WO2009079122A1 - Procédé de revêtement de fils fins et composition durcissable à cet effet - Google Patents

Procédé de revêtement de fils fins et composition durcissable à cet effet Download PDF

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Publication number
WO2009079122A1
WO2009079122A1 PCT/US2008/083323 US2008083323W WO2009079122A1 WO 2009079122 A1 WO2009079122 A1 WO 2009079122A1 US 2008083323 W US2008083323 W US 2008083323W WO 2009079122 A1 WO2009079122 A1 WO 2009079122A1
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WIPO (PCT)
Prior art keywords
curable composition
free
monomer
meth
acrylate
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Ceased
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PCT/US2008/083323
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English (en)
Inventor
Michael A. Kropp
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3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2010539557A priority Critical patent/JP2011508966A/ja
Priority to EP08862170A priority patent/EP2235749A1/fr
Priority to CN2008801214585A priority patent/CN101903999A/zh
Publication of WO2009079122A1 publication Critical patent/WO2009079122A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Definitions

  • Wire bonding is a low cost and flexible method for interconnection of semiconductors.
  • a semiconductor die is electrically connected to circuitry on a substrate by fine electrically conductive wires. More wires in a package and smaller wire gaps are the trend in the integrated circuit packaging industry.
  • thermosetting resin such as, for example, an epoxy resin.
  • Common techniques include glob-top and dam and fill. In glob-top encapsulation, a volume of encapsulant is deposited on top of a component. The material flows downward, covering the component.
  • wire density is becoming increasingly apparent, especially on the flow pattern of the encapsulant during encapsulation processes and, hence, on the amount of wire sweep (that is, physical movement of the wires).
  • wire sweep A major factor limiting wire density of this widely used interconnect technology is wire sweep, which can lead to shorting during the encapsulation processes.
  • the present disclosure provides a method of protecting wires during packaging of a semiconductor device, the method comprising: providing a curable composition comprising at least one epoxy monomer, at least one free-radically polymerizable monomer, an effective amount of photoinitiator for the free-radically polymerizable monomer, an effective amount of thermal curative for the at least one epoxy monomer, wherein the curable composition is electrically non-conductive and essentially free of solvent; providing a chip assembly comprising a substrate having a semiconductor die attached thereto, the semiconductor die being electrically connected to the substrate by a plurality of conductive wires; spraying the curable composition onto at least the plurality of conductive wires; free-radically polymerizing at least a portion of the at least one free-radically polymerizable monomer to convert the curable composition into a B-staged curable composition; and thermally curing at least a portion of the at least one epoxy monomer.
  • the method further comprises encapsulating the semiconductor die.
  • the curable composition is essentially free of particulates.
  • the curable composition further comprises a flow additive (for example, an acrylic polymer).
  • the at least one epoxy monomer comprises a monoepoxide and a polyepoxide.
  • the at least one free-radically curable monomer comprises at least one (meth)acrylate monomer and at least one N-vinyllactam.
  • the at least one (meth)acrylate monomer may comprise a poly(meth)acrylate monomer and a mono(meth)acrylate monomer.
  • the present disclosure provides a curable composition
  • a curable composition comprising at least one epoxy monomer, at least one free-radically polymerizable
  • (meth)acrylate at least one free-radically polymerizable N-vinyllactam
  • a flow additive comprising an acrylic polymer, an effective amount of photoinitiator, an effective amount of thermal curative for the at least one epoxy monomer, wherein the curable composition has a viscosity of less than 1000 millipascal-seconds, is essentially free of particulates, and is essentially free of solvent.
  • a curable composition according to the present disclosure contains little or no solvent and is sprayable. Once sprayed, the curable composition can be B-staged to prevent flow and provide protective insulation and increased stiffness for the wires that reduce or eliminate shorting caused by wire sweep. And, if desired, the epoxy monomer(s) in the B-staged curable composition may be co-polymerized with an epoxy encapsulant, thereby fixing the wires in the encapsulant.
  • Curable compositions suitable for use with the present disclosure comprise at least one epoxy monomer, an effective amount of thermal curative for the epoxy monomer(s), at least one free-radically polymerizable monomer, and an effective amount of photoinitiator for the free-radically polymerizable monomer.
