WO2009078441A1 - 室温硬化性ポリオルガノシロキサン組成物 - Google Patents

室温硬化性ポリオルガノシロキサン組成物 Download PDF

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Publication number
WO2009078441A1
WO2009078441A1 PCT/JP2008/072996 JP2008072996W WO2009078441A1 WO 2009078441 A1 WO2009078441 A1 WO 2009078441A1 JP 2008072996 W JP2008072996 W JP 2008072996W WO 2009078441 A1 WO2009078441 A1 WO 2009078441A1
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Prior art keywords
mass
parts
substituted
silane compound
hydrocarbon group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2008/072996
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English (en)
French (fr)
Inventor
Isao Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Momentive Performance Materials Inc
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Momentive Performance Materials Japan LLC
Momentive Performance Materials Inc
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Application filed by Momentive Performance Materials Japan LLC, Momentive Performance Materials Inc filed Critical Momentive Performance Materials Japan LLC
Priority to JP2009546285A priority Critical patent/JP5545717B2/ja
Priority to KR1020107013403A priority patent/KR101357530B1/ko
Priority to CN200880127075.9A priority patent/CN101945951B/zh
Priority to EP08862734.4A priority patent/EP2223968B1/en
Priority to US12/808,557 priority patent/US8362129B2/en
Publication of WO2009078441A1 publication Critical patent/WO2009078441A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C08K5/57—Organo-tin compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

 室温硬化性ポリオルガノシロキサン組成物は、粘度(23°C)0.02~1000Pa・sの両末端水酸基封鎖ポリオルガノシロキサン100質量部、難燃性付与充填剤1~200質量部、R1aSi(OR2)4-a(式中、R1、R2は同一/異種の置換/非置換の1価炭化水素基、aは平均値で0≦a≦0.2の数)で示されるシラン化合物の部分加水分解縮合物0.1~10質量部、R32Si(OR4)2(式中、R3、R4は同一/異種の置換/非置換の1価炭化水素基)で示されるシラン化合物またはその部分加水分解縮合物(1分子中のSi数3以下)0.1~10質量部、(R5O)3Si-R6-NH-R7(式中、R5は同一/異種の置換/非置換の1価炭化水素基、R6は置換/非置換の2価有機基、R7は水素原子、置換/非置換の1価炭化水素基またはアミノアルキル基)で示されるアミン官能シラン化合物0.1~10質量部、硬化触媒0.001~10質量部および白金化合物(Ptとして)1~1000ppmを含有する。
PCT/JP2008/072996 2007-12-19 2008-12-17 室温硬化性ポリオルガノシロキサン組成物 Ceased WO2009078441A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009546285A JP5545717B2 (ja) 2007-12-19 2008-12-17 室温硬化性ポリオルガノシロキサン組成物
KR1020107013403A KR101357530B1 (ko) 2007-12-19 2008-12-17 실온 경화성 폴리오르가노실록산 조성물
CN200880127075.9A CN101945951B (zh) 2007-12-19 2008-12-17 室温固化性聚有机硅氧烷组合物
EP08862734.4A EP2223968B1 (en) 2007-12-19 2008-12-17 Room-temperature-curable polyorganosiloxane composition
US12/808,557 US8362129B2 (en) 2007-12-19 2008-12-17 Room-temperature-curable polyorganosiloxane composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007327487 2007-12-19
JP2007-327487 2007-12-19

Publications (1)

Publication Number Publication Date
WO2009078441A1 true WO2009078441A1 (ja) 2009-06-25

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ID=40795554

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PCT/JP2008/072996 Ceased WO2009078441A1 (ja) 2007-12-19 2008-12-17 室温硬化性ポリオルガノシロキサン組成物

Country Status (7)

Country Link
US (1) US8362129B2 (ja)
EP (1) EP2223968B1 (ja)
JP (1) JP5545717B2 (ja)
KR (1) KR101357530B1 (ja)
CN (1) CN101945951B (ja)
TW (1) TWI454532B (ja)
WO (1) WO2009078441A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009292914A (ja) * 2008-06-04 2009-12-17 Momentive Performance Materials Inc 室温硬化性シリコーンゴム組成物
JP2013203989A (ja) * 2012-03-29 2013-10-07 Nippon Tungsten Co Ltd オルガノポリシロキサン混合体組成物、フィラー含有オルガノポリシロキサン、コーティング塗料及びコーティング体
JP2020094081A (ja) * 2018-12-10 2020-06-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物、その硬化物および積層体
JP2023038707A (ja) * 2021-09-07 2023-03-17 信越化学工業株式会社 室温硬化性樹脂組成物、コーティング剤、接着剤及びシーリング剤、並びに物品

