-05 2019-06-11 Murata Manufacturing Co., Ltd. Method of manufacturing elastic wave device
JP2015046870A (ja) * 2013-07-31 2015-03-12 株式会社村田製作所 弾性波装置の製造方法
WO2015025618A1 (ja) * 2013-08-20 2015-02-26 株式会社 村田製作所 弾性表面波デバイス及びその製造方法
US10374142B2 (en) 2013-08-20 2019-08-06 Murata Manufacturing Co., Ltd. Surface acoustic wave device and manufacturing method therefor
US10637431B2 (en) 2014-04-14 2020-04-28 Murata Manufacturing Co., Ltd. Electronic component and manufacturing method therefor
US10637432B2 (en) 2015-06-25 2020-04-28 Murata Manufacturing Co., Ltd. Elastic wave device
JPWO2018116717A1 (ja) * 2016-12-21 2019-07-25 株式会社村田製作所 弾性波装置の製造方法、弾性波装置、高周波フロントエンド回路、及び通信装置
US11588460B2 (en) 2016-12-21 2023-02-21 Murata Manufacturing Co., Ltd. Elastic wave device manufacturing method, elastic wave device, radio-frequency front-end circuit, and communication device

Also Published As

Publication number Publication date
EP2230764A1 (en) 2010-09-22
CN101868917A (zh) 2010-10-20
EP2230764B1 (en) 2016-11-02
JPWO2009078137A1 (ja) 2011-04-28
JP5110090B2 (ja) 2012-12-26
CN101868917B (zh) 2014-02-19
EP2230764A4 (en) 2014-04-02
KR101166637B1 (ko) 2012-07-18
KR20100089875A (ko) 2010-08-12
US7944125B2 (en) 2011-05-17
US20100253182A1 (en) 2010-10-07

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