  • Useful epoxy monomers include, for example, alicyclic and aromatic monoepoxides and polyepoxides, and combinations thereof.
  • Examples of useful monoepoxides include styrene oxide, allyl glycidyl ether, and glycidyl ethers of cardanol (for example, as "CARDOLITE 2513HP" from Cardolite Corp., Newark, NJ)
  • alicyclic polyepoxides examples include monomeric alicyclic polyepoxides, oligomeric alicyclic polyepoxides, and polymeric alicyclic polyepoxides.
  • exemplary alicyclic polyepoxides monomers useful in practice of the present invention include epoxycyclohexanecarboxylates such as, for example, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (for example, as "ERL-4221" from Dow Chemical Co.,
  • aromatic polyepoxides include, for example, monomeric aromatic polyepoxides, oligomeric aromatic polyepoxides, and polymeric aromatic polyepoxides.
  • Exemplary aromatic polyepoxides include the polyglycidyl ethers of polyhydric phenols such as bisphenol A-type resins and their derivatives; epoxy cresol-novolac resins; Bisphenol-F resins and their derivatives; epoxy phenol-novolac resins; and glycidyl esters of aromatic carboxylic acids (for example, phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, trimellitic acid triglycidyl ester, and pyromellitic acid tetraglycidyl ester), and mixtures thereof.
  • aromatic polyepoxides include, for example, those aromatic polyepoxides having the trade designation "EPON” (for example, “EPON 828”, “EPON 862”, “EPON 1001F, "EPON DPL-862” and “EPON HPT-1079"), available, for example, from Hexion Specialty Chemicals; and aromatic polyepoxides having the trade designations "DER”, "DEN” (for example, “DEN 438”, and DEN 439"), and "QUATREX", available, for example, from Dow Chemical Co.
  • EPON aromatic polyepoxides having the trade designation "EPON” (for example, "EPON 828”, “EPON 862”, “EPON 1001F, "EPON DPL-862” and "EPON HPT-1079)
  • DER aromatic polyepoxides having the trade designations "DER”, "DEN” (for example, "DEN 438”, and DEN 439"), and "QUATREX”, available, for example, from Dow Chemical Co.
  • the at least one epoxy monomer is typically present in an amount of from 20 to 50 percent by weight, more typically in an amount of from 30 to 50 percent by weight, and still more typically in an amount of from 35 to 45 percent by weight, based on the total weight of the curable composition, although this is not a requirement.
  • an effective amount of thermal curative for the at least one epoxy monomer is included in the curable composition such that it can be sufficiently cured to develop a C- stage.
  • the term "effective amount of thermal curative" refers to at least a minimum quantity. The precise amount will necessarily vary due to formulation and curing variables, but it is typically 10 percent by weight or less based on the total weight of the curable composition.
  • Useful thermal curatives for the polyepoxide(s) include acid curatives and base curatives.
  • useful curing agents include boron trifluoride complexes such as, for example, BF3 Et2 ⁇ and BF3 H2NC2H4OH; polyamines such as, for example, bis(4- aminophenyl)sulfone, bis(4-aminophenyl)ether, and 2,2-bis(4-aminophenyl)propane; aliphatic and aromatic tertiary amines such as, for example, dimethylaminopropylamine; fluorenediamines; and modified amine curing agents such as those commercially available from Air Products and Chemicals, Allentown , PA, under the trade designation "ANCAMINE " (for example, "ANCAMINE 2337S", "ANCAMINE 2014”, and
  • ANCAMINE 2441 and from Ajinimoto, Japan, "AJICURE” (for example, “AJICURE PN23” and “AJICURE M353”); imidazoles such as, for example, methylimidazole and 2,4-diamino-6-(2'-methylimidazolyl-( 1 '))-ethyl-s-triazine hexakis(imidazole)nickel phthalate); hydrazines such as, for example, adipohydrazine; guanidines, such as, for example, tetramethylguanidine and dicyandiamide (cyanoguanidine, also commonly known as DiCy); and combinations thereof.
  • imidazoles such as, for example, methylimidazole and 2,4-diamino-6-(2'-methylimidazolyl-( 1 '))-ethyl-s-triazine hexakis(imidazole)nickel
  • free-radically polymerizable monomers examples include mono(meth)acrylate monomers, poly(meth)acrylate monomers (that is, having a plurality of acryl groups), styrene, butadiene, maleimides, maleic anhydride, and N-vinylamides (including N- vinyllactams).
  • (meth)acryl encompasses both methacryl and/or acryl.
  • a poly(meth)acrylate monomer may have only acrylate groups, only methacrylate groups, or a combination of acrylate and methacrylate groups.
  • Useful free-radically polymerizable mono(meth)acrylates include, for example, phenoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and (meth)acrylic esters of non-tertiary alcohols having from about 4 to about 12 carbon atoms in the alcohol moiety, and combinations thereof. Included in this latter class of (meth)acrylic esters are butyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, decyl (meth)acrylate, and dodecyl (meth)acrylate.