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5265813B2 (ja) * 2011-05-13 2013-08-14 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
CN104781346A (zh) * 2012-11-13 2015-07-15 迈图高新材料日本合同公司 室温固化性聚有机硅氧烷组合物
RU2635604C2 (ru) * 2013-06-27 2017-11-14 Блюстар Силикон Франс Сас Вулканизуемые в горячем состоянии полиорганосилоксановые композиции, используемые для изготовления электрических проводов или кабелей
KR102276889B1 (ko) * 2013-12-24 2021-07-12 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실온 경화성 폴리오르가노실록산 조성물 및 전기·전자기기
KR102919168B1 (ko) * 2019-04-17 2026-01-29 한국신에츠실리콘(주) 실온 경화성 오가노폴리실록산 조성물 및 그 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105235A (ja) 2003-10-02 2005-04-21 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2005162974A (ja) * 2003-12-05 2005-06-23 Ge Toshiba Silicones Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2006160939A (ja) * 2004-12-09 2006-06-22 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006182935A (ja) * 2004-12-28 2006-07-13 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006213780A (ja) * 2005-02-02 2006-08-17 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2007119768A (ja) * 2005-09-30 2007-05-17 Dow Corning Toray Co Ltd 多成分型室温硬化性シリコーンゴム組成物
JP2007284687A (ja) * 2007-06-08 2007-11-01 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物及び該組成物を接着剤として用いた部品
JP2008274189A (ja) * 2007-05-07 2008-11-13 Momentive Performance Materials Japan Kk 室温硬化性ポリオルガノシロキサン組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JPS63199253A (ja) * 1987-02-13 1988-08-17 Shin Etsu Chem Co Ltd ゴム組成物
JP3108432B2 (ja) 1990-10-30 2000-11-13 東レ・ダウコーニング・シリコーン株式会社 室温硬化性オルガノポリシロキサン組成物
JP3110749B2 (ja) 1990-11-28 2000-11-20 東レ・ダウコーニング・シリコーン株式会社 室温硬化性オルガノポリシロキサン組成物
US5300611A (en) * 1991-10-21 1994-04-05 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane compositions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105235A (ja) 2003-10-02 2005-04-21 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2005162974A (ja) * 2003-12-05 2005-06-23 Ge Toshiba Silicones Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2006160939A (ja) * 2004-12-09 2006-06-22 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006182935A (ja) * 2004-12-28 2006-07-13 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006213780A (ja) * 2005-02-02 2006-08-17 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2007119768A (ja) * 2005-09-30 2007-05-17 Dow Corning Toray Co Ltd 多成分型室温硬化性シリコーンゴム組成物
JP2008274189A (ja) * 2007-05-07 2008-11-13 Momentive Performance Materials Japan Kk 室温硬化性ポリオルガノシロキサン組成物
JP2007284687A (ja) * 2007-06-08 2007-11-01 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物及び該組成物を接着剤として用いた部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2223968A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009292914A (ja) * 2008-06-04 2009-12-17 Momentive Performance Materials Inc 室温硬化性シリコーンゴム組成物
JP2013203989A (ja) * 2012-03-29 2013-10-07 Nippon Tungsten Co Ltd オルガノポリシロキサン混合体組成物、フィラー含有オルガノポリシロキサン、コーティング塗料及びコーティング体
JP2020094081A (ja) * 2018-12-10 2020-06-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物、その硬化物および積層体
JP7372033B2 (ja) 2018-12-10 2023-10-31 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物、その硬化物および積層体
JP2023038707A (ja) * 2021-09-07 2023-03-17 信越化学工業株式会社 室温硬化性樹脂組成物、コーティング剤、接着剤及びシーリング剤、並びに物品
JP7577422B2 (ja) 2021-09-07 2024-11-05 信越化学工業株式会社 室温硬化性樹脂組成物、コーティング剤、接着剤及びシーリング剤、並びに物品

Also Published As

Publication number Publication date
JPWO2009078441A1 (ja) 2011-04-28
CN101945951A (zh) 2011-01-12
CN101945951B (zh) 2015-07-29
EP2223968A1 (en) 2010-09-01
TW200948902A (en) 2009-12-01
KR101357530B1 (ko) 2014-01-29
EP2223968A4 (en) 2012-07-25
TWI454532B (zh) 2014-10-01
US20110124788A1 (en) 2011-05-26
JP5545717B2 (ja) 2014-07-09
KR20100108525A (ko) 2010-10-07
US8362129B2 (en) 2013-01-29
EP2223968B1 (en) 2013-07-31

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