  • Useful free-radically polymerizable poly(meth)acrylate monomers include, for example, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, 1,2- ethylene glycol di(meth)acrylate, pentaerythritol tetra(meth)acrylate, and urethane and epoxy di(meth)acrylate oligomers available under the trade designation "EBECRYL” (for example, "EBECRYL 230", “EBECRYL 3605", and "EBECRYL 8804") from UCB Radcure, Smyrna, Ga., and "CN” (for example, "CN 104”) from Sartomer Co., Exton, PA, and combinations thereof.
  • EBECRYL for example, "EBECRYL 230", “EBECRYL 3605", and "EBECRYL 8804" from UCB Radcure, Smyrna, Ga.
  • CN for example
  • N-vinylamides examples include N-vinylpyrrolidone, N-vinylcapro lactam, and N- viny lformamide .
  • a combination of one or more free-radically polymerizable monomer(s) is used.
  • the at least one free-radically polymerizable monomer is typically present in an amount of from 30 to 70 percent by weight, more typically in an amount of from 40 to 65 percent by weight, and still more typically in an amount of from 50 to 60 percent by weight, based on the total weight of the curable composition, although this is not a requirement.
  • an effective amount of photoinitiator for the at least one free-radically curable monomer is included in the curable composition such that it can be sufficiently cured to B- stage (that is, sufficiently cured that it will soften but not melt if heated) the curable composition upon photopolymerization.
  • the term "effective amount of photoinitiator” refers to at least a minimum quantity. The precise amount will necessarily vary due to formulation and curing variables, but it is typically 10 percent by weight or less based on the total weight of the curable composition.
  • lower molecular weight photoinitiators are used in total amounts of about 0.001 to about 4 percent by weight based on the total weight of the curable composition, while higher molecular weight photoinitiators are used in total amounts of about 0.1 percent to about 8 percent by weight based on the total weight of the curable composition.
  • Useful photoinitiators include, for example, substituted acetophenones such as 2,2-dimethoxy-2-phenylacetophenone; benzoin ethers such as benzoin methyl ether and substituted benzoin ethers such as anisoin methyl ether; substituted alpha-ketols such as 2- methyl-2-hydroxypropiophenone; benzophenone and its derivatives; phosphine oxides; polymeric photoinitiators; and combinations thereof.
  • substituted acetophenones such as 2,2-dimethoxy-2-phenylacetophenone
  • benzoin ethers such as benzoin methyl ether and substituted benzoin ethers such as anisoin methyl ether
  • substituted alpha-ketols such as 2- methyl-2-hydroxypropiophenone
  • benzophenone and its derivatives phosphine oxides
  • polymeric photoinitiators and combinations thereof.
  • photoinitiators are commercially available from sources such as, for example, Ciba Specialty Chemicals, Tarrytown, NY, under the trade designation "IRGACURE” (for example, “IRGACURE 184", “IRGACURE 651”, “IRGACURE 369", and “IRGACURE 907") and "DAROCUR” (for example, “DAROCUR 1173”, “DAROCUR MBF”, “DAROCUR TPO”, and “DAROCUR 4265”), and under the trade designation "ESCACURE” from Sartomer Co.,
  • curable compositions are electrically nonconductive.
  • the curable compositions may further contain minor amounts of one or more additive(s) such as, for example, surfactant(s), flow additive(s), dye(s), pigment(s), inhibitor(s), and /or coupling agent(s).
  • additive(s) such as, for example, surfactant(s), flow additive(s), dye(s), pigment(s), inhibitor(s), and /or coupling agent(s).
  • any optional flow additive may be included in the curable composition, for example, to facilitate even coating of the wires.
  • any such flow additive will be in an amount of less than 3 percent, more typically in an amount of less than 1 percent based on the total weight of the curable composition.
  • One exemplary useful flow additive is an acrylic polymer in solution available as "TEGO ZFS 460" from Tego Chemie Service GmbH, Essen, Germany.
  • the curable compositions are formulated as essentially solvent- free, or even totally free of solvent.
  • essentially solvent-free means containing less than about one percent by total weight of solvent based on the total weight of the curable composition.
  • solvent refers collectively to any volatile organic compound(s) (not reactive with other components that are present) added for the purpose of solvating at least some of the remaining components of a composition. Examples include toluene, heptane, ethyl acetate, methyl ethyl ketone, acetone, and mixtures thereof.
  • the curable composition is typically prepared from its constituent parts using a conventional mixing technique, for example, gentle rolling, roller milling, or ball milling.
  • a conventional mixing technique for example, gentle rolling, roller milling, or ball milling.
  • the curable composition is typically essentially free of (that is, containing less than one percent by weight of the total weight of the curable composition), or even completely free of particulates, however this is not a requirement. Further, the viscosity of the curable composition is typically less than 1000 centipoise (1000 millipascal-seconds), more typically less than 500 millipascal seconds, although this is not a requirement.
  • the chip assembly has a substrate with a semiconductor die attached thereto.
  • the semiconductor die is typically electrically connected to the contact pads on the substrate by a plurality of conductive wires (typically gold wires, although other conductive metals and alloys may also be used). Examples of such assemblies are well known in the integrated circuit packaging art and are discussed, for example, in U. S. Pat. No. 6,750,533 B2 (Yu-Po et al.) in col. 1, line 12 to col. 2, line 34.
  • a curable composition is applied to the conductive wires, and optionally onto the at least a portion of the substrate and /or semiconductor die by spraying. Examples of useful spraying techniques include, spray jet and air brush spraying.
  • the curable composition is then exposed to actinic radiation (for example, ultraviolet and/or visible light) that decomposes at least a portion of the photoinitiator and causes free-radical polymerization of the at least one free- radically polymerizable monomer sufficient to result in a B-staged (that is, sufficiently cured that it will soften but not melt if heated) curable composition.
  • actinic radiation for example, ultraviolet and/or visible light
  • Sources of actinic (for example, ultraviolet (UV)) radiation include, for example, low, medium, or high pressure mercury lamps, lasers, and xenon flash lamps.
  • the B-staged curable composition may be heated (for example, in an oven) under conditions (for example, time and temperature) to sufficiently cure the epoxy monomer(s) to achieve a C-stage cure (wherein the curable material has become relatively insoluble and infusible).
  • an encapsulant for example, an epoxy resin glob top
  • an epoxy resin glob top may be applied to the chip assembly to encapsulate the semiconductor die and conductive wires.
  • the encapsulant may be applied to the chip assembly while the curable composition remains in the B-stage and then the combination is heated to achieve a C-stage cure.
  • the curable composition will typically chemically bond to an epoxy encapsulant thereby reducing the likelihood of subsequent delamination (for example, due to thermal cycling).
  • Composition A was prepared by combining: 42.5 parts of an epoxy monomer (a polymer of dicyclopentadiene concentrate, phenol and epichlorohydrin, "TACTIX 756" from Huntsman Advanced Materials Americas, Brewster, NY); 44.2 parts of phenoxy ethyl acrylate ("AGEFLEX PEA” from Ciba Specialty Chemicals, Tarrytown, NY); 10.8 parts of N-vinylcaprolactam; 1.2 parts of l-cyanoethyl-2-ethyl-4-methylimidazole (“MEZCN” from Shikoku Chemicals Corp., Kagawa, Japan); 0.9 parts of photoinitiator (CAS No.
  • an epoxy monomer a polymer of dicyclopentadiene concentrate, phenol and epichlorohydrin, "TACTIX 756” from Huntsman Advanced Materials Americas, Brewster, NY
  • phenoxy ethyl acrylate (“AGEFLEX PEA” from Ciba Special
  • a first portion of Composition A was sprayed using a sprayer ( "PREVAL SPRAYER” from Precision Valve Corp., Yonkers, NY) onto a first gold-plated metal coupon.
  • a second portion of Composition A was sprayed as done with the first portion onto a second gold-plated metal coupon and irradiated using an "H-type” microwave powered electrodeless lamp, Model F300S, available from Fusion UV Systems, Gaithersburg, MD, operated at a conveyor speed of 20 ft/min (6.1 m/min) to B-stage the composition.
  • the ultraviolet light dosage was measured using an energy meter ("UV POWER PUCK" from
  • Composition A wetted out on the gold-plated metal coupon providing a smooth continuous coating.
  • Composition A was prepared by combining: 38.9 parts of an epoxy monomer (a polymer of dicyclopentadiene concentrate, phenol and epichlorohydrin, "TACTIX 756" from Huntsman Advanced Materials Americas); 4.3 parts of an epoxy monomer
  • a first portion of Composition B was sprayed using a sprayer ("PREVAL SPRAYER" from Precision Valve Corp.) onto a third gold-plated metal coupon.
  • a second portion of Composition B was sprayed as done with the first portion onto a fourth gold-plated metal coupon and irradiated as in Example 1.
  • composition B wetted out on the gold-plated metal coupon providing a smooth continuous coating.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé de réduction du déplacement et des courts-circuits de fils au cours de la fabrication d'un dispositif à semi-conducteur. Le procédé comprend la pulvérisation d'une composition durcissable sur les soudures de fils et le passage à l'état B par des radicaux libres de la composition durcissable puis le durcissement thermique à un état C. L'invention concerne également une composition durcissable pulvérisable.
PCT/US2008/083323 2007-12-18 2008-11-13 Procédé de revêtement de fils fins et composition durcissable à cet effet Ceased WO2009079122A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010539557A JP2011508966A (ja) 2007-12-18 2008-11-13 細径ワイヤのコーティング方法とそのための硬化可能な組成物
EP08862170A EP2235749A1 (fr) 2007-12-18 2008-11-13 Procédé de revêtement de fils fins et composition durcissable à cet effet
CN2008801214585A CN101903999A (zh) 2007-12-18 2008-11-13 涂覆细线材的方法及用于涂覆的可固化组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1448307P 2007-12-18 2007-12-18
US61/014,483 2007-12-18

Publications (1)

Publication Number Publication Date
WO2009079122A1 true WO2009079122A1 (fr) 2009-06-25

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PCT/US2008/083323 Ceased WO2009079122A1 (fr) 2007-12-18 2008-11-13 Procédé de revêtement de fils fins et composition durcissable à cet effet

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EP (1) EP2235749A1 (fr)
JP (1) JP2011508966A (fr)
KR (1) KR20100095014A (fr)
CN (1) CN101903999A (fr)
TW (1) TW200935529A (fr)
WO (1) WO2009079122A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3163610A1 (fr) * 2015-11-02 2017-05-03 MediaTek Inc. Boîtier de semi-conducteur avec fils de liaison revêtus
US10847488B2 (en) 2015-11-02 2020-11-24 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0245559A2 (fr) * 1985-11-26 1987-11-19 Loctite Corporation Composition de résines époxydes durcissable à deux composants ayant une longue durée de vie
US5565499A (en) * 1993-03-24 1996-10-15 Loctite Corporation Filament-winding compositions for fiber/resin composites
US20020120031A1 (en) * 2001-02-27 2002-08-29 Fu-Lung Chen Photothermosetting component
WO2005056675A1 (fr) * 2003-11-21 2005-06-23 Lord Corporation Agents d'encapsulation appliques a une plaquette a deux etages

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0245559A2 (fr) * 1985-11-26 1987-11-19 Loctite Corporation Composition de résines époxydes durcissable à deux composants ayant une longue durée de vie
US5565499A (en) * 1993-03-24 1996-10-15 Loctite Corporation Filament-winding compositions for fiber/resin composites
US20020120031A1 (en) * 2001-02-27 2002-08-29 Fu-Lung Chen Photothermosetting component
WO2005056675A1 (fr) * 2003-11-21 2005-06-23 Lord Corporation Agents d'encapsulation appliques a une plaquette a deux etages

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3163610A1 (fr) * 2015-11-02 2017-05-03 MediaTek Inc. Boîtier de semi-conducteur avec fils de liaison revêtus
US10037936B2 (en) 2015-11-02 2018-07-31 Mediatek Inc. Semiconductor package with coated bonding wires and fabrication method thereof
US10847488B2 (en) 2015-11-02 2020-11-24 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
US11257780B2 (en) 2015-11-02 2022-02-22 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires

Also Published As

Publication number Publication date
CN101903999A (zh) 2010-12-01
KR20100095014A (ko) 2010-08-27
EP2235749A1 (fr) 2010-10-06
JP2011508966A (ja) 2011-03-17
TW200935529A (en) 2009-08-16

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